专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明申请

US20060144711A1 Electrochemical machining device and electrochemical machining method 审中-公开
标题翻译：电化学加工装置和电化学加工方法
公开(公告)号：US20060144711A1
公开(公告)日：2006-07-06
申请号：US10534232
申请日：2003-07-18
申请人： Itsuki Kobata , Masayuki Kumekawa , Osamu Nabeya , Roberto Serikawa , Takayuki Saito , Tsukuru Suzuki , Akira Kodera , Hozumi Yasuda , Takeshi Iizumi , Mitsuhiko Shirakashi
发明人： Itsuki Kobata , Masayuki Kumekawa , Osamu Nabeya , Roberto Serikawa , Takayuki Saito , Tsukuru Suzuki , Akira Kodera , Hozumi Yasuda , Takeshi Iizumi , Mitsuhiko Shirakashi
IPC分类号： B23H7/20
CPC分类号： B23H3/02 , B23H5/08 , B23H9/00
摘要： A object of this invention is to provide an electrolytic processing method and apparatus that can suppress a change in the electric conductivity of a fluid due to contaminants, such as processing products produced in electrolytic processing, so that the fluid can maintain good flattening properties. The electrolytic processing apparatus of this invention includes: a processing electrode (42) that can come into contact with a workpiece (W); a feeding electrode (44) for feeding electricity to the workpiece (W); a holder (22) for holding the workpiece (W); a power source (26) for applying a voltage between the processing electrode (42) and the feeding electrode (44); a fluid supply section (50) for supplying a fluid between the workpiece (W) and at least one of the processing electrode (42) and the feeding electrode (44); a sensor (80) for measuring the electric conductivity of the fluid; and a control section (84) for changing the processing conditions based on the electric conductivity measured by the sensor (80).
摘要翻译：本发明的目的是提供一种电解处理方法和装置，其可以抑制由电解处理中产生的加工产品等污染物引起的流体的导电性变化，使得流体能够保持良好的平坦化性能。本发明的电解处理装置包括：可与工件（W）接触的处理电极（42）; 用于向工件（W）供电的供电电极（44）; 用于保持工件（W）的保持器（22）; 用于在处理电极（42）和馈电电极（44）之间施加电压的电源（26）; 用于在工件（W）和处理电极（42）和馈电电极（44）中的至少一个之间供应流体的流体供应部分（50）; 用于测量流体的电导率的传感器（80）; 以及用于根据由传感器（80）测量的电导率来改变处理条件的控制部分（84）。

62. 发明申请

US20050121328A1 Electrolytic processing apparatus and method 失效
标题翻译：电解处理装置及方法
公开(公告)号：US20050121328A1
公开(公告)日：2005-06-09
申请号：US10485204
申请日：2003-01-31
申请人： Mitsuhiko Shirakashi , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Osamu Nabeya
发明人： Mitsuhiko Shirakashi , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Osamu Nabeya
IPC分类号： C25F3/00 , C25F7/00 , H01L21/3063 , H01L21/3213 , C25B9/00 , C25B15/00
CPC分类号： C25F3/00 , C25F7/00 , H01L21/3063 , H01L21/32134
摘要： This invention relates to an electrolytic processing apparatus and method useful for processing a conductive material formed in the surface of a substrate, or for removing impurities adhering to the surface of a substrate. An electrolytic processing apparatus, including, a processing electrode that can come close to a workpiece, a feeding electrode for feeding electricity to the workpiece, an ion exchanger disposed in the space between the workpiece and the processing and the feeding electrodes, a fluid supply section for supplying a fluid between the workpiece and the ion exchanger, and a power source, wherein the processing electrode and/or the feeding electrode is electrically divided into a plurality of parts, and the power source applies a voltage to each of the divided electrode parts and can control voltage and/or electric current independently for each of the divided electrode parts.
摘要翻译：本发明涉及一种电解处理装置和方法，其用于处理形成在基板表面上的导电材料，或用于去除附着在基板表面上的杂质。一种电解处理装置，包括可以靠近工件的处理电极，用于向工件供电的供给电极，设置在工件和处理之间的空间中的离子交换器和供电电极，流体供应部分用于在工件和离子交换器之间供应流体，以及电源，其中处理电极和/或馈电电极被电分为多个部分，并且电源向每个分开的电极部分施加电压并且可以分别对每个分割电极部分分别控制电压和/或电流。

