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61. 发明公开

EP0505894A1 Coating processes and apparatus 失效
标题翻译： Beschichtungsverfahren和Einrichtung。
公开(公告)号：EP0505894A1
公开(公告)日：1992-09-30
申请号：EP92104580.3
申请日：1992-03-17
申请人： SHIPLEY COMPANY INC.
发明人： Sandock, Leonard Richard
IPC分类号： G03F7/16 , B05B15/02 , B05C5/02
CPC分类号： B05C9/04 , B05C5/0254 , B05C5/0262 , B05C9/14 , B05C11/1039 , G03F7/16 , H05K3/0091 , H05K2203/1518 , H05K2203/1572 , H05K2203/159
摘要： Processes and apparatus for uniformly coating discrete substrates by application of a controlled volume of fluid per unit surface area of a substrate. In one aspect, the invention provides a process comprising providing a fluid reservoir; and flowing fluid from the fluid reservoir without substantial interruption through one or more fluid applicators, the fluid applied with a controlled volume per unit surface area of the substrate. The invention also provides processes for applying fluid on a discrete substrate by upwardly or laterally flowing the fluid onto the substrate, and processes for applying fluid onto at least two sides of a discrete substrate. The invention further provides fluid application apparatus which enable application of a uniform fluid layer, including apparatus that provides termination of fluid flow without fluid dripping or trailing of fluid.
摘要翻译：通过在衬底的每单位表面积上施加受控体积的流体来均匀地涂覆离散衬底的方法和设备。一方面，本发明提供一种方法，包括提供流体储存器; 并且通过一个或多个流体施加器从流体储存器流动流体而没有实质的中断，所述流体以基板的每单位表面积施加受控的体积。本发明还提供了通过将流体向上或横向流动到衬底上而在离散衬底上施加流体的方法，以及将流体施加到离散衬底的至少两侧上的过程。本发明进一步提供了能够应用均匀流体层的流体施加装置，包括提供流体流动终止而不流体流体滴落或拖尾的装置。

62. 发明公开

EP0427923A2 Method for the reduction of pinholes in resist films 失效
标题翻译： Verfahren zur Erzeugung von fehlerfreien Fotolackschichten。
公开(公告)号：EP0427923A2
公开(公告)日：1991-05-22
申请号：EP90115155.5
申请日：1990-08-07
申请人： SHIPLEY COMPANY INC.
发明人： Ho, Ivan , Harris, Martin J. , Harrison, Richard , Miller, Phillip J. Jr
IPC分类号： G03F7/16
CPC分类号： G03F7/164 , H05K3/0079 , H05K3/0091 , H05K2203/0292 , H05K2203/135 , H05K2203/1518
摘要： A process for applying a pinhole free organic coating on a conductive substrate during an electrodeposition process. The elimination of pinhole defects is accomplished by use of a vibrating device interfaced with the equipment which dislodges gas bubbles adhering to the surface of the substrate during the electrodeposition process.
摘要翻译：在电沉积过程中在导电基材上施加无针孔有机涂层的方法。消除针孔缺陷是通过使用与设备接口的振动装置来完成的，该设备在电沉积过程中除去附着在基板表面上的气泡。

63. 发明授权

EP0221283B1 Ductile electroless copper 失效
标题翻译： DUCTILE电镀铜
公开(公告)号：EP0221283B1
公开(公告)日：1991-03-13
申请号：EP86112200.0
申请日：1986-09-03
申请人： SHIPLEY COMPANY INC.
发明人： Dutkewych, Oleh Boris
IPC分类号： C23C18/40
CPC分类号： C23C18/40 , H05K1/09 , H05K2203/072 , Y10T428/24917

64. 发明公开

EP0401499A1 Photoresist with copolymer binder 失效
标题翻译：共聚物-indexittel enthaltender Photolack。
公开(公告)号：EP0401499A1
公开(公告)日：1990-12-12
申请号：EP90107478.1
申请日：1990-04-19
申请人： SHIPLEY COMPANY INC.
发明人： Thackeray, James W. , Orsula, George W. , Sinta, Roger,
IPC分类号： G03F7/023 , G03F7/038 , G03F7/029
CPC分类号： G03F7/0295 , G03F7/0233 , G03F7/038 , Y10S430/106 , Y10S430/11
摘要： A photoresist that utilizes a copolymer of a phenol and a cyclic alcohol having increased optical transmission properties relative to photoresists using fully aromatic phenolic resins. Preferred binders are hydrogenated novolak resins and hydrogenated polyvinyl phenol resins.
摘要翻译：使用完全芳族酚醛树脂相对于光致抗蚀剂，利用酚和环醇的共聚物的光致抗蚀剂具有增强的光学透射性能。优选的粘合剂是氢化酚醛清漆树脂和氢化聚乙烯基苯酚树脂。

