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61. 发明专利

JP2001234355A SURFACE METALLIZING METHOD 失效
公开(公告)号：JP2001234355A
公开(公告)日：2001-08-31
申请号：JP2000038740
申请日：2000-02-16
申请人： EBARA CORP
发明人： KOGURE NAOAKI
IPC分类号： B22F7/04 , C23C24/08
摘要： PROBLEM TO BE SOLVED: To provide a surface metallizing method by which the increase of temperature is reduced and a metallic film having high adhesion and joining strength with a base material can be deposited. SOLUTION: This method has a stage where an agent for metallic film deposition in which metallic hyperfine particles are dispersed into a prescribed solvent is prepared, a stage where the agent is brought into contact with the surface of a base material composed of an insulator, and a stage where the agent deposited on the surface of the base material is dried and heat-treated to melt and bond the metallic hyperfine particles.

62. 发明专利

JP2001210643A WIRING FORMATION METHOD AND WIRING STRUCTURE 失效
公开(公告)号：JP2001210643A
公开(公告)日：2001-08-03
申请号：JP2000014919
申请日：2000-01-24
申请人： EBARA CORP
发明人： KOGURE NAOAKI , KATO TAKAO , HORIE KUNIAKI
IPC分类号： H01L21/3205 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To form sound embedded wiring without defects so as to from a ground layer with uniform film thickness on the inner surface of a fine recessed part. SOLUTION: When wiring 9 is to be formed by burying a conductive material into a fine recessed part 5, that is provided on the surface of a base W according to a wiring pattern by plating, a ground layer 7 that is made of a conductive material, whose surface energy is smaller than that of a conductive material forming the wiring 9 on the inner surface of the recessed part 5, and then the surface of the base W is plated.

63. 发明专利

JP2001183856A ELECTROPHOTOGRAPHIC PHOTORECEPTOR 失效
公开(公告)号：JP2001183856A
公开(公告)日：2001-07-06
申请号：JP36546399
申请日：1999-12-22
申请人： EBARA CORP
发明人： KOGURE NAOAKI
IPC分类号： G03G5/14
摘要： PROBLEM TO BE SOLVED: To provide an electrophotographic photoreceptor capable of increasing the thickness of an inorganic pigment-containing middle layer and containing inorganic pigment particles dispersed in the middle layer with high uniformity. SOLUTION: In the electrophotographic photoreceptor with a middle layer 12 between a substrate 10 and a photosensitive layer 11, the middle layer 12 contains inorganic pigment particles and ultrafine metal particles mixed with the inorganic pigment particles.

64. 发明专利

JP2001144417A PRINTED-CIRCUIT BOARD AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2001144417A
公开(公告)日：2001-05-25
申请号：JP32673699
申请日：1999-11-17
申请人： EBARA CORP
发明人： KOGURE NAOAKI
IPC分类号： H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a printed-circuit board that can be manufactured without using conventional adhesives with low reliability and expensive large-scale vacuum devices, is highly reliable, and can be wired with high density, and its manufacturing method. SOLUTION: The method for manufacturing a printed-circuit board is provided with a process for bringing ultra-fine particle solution where a metal ultra-fine particle has been dispersed into a specific solvent into contact with a base 10 and then preparing a base and a printed-circuit board where the surface of the base 10 is covered with a dried and heat-treated metal covering 12, a process for preparing the ultra-fine particle solution where the metal ultra-fine particle has been dispersed into the solvent, a process for bringing the ultra-fine particle solvent into contact with the surface of the base, and a process for drying and heat-treating the ultra-fine particle adhering to the surface of the base and then connecting the metal ultra-fine particle.

65. 发明专利

JP2001118806A METHOD OF FORMING WIRING 失效
公开(公告)号：JP2001118806A
公开(公告)日：2001-04-27
申请号：JP29677799
申请日：1999-10-19
申请人： EBARA CORP
发明人： KOGURE NAOAKI
IPC分类号： H01L21/3205 , H01L21/288 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To provide a method of forming a wiring by which a buried wiring made of a good conductive material having no defect in fine recessed portions can be formed. SOLUTION: When a conductive metal 7 is buried in fine recessed portions 5 made in the surface of a substrate W by a plating method to form a wiring, an ultra-fine particle dispersing liquid 20 in which ultra-fine metal particles 24 are dispersed in a solvent 26 is supplied to the surface of the substrate W and then the substrate W is dried and burned to form an underlying film 28. This underlying film 28 helps to form the good wiring by burying the conductive metal thereafter.

66. 发明专利

JP2001057367A SURFACE FLATTENING METHOD OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2001057367A
公开(公告)日：2001-02-27
申请号：JP23192599
申请日：1999-08-18
申请人： EBARA CORP
发明人： KOGURE NAOAKI
IPC分类号： H01L21/3205 , H01L21/288 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a method of repairing a surface recess produced on the metal part of a semiconductor device by a dishing phenomenon when a CMP (chemical mechanical polishing) process is carried out so as to uniformly flatten all the surface of the semiconductor device. SOLUTION: The surface of a base material 10 is made to keep undergoing a primary chemical mechanical polishing process until a point of time when a dishing phenomenon occurs in the polished surface of a metal part 22. Furthermore, another metal 24 is deposited on the surface of the metal part 22 by preferably electroless copper plating so as to fill up a surface recess caused by a dishing phenomenon with the other metal 24, and then the surface of the base material 10 is subjected to a secondary chemical mechanical polishing process.