63. 发明申请

US20100151771A1 POLISHING APPARATUS AND POLISHING METHOD 审中-公开
标题翻译：抛光装置和抛光方法
公开(公告)号：US20100151771A1
公开(公告)日：2010-06-17
申请号：US12712455
申请日：2010-02-25
申请人： Osamu Nabeya
发明人： Osamu Nabeya
IPC分类号： B24B49/14 , B24B1/00
CPC分类号： B24B37/015
摘要： A polishing apparatus polishing a surface of a substrate, such as a semiconductor substrate. The polishing apparatus including a substrate holding mechanism, a polishing table having a polishing surface, and a polishing surface temperature controller for controlling a temperature distribution of the polishing surface. The substrate holding mechanism and the polishing table provide relative movement between the surface of the substrate and the polishing surface while the substrate holding mechanism presses the surface of the substrate against the polishing surface to thereby polish the surface of the substrate. The polishing surface temperature controller controls the temperature distribution so that the polishing surface has a predetermined temperature distribution to thereby control removal rates of portions of the surface of the substrate.
摘要翻译：抛光装置抛光诸如半导体衬底的衬底的表面。该抛光装置包括基板保持机构，具有抛光表面的抛光台和用于控制抛光表面的温度分布的抛光表面温度控制器。基板保持机构和抛光台在基板保持机构将基板的表面压靠在研磨面上的状态下提供基板表面与研磨面之间的相对运动，从而对基板的表面进行抛光。抛光表面温度控制器控制温度分布，使得抛光表面具有预定的温度分布，从而控制基板表面的部分的去除速率。

64. 发明授权

US07563356B2 Composite processing apparatus and method 失效
标题翻译：复合加工设备及方法
公开(公告)号：US07563356B2
公开(公告)日：2009-07-21
申请号：US10549324
申请日：2004-03-12
申请人： Osamu Nabeya , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Ikutaro Noji
发明人： Osamu Nabeya , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Ikutaro Noji
IPC分类号： C25F3/16 , B23H5/08
CPC分类号： C25F7/00
摘要： A composite processing apparatus which can securely process a conductive material, such as a copper film, at a low surface pressure and a high rate while effectively preventing the formation of pits is disclosed. The composite processing apparatus includes: a substrate holder for holding a substrate; a processing table including a mechanical processing section for processing a surface of the substrate by a processing method involving a mechanical action; and an electrolytic processing section which is separate from the mechanical processing section. The electrolytic processing section includes a processing electrode with an ion exchanger, for processing the substrate by applying a voltage between the processing electrode and the substrate while keeping the ion exchanger (92) in contact with the substrate. The composite processing apparatus also includes a liquid supply section for supplying a liquid between the substrate and the processing electrode, and between the substrate and the mechanical processing section; and a drive section for moving the substrate and the processing table relative to each other.
摘要翻译：公开了一种复合处理装置，其能够在有效地防止凹坑形成的同时，以低表面压力和高速度可靠地处理诸如铜膜的导电材料。复合处理装置包括：用于保持基板的基板保持件; 一种处理台，包括用于通过涉及机械动作的处理方法来处理所述基板的表面的机械处理部分; 以及与机械加工部分开的电解处理部。电解处理部包括具有离子交换器的处理电极，用于通过在保持离子交换器（92）与基板接触的同时在处理电极和基板之间施加电压来处理基板。所述复合处理装置还包括用于在所述基板和所述处理电极之间以及所述基板和所述机械加工部之间供给液体的液体供给部; 以及用于相对于彼此移动所述基板和所述处理台的驱动部。

