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    • 72. 发明授权
    • Compact multiple diameters wafer handling system with on-chuck wafer calibration and integrated cassette-chuck transfer
    • 紧凑的多直径晶圆处理系统,带有卡盘晶圆校准和集成盒式卡盘传输
    • US07717661B1
    • 2010-05-18
    • US11420470
    • 2006-05-25
    • Marc T. AhoThaddeus J. Wilson
    • Marc T. AhoThaddeus J. Wilson
    • B65B21/02B65G65/04G01B11/00G01N21/86
    • H01L21/681G01N21/9501Y10S414/136Y10S414/137
    • A compact multiple diameter wafer testing device with a footprint of about 33 by 34 inches features on-chuck wafer calibration and integrated cassette-chuck transfer. It includes a five axes wafer handling system, a quick exchange chuck and a fixed through beam sensor fixed. Two of the five axes are provided by an X-Y stage, a third axis is provided by a rotary stage on top of the X-Y stage, a fourth axis belongs to a rotating effector and a fifth axis is provided by motion controlled pin lifters all combined with the X-Y stage. The quick exchange chuck may be easily changed for different wafer diameters and also calibrated by the through beam sensor. The through beam sensor provides on-chuck position calibration of the chucked wafers in conjunction with the X-Y stage and rotary stage. The compact wafer testing device handles wafers between six and twelve inches diameter.
    • 紧凑的多直径晶圆测试装置,占地面积约33×34英寸,具有卡盘晶片校准和集成盒式卡盘传输。 它包括五轴晶片处理系统,快速更换卡盘和固定通过光束传感器固定。 五个轴中的两个由XY台提供,第三轴由XY台顶部的旋转台提供,第四轴属于旋转执行器,第五轴由运动控制销升降器提供,全部结合 XY阶段。 对于不同的晶片直径,快速更换卡盘可能容易改变,并且还可以通过光束传感器进行校准。 通过光束传感器与X-Y平台和旋转台一起提供卡盘晶片的卡盘位置校准。 紧凑的晶片测试设备处理直径在六到十二英寸之间的晶圆。