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    • 64. 发明专利
    • SEMICONDUCTOR LASER
    • JPH07193320A
    • 1995-07-28
    • JP34853793
    • 1993-12-27
    • TOSHIBA CORP
    • NITTA KOICHIHATAGOSHI GENICHIOKAJIMA MASASUE
    • H01S5/00H01S3/18
    • PURPOSE:To increase the TE polarization/TM polarization ratio by a method wherein a metallic layer having TM polarization loss and TE polarization loss to the laser oscillation wavelength is to be provided in an optical waveguide structure. CONSTITUTION:The surface of the title semiconductor laser is flattened by a p-type GaAs cap layer 23, an n-type GaAs current block layer 25 and a p-type GaA5 contact layer 26. A pure Au metallic layer 24 having absorption loss to laser oscillation wavelength is provided on the surface. This Au metallic layer 24 is provided with a p-type electrode AuZn 28. Besides, an n-type GaAs substrate 11 is provided with an n-type electrode AuGe 27. Through these procedures, the Au metallic layer 24 fills the role of a layer giving the loss difference to TE polarization and TM polarization so that the loss to the TM polarization may be made sufficiently larger than the loss to the TE polarization by the distance value (h) between the Au metallic layer 24 and the active layers. Accordingly, the title semiconductor laser system in large TE polarization capable of using for such a device as a magneto-optical system etc. can be manufactured.
    • 66. 发明专利
    • JPH05335683A
    • 1993-12-17
    • JP13923092
    • 1992-05-29
    • TOSHIBA CORP
    • NITTA KOICHIWATANABE MINORUOKAJIMA MASASUE
    • H01S5/00H01S3/18
    • PURPOSE:To obtain a wide-stripe semiconductor laser which can be reduced in element resistance and has an excellent temperature characteristic by providing an impurity diffusion preventing layer. CONSTITUTION:An n-type GaAs buffer layer 12, n-type InGaAlP clad layer 13, undoped InGaAl clad layer 14, undoped InGaP active layer 15, undoped InGaAlP diffusion preventing layer 16, p-type InGaAlP clad layer 17, p-type InGaP cap layer 18, and n-type GaAs current blocking layer 19 are successively grown on an n-type GaAs substrate 11. Then a p-type GaAs contact layer 20 containing a stripe-like opening is grown on the layer 19. In addition, an n-type AuGe electrode 21 and p-type AuZn electrode 22 are respectively formed on the rear surface of the substrate 11 and on the layer 20. Therefore, heat generation from this semiconductor laser can be suppressed and the operation of the laser can be stabilized, since the carrier concentration in the p-type clad layer 17 can be increased without diffusing impurities in the active layer 15.
    • 70. 发明专利
    • MANUFACTURE OF SEMICONDUCTOR LIGHT EMITTING ELEMENT
    • JPH01202881A
    • 1989-08-15
    • JP2649088
    • 1988-02-09
    • TOSHIBA CORP
    • NITTA KOICHIISHIKAWA MASAYUKI
    • H01L21/308H01S5/00
    • PURPOSE:To improve yield, current constriction efficiency and reliability by providing a region in which impurity is diffused to an intermediate band gap layer which is not covered with a current constriction layer and by providing a contact layer on the intermediate band gap layer which is not covered with the current constriction layer and on the current constriction layer. CONSTITUTION:Of clad layers 43, 45, a current constriction layer 47 which is partially removed is provided at least on a second clad layer 45 which is located on the opposite side of a substrate. A region 49 whereon impurity of the same conduction type as the second clad layer 45 is diffused is provided from a region 52 where the current constriction layer 47 is removed and to the second clad layer 45. Furthermore, a contact layer 48 of the same conduction type of the second clad layer 42 is provided on the current constriction layer 47 which has the diffused region 49. In this way, highly efficient and reliable visible light semiconductor light emitting element can be acquired which is provided with high yield and good current constriction.