65. 发明申请

US20080314763A1 Method and device for regenerating ion exchanger, and electrolytic processing apparatus 有权
标题翻译：再生离子交换器的方法和装置，以及电解处理装置
公开(公告)号：US20080314763A1
公开(公告)日：2008-12-25
申请号：US12222733
申请日：2008-08-14
申请人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiro Shirakashi , Yasushi Toma , Itsuki Kobata
发明人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiro Shirakashi , Yasushi Toma , Itsuki Kobata
IPC分类号： C25F1/00 , C25F7/00
CPC分类号： C25F3/00 , B01J49/30 , C25F7/00
摘要： A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.
摘要翻译：用于再生离子交换剂的方法和装置可以容易且快速地再生离子交换器，并且可以在再生离子交换器的清洁和废液的处理时最小化负载。再生污染离子交换器的方法包括：提供一对再生电极和对置电极，设置在电极之间的隔板和设置在对电极与隔板之间的再生用离子交换器; 并在再生电极和对电极之间施加电压，同时在隔板和再生电极之间提供液体，并且还在分隔件和对电极之间供应液体。

66. 发明授权

US07427345B2 Method and device for regenerating ion exchanger, and electrolytic processing apparatus 有权
公开(公告)号：US07427345B2
公开(公告)日：2008-09-23
申请号：US10432397
申请日：2002-11-29
申请人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata
发明人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata
IPC分类号： C25D17/00 , C25B15/00 , B23H3/00
CPC分类号： C25F3/00 , B01J49/30 , C25F7/00
摘要： A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.

67. 发明授权

US07638030B2 Electrolytic processing apparatus and electrolytic processing method 有权
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US07638030B2
公开(公告)日：2009-12-29
申请号：US10669468
申请日：2003-09-25
申请人： Osamu Nabeya , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Takeshi Iizumi , Nobuyuki Takada , Koichi Fukaya , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita
发明人： Osamu Nabeya , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Takeshi Iizumi , Nobuyuki Takada , Koichi Fukaya , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita
IPC分类号： C25F7/00 , B23H5/06
CPC分类号： C25F7/00
摘要： An electrolytic processing apparatus which, while eliminating a CMP processing entirely or reducing a load on a CMP processing to the least possible extent, can process and flatten a conductive material formed in the surface of a substrate, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The present invention includes an electrode section including a plurality of electrode members disposed in parallel, each electrode member including an electrode and an ion exchanger covering the surface of the electrode, a holder for holding a workpiece, which is capable of bringing the workpiece close to or into contact with the ion exchanger of the electrode member, and a power source to be connected to the electrode of each electrode member of the electrode section. The ion exchanger of the electrode member includes an ion exchanger having an excellent surface smoothness and an ion exchanger having a large ion exchange capacity.
摘要翻译：一种在完全消除CMP处理或者尽可能减少CMP处理负荷的电解处理装置可以处理和平坦化形成在基板表面上的导电材料，或者可以除去（清洁）附着的附着物到工件（例如基板）的表面。本发明包括一个电极部分，它包括平行设置的多个电极部件，每个电极部件包括一个电极和一个覆盖电极表面的离子交换器，一个用于保持工件的保持器，它能使工件靠近或与电极部件的离子交换器接触，以及要连接到电极部分的每个电极部件的电极的电源。电极构件的离子交换器包括具有优异表面平滑度的离子交换器和离子交换容量大的离子交换器。

