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    • 66. 发明专利
    • JPH05234643A
    • 1993-09-10
    • JP7267092
    • 1992-02-21
    • TDK CORP
    • TAKATANI MINORUMOCHIZUKI NOBUNORI
    • H01R13/719H01R13/7193H01R13/7197
    • PURPOSE:To provide a counter-noise type connector and noise removing parts for the counter-noise type connector which can adopt a structure assembling the noise removing parts to the connector even though the connector is made compact, and can have a structure to secure a desired strength to the noise removing parts. CONSTITUTION:In this connector, a block form laminate part 3 for removing noise in which at least either an inductor or a condenser is formed by laminating a conductor 5 and a condenser, combining with a connector housing 2 or metallic terminals 1, commonly to plural metallic terminals of a connector, is provided. And a housing to hold the metallic terminals of the connector is composed of a magnetic ferrite block. The noise removing parts are formed by a coaxial multiple condenser, or by forming inductors and condensers in a multiple form, with laminated parts.
    • 70. 发明专利
    • PASSIVE COMPOUND COMPONENT
    • JPH0414208A
    • 1992-01-20
    • JP11714290
    • 1990-05-07
    • TDK CORP
    • TAKATANI MINORUMOCHIZUKI NOBUNORI
    • H01F27/00H01G4/40H03H7/01H03H7/09
    • PURPOSE:To assure the enhancements in the high-frequency characteristics, the mounting density and the reliability as well as the facilitation of mounting by a method wherein the opposing direction of capacitor electrodes and the coil axis direction in parallel with each other and juxtaposing the capacitor and the coil perpendicularly to this direction. CONSTITUTION:A coil 3 and a capacitor 2 are laterally juxtaposed inside a sintered body 1. Accordingly, a circuit connection is made by connecting conductors 41, 42 arranged inside the sintered body 1 for cutting down the length of the conductors 41, 42 while decreasing the lead inductance to enhance the high-frequency characteristics. Since the coil 3 and the capacitor 2 can be circuit-connected inside the sintered body 1, the outer terminal electrode number will suffice for only two of the terminal electrodes 61, 62. Consequently, the conductor pattern on a circuit substrate can be simplified enabling the space to be cut down for augmenting the mounting density. Through these procedures, the terminal number can be minimized while making it feasible to increase the gap between terminal electrodes, to avoid the occurrence of solder bridge and to enhance the reliability.