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    • 62. 发明授权
    • Objective lens actuator for enabling to reduce the dynamic tilt between optical disc and objective lens
    • 物镜致动器,用于减轻光盘与物镜之间的动态倾斜
    • US08407730B2
    • 2013-03-26
    • US12632891
    • 2009-12-08
    • Yoshihiro SatoHidenao SaitoSeiichi KatoJun HatoRyuichiro MizunoKatsuhiko Kimura
    • Yoshihiro SatoHidenao SaitoSeiichi KatoJun HatoRyuichiro MizunoKatsuhiko Kimura
    • G11B7/00
    • G11B7/0932G11B7/0933G11B7/22
    • An objective lens actuator 25, for driving an objective lens 1 for focusing lights upon a recoding surface of an optical disc, comprises a moving part 2, which comprises the objective lens 1 and a coil; a magnet, which is fixed on a yoke and drives the moving part 2; a plural number of elastic support parts, each of which supports the moving part 2 at an end thereof; a first fixing portion 5a and a second fixing portion 5b, which fix other ends of the plural number of elastic support parts 4 and are disposed opposite to each other in a focus direction; and a moving mechanism 6, which is provided on the first and second fixing portion 5a and 5b, so that the first and second fixing portions 5a and 5b can move in the focus direction, relatively, and thereby providing the objective lens actuator 25 enabling to reduce the dynamic relative tilt between the optical disc and the objective lens 1 (i.e., reducing the tilt of the objective lens 1 in the tangential direction when operating), as well as, an optical pickup and an optical disc drive.
    • 用于驱动用于将光聚焦在光盘的记录表面上的物镜1的物镜致动器25包括包括物镜1和线圈的移动部分2; 磁体,其固定在磁轭上并驱动移动部件2; 多个弹性支撑部件,每个弹性支撑部件在其一端支撑移动部件2; 第一固定部分5a和第二固定部分5b,其固定多个弹性支撑部分4的另一端,并且在聚焦方向上彼此相对设置; 以及设置在第一和第二固定部分5a和5b上的移动机构6,使得第一和第二固定部分5a和5b可相对于聚焦方向移动,从而使物镜致动器25能够 降低光盘和物镜1之间的动态相对倾斜度(即,当操作时减小物镜1在切线方向上的倾斜度)以及光拾取器和光盘驱动器。
    • 64. 发明申请
    • PLASMA NITRIDING METHOD, PLASMA NITRIDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • 等离子体氮化方法,等离子体纳米装置及制造半导体器件的方法
    • US20120252209A1
    • 2012-10-04
    • US13433746
    • 2012-03-29
    • Yoshiro KabeYoshihiro Sato
    • Yoshiro KabeYoshihiro Sato
    • H01L21/768C23C14/06H01L21/318
    • H01L21/321C23C8/36H01L21/28176H01L21/28247H01L21/7685H01L29/4941H01L29/518
    • A plasma nitriding method includes placing, in a processing chamber, a target object having a structure including a first portion containing a metal and a second portion containing silicon to expose surfaces of the first and the second portion; and performing a plasma process on the target object to selectively nitride the surface of the first portion such that a metal nitride film is selectively formed on the surface of the first portion. Further, the first portion contains tungsten, and a nitrogen-containing plasma is generated by supplying a nitrogen-containing gas into the processing chamber and setting an internal pressure of the processing chamber in a range from 133 Pa to 1333 Pa. The surface of the first portion is selectively nitrided without nitriding the surface of the second portion by the nitrogen-containing plasma such that a tungsten nitride film is formed on the surface of the first portion.
    • 等离子体氮化方法包括在处理室中放置具有包括含有金属的第一部分和含有硅的第二部分的结构的目标物体以暴露第一和第二部分的表面; 以及对所述目标物体进行等离子体处理以选择性地氮化所述第一部分的表面,使得在所述第一部分的表面上选择性地形成金属氮化物膜。 此外,第一部分含有钨,通过向处理室中供给含氮气体并将处理室的内部压力设定在133Pa〜1333Pa的范围内,生成含氮等离子体, 选择性氮化第一部分,而不会通过含氮等离子体氮化第二部分的表面,使得在第一部分的表面上形成氮化钨膜。
    • 66. 发明授权
    • Method for forming insulating film and method for manufacturing semiconductor device
    • 绝缘膜的形成方法及半导体装置的制造方法
    • US08158535B2
    • 2012-04-17
    • US12521666
    • 2007-12-20
    • Minoru HondaYoshihiro SatoToshio Nakanishi
    • Minoru HondaYoshihiro SatoToshio Nakanishi
    • H01L21/31
    • H01L21/28202H01L21/67109H01L21/67115
    • A method for forming an insulating film includes a step of preparing a substrate, which is to be processed and has silicon exposed on the surface, a step of performing oxidizing to the silicon on the surface, and forming a silicon oxide thin film on the surface of the silicon, a step of performing first nitriding to the silicon oxide film and the base silicon thereof, and forming a silicon oxynitride film, and a step of performing first heat treatment to the silicon oxynitride film in N2O atmosphere. In such method, a step of performing second nitriding to the silicon oxynitride film may be further included after the first heat treatment, and furthermore, a step of performing second heat treatment to the silicon oxynitride film after the second nitriding may be included.
    • 一种形成绝缘膜的方法包括制备待加工的基板并且在表面上露出硅的步骤,对表面上的硅进行氧化并在表面上形成氧化硅薄膜的步骤 的硅,对氧化硅膜及其基底硅进行氮化的步骤,形成氮氧化硅膜,以及在N 2 O气氛中对氮氧化硅膜进行热处理的工序。 在这种方法中,可以在第一热处理之后进一步包括对氮氧化硅膜进行第二氮化的步骤,此外,可以包括在第二次氮化之后对氮氧化硅膜进行第二次热处理的步骤。