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    • 64. 发明申请
    • Plasma Doping Method and Apparatus
    • 等离子体掺杂法和装置
    • US20090233383A1
    • 2009-09-17
    • US11884924
    • 2006-02-14
    • Tomohiro OkumuraYuichiro SasakiKatsumi OkashitaHiroyuki ItoBunji MizunoCheng-Guo JinIchiro Nakayama
    • Tomohiro OkumuraYuichiro SasakiKatsumi OkashitaHiroyuki ItoBunji MizunoCheng-Guo JinIchiro Nakayama
    • H01L21/66B05C11/00
    • H01L21/2236H01J37/321H01J37/32412H01J2237/2001
    • It is intended to provide a plasma doping method and apparatus which are superior in the controllability of the concentration of an impurity that is introduced into a surface layer of a sample.A prescribed gas is introduced into a vacuum container 1 from a gas supply apparatus 2 while being exhausted by a turbomolecular pump 3 as an exhaust apparatus. The pressure in the vacuum container 1 is kept at a prescribed value by a pressure regulating valve 4. High-frequency electric power of 13.56 MHz is supplied from a high-frequency power source 5 to a coil 8 disposed close to a dielectric window 7 which is opposed to a sample electrode 6, whereby induction-coupled plasma is generated in the vacuum container 1. A high-frequency power source 10 for supplying high-frequency electric power to the sample electrode 6 is provided. Every time a prescribed number of samples have been processed, a dummy sample is subjected to plasma doping and then to heating. The conditions for processing of a sample are controlled so that the measurement value of the surface sheet resistance becomes equal to a prescribed value, whereby the controllability of the impurity concentration can be increased.
    • 旨在提供一种等离子体掺杂方法和装置,该等离子体掺杂方法和装置在引入样品的表面层中的杂质的浓度的可控性方面是优异的。 将规定的气体从作为排气装置的涡轮分子泵3排出而从气体供给装置2引入真空容器1。 真空容器1中的压力通过压力调节阀4保持在规定值。13.56MHz的高频电力从高频电源5供给到靠近电介质窗7设置的线圈8, 与样品电极6相对,从而在真空容器1中产生感应耦合等离子体。提供了用于向样品电极6提供高频电力的高频电源10。 每当处理规定数量的样品时,将虚拟样品进行等离子体掺杂,然后进行加热。 控制处理样品的条件使得表面薄层电阻的测量值等于规定值,从而可以提高杂质浓度的可控性。
    • 65. 发明授权
    • Method of introducing impurity, device and element
    • 引入杂质,器件和元素的方法
    • US07547619B2
    • 2009-06-16
    • US10526999
    • 2003-09-19
    • Yuichiro SasakiBunji MizunoIchiro Nakayama
    • Yuichiro SasakiBunji MizunoIchiro Nakayama
    • H01L21/42H01L21/26
    • H01L21/2236
    • A method of introducing an impurity and an apparatus for introducing the impurity forms an impurity layer easily in a shallower profile. Component devices manufactured taking advantage of these method or apparatus are also disclosed. When introducing a material to a solid substance which has an oxidized film or other film sticking at the surface, the present method and apparatus first removes the oxidized film and other film using at least one means selected from among the group consisting of a means for irradiating the surface of solid substance with plasma, a means for irradiating the surface of solid substance with gas and a means for dipping the surface of solid substance in a reductive liquid; and then, attaches or introduces a certain desired particle. The way of attaching, or introducing, a particle is bringing a particle-containing gas to make contact to the surface, which surface has been made to be free of the oxidized film and other film. Thus, the particle is attached or introduced to the surface, or the vicinity, of solid substance. The component devices are those manufactured taking advantage of the above method or apparatus.
    • 引入杂质的方法和用于引入杂质的装置在较浅的轮廓中容易地形成杂质层。 还公开了利用这些方法或装置制造的部件装置。 当将材料引入具有在表面附着的氧化膜或其它膜的固体物质时,本方法和装置首先使用选自以下的至少一种方法除去氧化膜和其它膜:照射装置 具有等离子体的固体物质的表面,用气体照射固体表面的装置和将固体物质表面浸入还原液中的装置; 然后,附加或引入某个所需的粒子。 附着或引入颗粒的方法是使含颗粒的气体与表面接触,该表面已经被制成没有氧化膜和其它膜。 因此,将颗粒附着或引入固体物质的表面或附近。 部件装置是利用上述方法或装置制造的装置。
    • 66. 发明授权
    • Plasma processing method and apparatus
    • 等离子体处理方法和装置
    • US07510667B2
    • 2009-03-31
    • US11397626
    • 2006-04-05
    • Tomohiro OkumuraIchiro Nakayama
    • Tomohiro OkumuraIchiro Nakayama
    • C23F1/00
    • H01J37/32082C23F4/00Y02E50/30
    • A plasma processing apparatus includes a vacuum vessel, a substrate electrode for supporting a substrate, and an antenna disposed in opposition to the substrate electrode and covered with an insulating antenna cover. A first high-frequency power supplies a high-frequency power of a 30 MHz to 3 GHz frequency to the antenna, and a second high-frequency power supply supplies a high-frequency power of a 100 kHz to 20 MHz. A refrigerant supply unit is provided for supplying a refrigerant flow to the antenna, and an electrically conductive sheet is provided between the antenna and the antenna cover. The electrically conductive sheet has a surface that is parallel to the substrate electrode and is larger than an opposing surface of the antenna.
    • 等离子体处理装置包括真空容器,用于支撑基板的基板电极和与基板电极相对设置且被绝缘天线盖覆盖的天线。 第一高频电源向天线提供30MHz至3GHz频率的高频功率,而第二高频电源提供100kHz至20MHz的高频功率。 设置制冷剂供给单元,用于向天线供给制冷剂流,在天线和天线罩之间设置导电片。 导电片具有平行于衬底电极并且大于天线的相对表面的表面。
    • 67. 发明授权
    • Plasma processing method and apparatus
    • 等离子体处理方法和装置
    • US07465407B2
    • 2008-12-16
    • US10649670
    • 2003-08-28
    • Mitsuo SaitohTomohiro OkumuraIchiro Nakayama
    • Mitsuo SaitohTomohiro OkumuraIchiro Nakayama
    • C23C16/00
    • H01J37/32009C23C16/5096H01J37/32376
    • In a plasma processing method for supplying an electric power to a first electrode, making a first electrode have a ground potential, or making a first electrode have a floating potential while supplying gas to a plasma source arranged in a vicinity of an object to be processed at a pressure in a vicinity of an atmospheric pressure. The method includes processing a part of the object to be processed with a plasma in a state where an area of a surface of a potentially controlled second electrode, arranged in a position opposite to the plasma source via the object to be processed, is made superposed on the object to be processed smaller than an area of a surface of the plasma source superposed on the object to be processed.
    • 在用于向第一电极供给电力的等离子体处理方法中,使第一电极具有接地电位,或者使第一电极具有浮置电位,同时向布置在待处理物体附近的等离子体源供给气体 在大气压力附近的压力下。 该方法包括在等离子体处理待处理物体的一部分的状态,其中经由待处理物体布置在与等离子体源相反的位置的潜在受控的第二电极的表面的面积被叠加 对待处理的物体小于叠加在待处理物体上的等离子体源的表面的面积。