68. 发明申请

US20080076335A1 Polishing apparatus and polishing method 审中-公开
标题翻译：抛光设备和抛光方法
公开(公告)号：US20080076335A1
公开(公告)日：2008-03-27
申请号：US11979023
申请日：2007-10-30
申请人： Osamu Nabeya
发明人： Osamu Nabeya
IPC分类号： B24B29/00
CPC分类号： B24B37/015
摘要： A polishing apparatus polish a surface of a substrate, such as a semiconductor substrate. The polishing apparatus according to the present invention includes a substrate holding mechanism, a polishing table having a polishing surface, and a polishing surface temperature controller for controlling a temperature distribution of the polishing surface. The substrate holding mechanism and the polishing table are operable to provide relative movement between the surface of the substrate and the polishing surface while the substrate holding mechanism presses the surface of the substrate against the polishing surface to thereby polish the surface of the substrate. The polishing surface temperature controller controls the temperature distribution so that the polishing surface has a predetermined temperature distribution to thereby control removal rates of portions of the surface of the substrate.
摘要翻译：抛光装置抛光诸如半导体衬底的衬底的表面。根据本发明的抛光装置包括基板保持机构，具有抛光表面的抛光台和用于控制抛光表面的温度分布的抛光表面温度控制器。基板保持机构和抛光台可操作以在基板保持机构将基板的表面压靠抛光表面的同时提供基板表面和抛光表面之间的相对移动，从而抛光基板的表面。抛光表面温度控制器控制温度分布，使得抛光表面具有预定的温度分布，从而控制基板表面的部分的去除速率。

69. 发明申请

US20070123154A1 Polishing apparatus 审中-公开
标题翻译：抛光设备
公开(公告)号：US20070123154A1
公开(公告)日：2007-05-31
申请号：US11602321
申请日：2006-11-21
申请人： Osamu Nabeya
发明人： Osamu Nabeya
IPC分类号： B24B29/00 , B24B21/18
CPC分类号： B24B53/017
摘要： A polishing apparatus is used to polish a workpiece such as a semiconductor wafer. The polishing apparatus includes a polishing table having a polishing surface, a dresser for dressing the polishing surface, a substrate holder for holding and pressing a substrate against the polishing surface to polish the substrate with relative movement between the polishing surface and the substrate. The dresser includes a first dressing member and a second dressing member. The first dressing member has a circular shape having a diameter larger than a diameter of the substrate. The second dressing member is shaped so as to surround the first dressing member. The first dressing member and the second dressing member are operable to come into contact with the polishing surface independently of each other.
摘要翻译：抛光装置用于抛光诸如半导体晶片的工件。抛光装置包括具有抛光表面的抛光台，用于修整抛光表面的修整器，用于将衬底保持并压靠在抛光表面上的衬底保持器，以在抛光表面和衬底之间的相对运动来抛光衬底。修整器包括第一修整构件和第二修整构件。第一修整构件具有直径大于基底的直径的圆形。第二修整构件成形为围绕第一修整构件。第一修整构件和第二修整构件可操作以彼此独立地与抛光表面接触。

70. 发明授权

US07140955B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US07140955B2
公开(公告)日：2006-11-28
申请号：US10160017
申请日：2002-06-04
申请人： Osamu Nabeya
发明人： Osamu Nabeya
IPC分类号： B24B5/00 , B24D15/00
CPC分类号： B24B37/26 , B24B57/02
摘要： A polishing apparatus includes a plurality of polishing fluid supply openings terminating in a polishing surface of a polishing table, and a plurality of grooves which are formed in the polishing surface and arranged so as not to be in direct communication with the polishing fluid supply openings. The polishing apparatus further includes a polishing fluid supply system for supplying a polishing fluid to a surface of a substrate through the openings. The grooves may extend at right angles relative to one another so as to define a plurality of lands therebetween, and the polishing fluid supply openings are formed through the lands.
摘要翻译：抛光装置包括终止于研磨台的研磨面的多个研磨液供给口，以及形成在研磨面上并配置为不与研磨液供给口直接连通的多个槽。抛光装置还包括用于通过开口将抛光流体供应到基板的表面的抛光流体供应系统。凹槽可以相对于彼此成直角地延伸，以便在它们之间限定多个焊盘，并且抛光流体供应开口穿过焊盘形成。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式