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    • 61. 发明授权
    • Mask pattern correction method and a recording medium which records a mask pattern correction program
    • 掩模图案校正方法和记录掩模图案校正程序的记录介质
    • US06221539B1
    • 2001-04-24
    • US09358824
    • 1999-07-22
    • Toshiya KotaniSatoshi TanakaSoichi Inoue
    • Toshiya KotaniSatoshi TanakaSoichi Inoue
    • G03F900
    • G03F7/70441G03F1/36
    • All edge positions constituting a first mask pattern are shifted by a predetermined change amount, to obtain a second mask pattern. A first finished plan shape transferred by the fist mask pattern and a second finished plan shape transferred by the second mask pattern are obtained by a calculation. Coefficients, which are obtained by respectively dividing dimensional differences between the edge positions of the first and second finished plan shapes by the change amount, are respectively calculated and assigned for edges. A corrected pattern is prepared by shifting the edge positions of the first mask pattern in accordance with magnitude of division of differences between a design pattern and the first finished plan shape by the coefficients assigned to the edges.
    • 构成第一掩模图案的所有边缘位置偏移预定的变化量,以获得第二掩模图案。 通过计算获得通过第一掩模图案传送的第一完成平面形状和通过第二掩模图案传送的第二完成平面形状。 通过分别计算第一和第二完成平面形状的边缘位置之间的尺寸差异所得到的系数,并分配给边缘。 通过根据分配给边缘的系数,根据设计图案和第一完成平面形状之间的差分的大小来移动第一掩模图案的边缘位置来准备校正图案。
    • 62. 发明授权
    • Pattern forming method
    • 图案形成方法
    • US09207531B2
    • 2015-12-08
    • US13239449
    • 2011-09-22
    • Hiroko NakamuraKoji AsakawaShigeki HattoriSatoshi TanakaToshiya Kotani
    • Hiroko NakamuraKoji AsakawaShigeki HattoriSatoshi TanakaToshiya Kotani
    • H01L21/31H01L21/469G03F7/00B81C1/00B82Y10/00B82Y40/00
    • G03F7/0002B81C1/00031B81C2201/0149B82Y10/00B82Y40/00
    • According to one embodiment, a pattern including first and second block phases is formed by self-assembling a block copolymer onto a film to be processed. The entire block copolymer present in a first region is removed under a first condition by carrying out energy beam irradiation and development, thereby leaving a pattern including the first and second block phases in a region other than the first region. The first block phase present in a second region is selectively removed under a second condition by carrying out energy beam irradiation and development, thereby leaving a pattern including the first and second block phases in an overlap region between a region other than the first region and a region other than the second region, and leaving a pattern of second block phase in the second region excluding the overlap region. The film is etched with the left patterns as masks.
    • 根据一个实施方案,通过将嵌段共聚物自组装成待加工的膜来形成包括第一和第二嵌段相的图案。 存在于第一区域中的整个嵌段共聚物在第一条件下通过进行能量束照射和显影而除去,从而在第一区域以外的区域留下包括第一和第二嵌段相的图案。 存在于第二区域中的第一块相位通过进行能量束照射和显影而在第二条件下被选择性地去除,从而在包括第一区域和第一区域之间的重叠区域中留下包括第一和第二块相的图案, 区域,并且在除了重叠区域之外的第二区域中留下第二块相位的图案。 用左图案蚀刻该胶片作为掩模。
    • 65. 发明授权
    • Pattern generation method, computer-readable recording medium, and semiconductor device manufacturing method
    • 图案生成方法,计算机可读记录介质和半导体器件制造方法
    • US08347241B2
    • 2013-01-01
    • US12354119
    • 2009-01-15
    • Fumiharu NakajimaToshiya KotaniHiromitsu MashitaChikaaki Kodama
    • Fumiharu NakajimaToshiya KotaniHiromitsu MashitaChikaaki Kodama
    • G06F17/50
    • G06F17/5068G03F1/36
    • A pattern generation method includes: acquiring a first design constraint for first patterns to be formed on a process target film by a first process, the first design constraint using, as indices, a pattern width of an arbitrary one of the first patterns, and a space between the arbitrary pattern and a pattern adjacent to the arbitrary pattern; correcting the first design constraint in accordance with pattern conversion by the second process, and thereby acquiring a second design constraint for the second pattern which uses, as indices, two patterns on both sides of a predetermined pattern space of the second pattern; judging whether the design pattern fulfils the second design constraint; and changing the design pattern so as to correspond to a value allowed by the second design constraint when the design constraint is not fulfilled.
    • 图案生成方法包括:通过第一处理获取要在过程目标胶片上形成的第一图案的第一设计约束,所述第一设计约束使用作为所述第一图案中的任意一个的图案宽度的索引,以及 任意图案之间的空间和与任意图案相邻的图案; 根据第二处理的图案转换来校正第一设计约束,从而获得第二图案的第二设计约束,该第二图案使用在第二图案的预定图案空间的两侧上的两个图案作为索引; 判断设计模式是否符合第二设计约束; 并且当不满足设计约束时,改变设计模式以对应于由第二设计约束允许的值。
    • 68. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08065637B2
    • 2011-11-22
    • US12267465
    • 2008-11-07
    • Toshiya Kotani
    • Toshiya Kotani
    • G06F17/50
    • G03F1/36H01J2237/31769
    • A semiconductor device having a physical pattern based on a designed pattern is provided. The designed pattern includes a target pattern and a correction pattern. The target pattern includes a first portion of an edge with a first distance between the first portion and a pattern opposed thereto, a second portion of the edge with a second distance between the second portion and a pattern opposed thereto, which is different from the first distance, and a third portion of the edge having a first region of the edge with the first distance between the first region and the pattern opposed thereto.
    • 提供具有基于设计图案的物理图案的半导体器件。 设计的图案包括目标图案和校正图案。 目标图案包括边缘的第一部分,第一部分与第一部分和与其相对的图案具有第一距离,边缘的第二部分在第二部分和与其相对的图案之间具有第二距离,该第二部分与第一部分不同于第一部分 所述边缘的第三部分具有所述边缘的第一区域,所述第一区域在所述第一区域和与其相对的图案之间具有第一距离。