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    • 66. 发明授权
    • Electronic device
    • 电子设备
    • US08199503B2
    • 2012-06-12
    • US12845609
    • 2010-07-28
    • Kentaro TomiokaTakeshi Hongo
    • Kentaro TomiokaTakeshi Hongo
    • H05K7/20F28D15/00
    • H05K7/20336H01L2924/0002H05K7/2049H01L2924/00
    • According to one embodiment, an electronic device includes a housing, a circuit board, a thermally radiative section, a first heat generator, a second heat generator, a first heat receiving block, a second heat receiving block, at least one heat pipe including a first end and a second end, a second heat pipe including a third end, a fourth end, and an intermediate portion, and a cutout section provided on the first heat receiving block. The second heat generator is mounted on the circuit board at a position farther from the thermally radiative section than the first heat generator is. The first heat receiving block is provided with a cutout section and is thermally connected to the first heat generator. The second heat receiving block is thermally connected to the second heat generator. The intermediate portion of the second heat pipe passes through the cutout section.
    • 根据一个实施例,电子设备包括壳体,电路板,热辐射部分,第一热发生器,第二热发生器,第一热接收块,第二热接收块,至少一个热管,包括 第一端和第二端,包括第三端,第四端和中间部分的第二热管,以及设置在第一热接收块上的切口部。 第二热发生器安装在比第一热发生器更远离热辐射部分的位置处的电路板上。 第一热接收块设置有切口部,并与第一热发生器热连接。 第二热接收块热连接到第二热发生器。 第二热管的中间部分穿过切口部分。
    • 67. 发明申请
    • ELECTRONIC DEVICE
    • 电子设备
    • US20110075371A1
    • 2011-03-31
    • US12845609
    • 2010-07-28
    • Kentaro TomiokaTakeshi Hongo
    • Kentaro TomiokaTakeshi Hongo
    • H05K7/20
    • H05K7/20336H01L2924/0002H05K7/2049H01L2924/00
    • According to one embodiment, an electronic device includes a housing, a circuit board, a thermally radiative section, a first heat generator, a second heat generator, a first heat receiving block, a second heat receiving block, at least one heat pipe including a first end and a second end, a second heat pipe including a third end, a fourth end, and an intermediate portion, and a cutout section provided on the first heat receiving block. The second heat generator is mounted on the circuit board at a position farther from the thermally radiative section than the first heat generator is. The first heat receiving block is provided with a cutout section and is thermally connected to the first heat generator. The second heat receiving block is thermally connected to the second heat generator. The intermediate portion of the second heat pipe passes through the cutout section.
    • 根据一个实施例,电子设备包括壳体,电路板,热辐射部分,第一热发生器,第二热发生器,第一热接收块,第二热接收块,至少一个热管,包括 第一端和第二端,包括第三端,第四端和中间部分的第二热管,以及设置在第一热接收块上的切口部。 第二热发生器安装在比第一热发生器更远离热辐射部分的位置处的电路板上。 第一热接收块设置有切口部,并与第一热发生器热连接。 第二热接收块热连接到第二热发生器。 第二热管的中间部分穿过切口部分。
    • 69. 发明授权
    • Electronic device, loop heat pipe and cooling device
    • 电子设备,回路热管及冷却装置
    • US07738248B2
    • 2010-06-15
    • US12330266
    • 2008-12-08
    • Kentaro Tomioka
    • Kentaro Tomioka
    • H05K7/20H01L23/36
    • G06F1/203G06F2200/201H01L2924/0002H01L2924/00
    • According to one embodiment, an electronic device includes a heat generating part housed inside a cabinet and a loop heat pipe housed inside the cabinet, which includes an internal flow path having a loop shape in which a working fluid is sealed. The loop heat pipe further includes a heat receiving unit, a heat radiating unit, a vapor flow path which allows a gasified portion of the working fluid to flow from the heat receiving unit towards the heat radiating unit, a liquid returning flow path which allows a liquefied portion of the working fluid to flow from the heat radiating unit towards the heat receiving unit, and a wick provided at a position adjacent to the vapor flow path inside the liquid returning flow path. The wick also serves as a partition portion which partitions the vapor flow path and the liquid returning flow path from each other.
    • 根据一个实施例,电子设备包括容纳在机壳内部的发热部分和容纳在机壳内的回路热管,其包括具有工作流体被密封的环形的内部流路。 回路热管还包括热接收单元,散热单元,允许工作流体的气化部分从热接收单元朝向散热单元流动的蒸气流路,允许 工作流体的液化部分从热辐射单元朝向热接收单元流动,并且设置在与返回液流路径内部的蒸气流路相邻的位置处的芯。 芯也用作将蒸气流路和液体返回流路彼此隔开的分隔部。