65. 发明公开

EP0371217A2 A fitting for connecting a drum to a pipeline 失效
标题翻译：连接件为一筒体的与管的连接。
公开(公告)号：EP0371217A2
公开(公告)日：1990-06-06
申请号：EP89117107.6
申请日：1989-09-15
申请人： SHIPLEY COMPANY INC.
发明人： Sands, Philip William
IPC分类号： F16L41/14 , F16L41/00
CPC分类号： F16L41/00 , Y10S285/901
摘要： A fitting (10) for connecting a drum (12) containing a fluid product to a pipeline (14) leading to a place of use without introducing contaminant.
摘要翻译：一种用于连接容纳流体产品到管线（14）的滚筒（12）通向使用地点而不引入污染物接头（10）。

66. 发明公开

EP0211180A3 Method for manufacture of multilayer circuit board 失效
标题翻译：多层电路板的制造方法
公开(公告)号：EP0211180A3
公开(公告)日：1989-08-09
申请号：EP86107744.4
申请日：1986-06-06
申请人： SHIPLEY COMPANY INC.
发明人： Shipley, Charles R., Jr.
IPC分类号： H05K3/46
CPC分类号： H05K3/465 , H05K3/0023 , H05K3/184 , H05K3/205 , H05K3/4661 , H05K3/4682 , H05K2201/09563 , H05K2203/0565 , H05K2203/1407
摘要： The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and photoimaging of permanent dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using photoimaging techniques.

67. 发明公开

EP0287750A3 Photoactive curcumin derivatives 失效
标题翻译：光敏的CURCUMIN衍生物
公开(公告)号：EP0287750A3
公开(公告)日：1989-07-19
申请号：EP88100176.2
申请日：1988-01-08
申请人： SHIPLEY COMPANY INC.
发明人： Martin, Robert L. , Rajaratnam, M. Martha , Turci, Pamela
IPC分类号： G03F7/02
CPC分类号： G03F7/022 , G03F7/091
摘要： The subject invention involves reduction of light refraction into a photoresist coating over a reflective substrate by the use of a photoactive compound in a photoresist formulation that is the reaction product of a diazooxide and curcumin.
摘要翻译：本发明涉及通过在作为重氮氧化物和姜黄素的反应产物的光致抗蚀剂制剂中使用光活性化合物将光折射减少到反射底物上的光致抗蚀剂涂层中。

68. 发明公开

EP0298298A3 Electroplating process and Article of Manufacture 失效
标题翻译：电镀工艺
公开(公告)号：EP0298298A3
公开(公告)日：1989-07-05
申请号：EP88109859.4
申请日：1988-06-21
申请人： SHIPLEY COMPANY INC.
发明人： Bladon, Dr. John J.
IPC分类号： C25D5/54 , C23C18/00 , H05K3/18
CPC分类号： C25D5/54 , H05K3/188 , H05K3/424 , H05K3/427 , H05K2203/0716
摘要： A method for metal plating the surface of an article formed from a nonconductor. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a catalytic metal chalcogenide conversion coating adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.

69. 发明公开

EP0320601A2 Electroplating process 失效
标题翻译： Elektroplattierungsverfahren。
公开(公告)号：EP0320601A2
公开(公告)日：1989-06-21
申请号：EP88117392.6
申请日：1988-10-19
申请人： SHIPLEY COMPANY INC.
发明人： Gulla, Michael , Foust, Donald F. , Philipose, George K.
IPC分类号： C25D5/54
CPC分类号： C25D5/54 , H05K3/188 , H05K3/424 , H05K3/427 , H05K2203/0716 , Y10S205/92
摘要： A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a transition metal sulfide adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.
摘要翻译：由有机塑料形成的制品的表面进行金属电镀的方法。该方法包括使浸入含有溶解电镀金属的电解质中的两个电极之间的电流通过的步骤。其中一个电极是待镀的制品，并且具有与导电区域相邻并与其接触的过渡金属硫化物区域的表面。该方法对印刷电路板的形成特别有用，并且通过涉及图案电镀的工艺能够形成印刷电路板是足够通用的。

70. 发明公开

EP0242530A3 Method for analyzing additive concentration 失效
标题翻译：分析添加浓度的方法
公开(公告)号：EP0242530A3
公开(公告)日：1989-05-10
申请号：EP87102422.0
申请日：1987-02-20
申请人： SHIPLEY COMPANY INC.
发明人： Fisher, Gordon
IPC分类号： G01N27/42 , C25D21/12
CPC分类号： G01N27/423 , H05K3/241 , H05K3/423
摘要： A method for determining the effective quantity of an organic additive in an electroplating bath involving passing an inert electrode through a predetermined sequence of voltammetric steps including a step of plating the electrode at a given applied potential, stripping the plated metal at a given applied potential, and conditioning the inert electrode without applied potential; correlating the quantity of additive with the coulombs utilized during the metal stripping step; and using the same predetermined sequence of voltammetric steps for a bath having an unknown quantity of additive.

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