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    • 61. 发明专利
    • Examining device for glue adhesion failure
    • 用于胶粘剂失败的检查装置
    • JP2003002308A
    • 2003-01-08
    • JP2001189014
    • 2001-06-22
    • Dainippon Printing Co Ltd大日本印刷株式会社
    • SHIMA YUKINOBU
    • B65B57/00B05C11/00B31B1/62B31B19/62
    • PROBLEM TO BE SOLVED: To provide an examining device for a glue adhesion failure, which dispenses with a trigger sensor requiring an adjusting work highly difficult even for an experienced operator.
      SOLUTION: The examining device for the glue adhesion failure, which is used for examining whether a glue is properly adhered to a spot for glue adhesion on an article or not, and has a glue detecting means and a process means. The glue detecting means outputs a glue detection signal upon detecting glue adhered to an article on transfer, and the process means determines, basing on the glue detection signal, that the glue has been properly adhered upon detecting the glue again within a determining section after the article has been transferred through a prescribed section starting from a point where the glue is detected first.
      COPYRIGHT: (C)2003,JPO
    • 要解决的问题:提供一种胶粘剂破坏的检查装置,其不需要经验丰富的操作者即使对于甚至难以进行调节的触发传感器。 解决方案:用于检查胶水是否适当地粘附到用于粘合在物品上的胶点的胶粘剂破坏的检查装置,并且具有胶水检测装置和处理装置。 胶水检测装置在检测粘附在物品上的粘合剂时输出胶水检测信号,并且处理装置根据胶水检测信号确定在确定部分之后再次检测胶水后胶水已被适当粘附 物品已经从首先检测到胶水的点开始通过规定的部分转移。