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    • 76. 发明专利
    • Three-dimensional image measuring device and three-dimensional image measuring method
    • 三维图像测量装置和三维图像测量方法
    • JP2012043651A
    • 2012-03-01
    • JP2010184024
    • 2010-08-19
    • Fukuoka Pref Gov Sangyo Kagaku Gijutsu Shinko ZaidanFukuoka Univ学校法人福岡大学財団法人福岡県産業・科学技術振興財団
    • TOMOKAGE HAJIMESUEYOSHI HARUKI
    • H01J37/28G01B15/08G01N23/225
    • PROBLEM TO BE SOLVED: To provide a three-dimensional image measuring device capable of specifying flow portions and failure portions of a semiconductor device and a device system using a three-dimensional current image.SOLUTION: A three-dimensional image measuring device 100 comprises a scanning circuit 24 for outputting scanning signals to a scanning mirror 23, an optical axial direction moving mechanism 26 for changing a relative distance between a specimen 200 and a second objective lens 25 in an optical axial direction by moving the second objective lens 25 along the optical axis, an optical axial direction movement control circuit 27 for outputting control signals to the optical axial direction moving mechanism 26, a conductive probe 31 for outputting induced current flowing through the specimen 200, and an operation part 43 for constructing a two-dimensional current image of the specimen 200 based on the scanning signals from the scanning circuit 24 and a current value from the conductive probe 31, and constructing a three-dimensional image to which each of the two-dimension current images is overlaid at each relative distance changed by the optical axial direction moving mechanism 26.
    • 要解决的问题:提供一种能够指定半导体器件的流动部分和故障部分以及使用三维当前图像的器件系统的三维图像测量装置。 解决方案:三维图像测量装置100包括用于将扫描信号输出到扫描镜23的扫描电路24,用于改变样本200和第二物镜25之间的相对距离的光轴方向移动机构26 沿着光轴移动第二物镜25的光轴方向的光轴方向移动控制电路27,用于向光轴方向移动机构26输出控制信号的光轴方向移动控制电路27,用于输出流过试样的感应电流的导电探针31 200,以及用于根据来自扫描电路24的扫描信号和来自导电探针31的电流值构成样本200的二维电流图像的操作部43,并构成三维图像, 在由光轴向移动机构26改变的每个相对距离处重叠两维电流图像 PYRIGHT:(C)2012,JPO&INPIT
    • 77. 发明专利
    • Wiring board formation method, and wiring board
    • 接线板形成方法和接线板
    • JP2012009613A
    • 2012-01-12
    • JP2010144057
    • 2010-06-24
    • Fukuoka Pref Gov Sangyo Kagaku Gijutsu Shinko ZaidanFukuoka UnivNippon Steel Chem Co Ltd学校法人福岡大学新日鐵化学株式会社財団法人福岡県産業・科学技術振興財団
    • TOMOKAGE HAJIMEFUJISHIRO KOICHIITAHARA SHUNEISAITO TORUHAYASHI SHIGEHIRO
    • H01L23/12H01L23/14H05K3/10
    • PROBLEM TO BE SOLVED: To provide a wiring board formation method and the like capable of significantly reducing labor and cost for manufacturing a wiring board, by forming a decoupling capacitor at the same time a wiring pattern is formed.SOLUTION: The wiring board formation method includes steps of: forming cylindrical via insulation parts 3a and 3b and via conduction parts 4a and 4b on a silicon substrate 2; forming an induction part 5a by extending an insulation material which is laminated on a peripheral region of the via conduction part 4a to be connected to a tubular end part of the via insulation part 3a across the entire circumference; forming an insulation part 5b by extending the insulation material laminated in the peripheral region of the via conduction part 4b so that a portion does not come in contact with the tubular end part of the via insulation part 3b; and forming wiring parts 6a and 6b which are connected to the via conduction parts 4a and 4b while being laminated on surfaces of the induction part 5a and the insulation part 5b. The wiring part 6a is connected to a power source, the wiring part 6b is connected to the ground, and then the wiring part 6a and the silicon substrate 2 sandwich the induction part 5a to form a capacitor.
    • 解决问题的方案为了提供能够显着降低制造布线板的人力和成本的布线基板的形成方法等,通过在形成布线图案的同时形成去耦电容器。 线路板形成方法包括以下步骤:在硅衬底2上形成圆柱形通孔绝缘部分3a和3b以及通过导电部分4a和4b; 通过延伸绝缘材料形成感应部分5a,所述绝缘材料层压在通孔导电部分4a的周边区域上,以连接到通孔绝缘部分3a的整个圆周上的管状端部; 通过使层叠在通路导通部4b的周边区域的绝缘材料延伸而形成绝缘部5b,使得部分不与通孔绝缘部3b的管状端部接触; 以及在层压在感应部5a和绝缘部5b的表面上的同时形成与通孔导通部4a,4b连接的配线部6a,6b。 布线部分6a连接到电源,布线部分6b连接到地,然后布线部分6a和硅基片2夹着感应部分5a形成电容器。 版权所有(C)2012,JPO&INPIT