67. 发明专利

JP2001023985A INTERCONNECTION STRUCTURE AND PREPARATION THEREOF 失效
公开(公告)号：JP2001023985A
公开(公告)日：2001-01-26
申请号：JP19491899
申请日：1999-07-08
申请人： EBARA CORP
发明人： KOGURE NAOAKI
IPC分类号： H01L21/3205 , H01L21/304 , H01L21/768
摘要： PROBLEM TO BE SOLVED: To obtain an interconnection structure and a method of preparing the same, capable of easily protecting interconnections made of a metal, such as copper which are formed on a substrate. SOLUTION: This method comprises the steps of embedding a conductive metallic material into fine recesses formed in a substrate, such as a semiconductor wafer (step 1), polishing the surface of the metallic material by a mechanical and chemical operation using a working solution (including a polishing solution, a chemical solution and a cleaning solution) from the outermost layer of the buried metal (step 2), whereby an interconnection structure is prepared. During or after the polishing step 2, a chemical conversion treatment is conducted through a contact with an electrolytic solution, either with the surface of the substrate in contact as is with the working solution or immediately after the working solution is removed, whereby the surface of the embedded metallic material is provided with a protective chemical conversion coating.

68. 发明专利

JP2000349089A WIRING FORMING METHOD AND WIRING STRUCTURE 失效
公开(公告)号：JP2000349089A
公开(公告)日：2000-12-15
申请号：JP15396699
申请日：1999-06-01
申请人： EBARA CORP
发明人： KOGURE NAOAKI
IPC分类号： H01L21/302 , H01L21/3065 , H01L21/3213
摘要： PROBLEM TO BE SOLVED: To provide a wiring forming method and a wiring structure capable of preventing a conductive material buried in a recess from dropping in a planarization process even if the conductive material buried in the recess having an incomplete surface seed layer formed on the surface of an insulating layer. SOLUTION: A recess 14 is formed on the surface of a substrate 10 according to a predetermined wiring pattern, a conductive material 20a is buried in the recess 14, and then the extra conductive material is removed from the surface of the substrate, wherein the recess is formed in a shape in which its opening side is narrowed.

69. 发明专利

JP2000164587A SUBSTRATE HEATER FOR SEMICONDUCTOR-MANUFACTURING EQUIPMENT 失效
公开(公告)号：JP2000164587A
公开(公告)日：2000-06-16
申请号：JP33786198
申请日：1998-11-27
申请人： EBARA CORP
发明人： MURAKAMI TAKESHI , KOGURE NAOAKI , FUKUNAGA YUKIO
IPC分类号： H01L21/31
摘要： PROBLEM TO BE SOLVED: To obtain a substrate heater for semiconductor-manufacturing equipment, that can stably supply heat to a semiconductor substrate by avoiding the oxidation of a surface that directly makes contact with at least the semiconductor substrate or a susceptor within a heating plate surface, even if oxygen is used as the reaction gas. SOLUTION: In a substrate heater 2 for semiconductor manufacturing equipment, that is provided with an electrical heating element 10 and retains a semiconductor substrate or a susceptor for placing the semiconductor substrate on a surface 12a of a metal heating plate 12, the surface 12a for retaining at least the semiconductor substrate or the susceptor out of the surface of the heating plate 12 is covered with a nonmetal film 20.

70. 发明专利

JP2000109994A SUBSTRATE PLATING DEVICE 失效
公开(公告)号：JP2000109994A
公开(公告)日：2000-04-18
申请号：JP28284498
申请日：1998-10-05
申请人： EBARA CORP
发明人： KURIYAMA FUMIO , KOGURE NAOAKI , HONGO AKIHISA
IPC分类号： C25D5/48 , C25D19/00
摘要： PROBLEM TO BE SOLVED: To provide a substrate plating device capable of forming a plating layer on a substrate face, storing the substrate till the next stage without exposing the substrate to the air and easily realizing a device for forming a plating layer on a substrate face and thereafter continuously executing all treating stages including wet treatment such as CMP treatment for removing the plating layer other than the wiring part of the plating layer from the substrate face. SOLUTION: In this substrate plating device having a treating part in which a substrate is applied with plating treatment and a cleaning treating part in which the substrate after the plating treatment is cleaned, the plating treatment is executed at the plating treatment part, and, moreover, a substrate storing tank 16 in which the substrate subjected to the plating treatment at the plating treating part and the cleaning treatment at the cleaning treating part is dipped in a storing soln. for a certain time and is stored is provided. Further, a substrate underwater carrying machine in which the substrate after the plating treatment at the plating treating part is moved in a water channel in which pure water is flowed is provided.

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