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    • 63. 发明授权
    • Heat pipe with multiple wicks
    • 带多个灯芯的热管
    • US07866373B2
    • 2011-01-11
    • US11309244
    • 2006-07-19
    • Chuen-Shu HouTay-Jian LiuChao-Nien TungChih-Hsien Sun
    • Chuen-Shu HouTay-Jian LiuChao-Nien TungChih-Hsien Sun
    • F28D15/00H05K7/20
    • F28D15/046F28D15/025
    • A heat pipe includes a metal casing (10) filled with a working fluid therein, a capillary wick (20) provided inside of the metal casing and a tube (30) contacting with a surface of the capillary wick. The metal casing includes an evaporating section (40), a condensing section (60) and an adiabatic section (50) between the evaporating section and the condensing section. A vapor passage (70) is formed inside of the casing and a liquid channel (80) is defined by the capillary wick. The working fluid in vapor state flows from the evaporating section towards the condensing section along the vapor passage and the working fluid in liquid state returns to the evaporating section from the condensing section along the liquid channel. The tube separates the vapor from the liquid at a place where the tube is located.
    • 热管包括在其中填充有工作流体的金属壳体(10),设置在金属壳体内部的毛细管芯(20)和与毛细管芯的表面接触的管(30)。 金属壳体包括在蒸发部分和冷凝部分之间的蒸发部分(40),冷凝部分(60)和绝热部分(50)。 在壳体的内部形成有蒸气通路(70),并且由毛细管芯限定液体通道(80)。 蒸汽状态的工作流体沿着蒸汽通道从蒸发部流向冷凝部,液态的工作流体沿着液体通道从冷凝部返回到蒸发部。 管在管所在的地方将蒸汽与液体分开。
    • 65. 发明授权
    • LED illumination device and light engine thereof
    • LED照明装置及其发光二极管
    • US07841753B2
    • 2010-11-30
    • US12406051
    • 2009-03-17
    • Tay-Jian Liu
    • Tay-Jian Liu
    • F21V29/00
    • F21L4/027F21K9/00F21V23/006F21V29/51F21V29/767F21Y2115/10H01L2924/0002Y10S362/80H01L2924/00
    • An LED illumination device includes an optical section at a front end thereof, an electrical section at a rear end thereof, and a heat dissipation section between the optical section and the electrical section. The optical section includes a plurality of LEDs electrically connecting with the electrical section, and a light output housing around the LEDs. The heat dissipation section includes a plurality of L-shaped heat pipes, a heat sink and a mounting seat. Each of the heat pipes includes an evaporation section and a condensation section substantially perpendicular thereto. The condensation sections of the heat pipes are received in the heat sink. The mounting seat attaches to the evaporation sections of the heat pipes. The LEDs thermally connect with evaporation sections via the mounting seat.
    • LED照明装置包括前端的光学部分,其后端的电气部分和光学部分与电气部分之间的散热部分。 光学部分包括与电部分电连接的多个LED和围绕LED的光输出壳体。 散热部包括多个L形热管,散热器和安装座。 每个热管包括蒸发部分和与其基本垂直的冷凝部分。 热管的冷凝段被接收在散热器中。 安装座附接到热管的蒸发部分。 LED通过安装座与蒸发部分热连接。
    • 66. 发明授权
    • Heat exchange module
    • 热交换模块
    • US07743818B2
    • 2010-06-29
    • US11308070
    • 2006-03-05
    • Tay-Jian LiuChih-Feng FanChih-Peng LeeChao-Nien Tung
    • Tay-Jian LiuChih-Feng FanChih-Peng LeeChao-Nien Tung
    • F28D15/00
    • H01L23/427H01L2924/0002H01L2924/00
    • A heat exchange module (1) includes a fan duct, an evaporator (22), a condenser (26) and an electric fan (50). The fan duct includes a lower portion (10) and an upper portion (30). The lower portion cooperates with the upper portion to define therebetween an air passage (90). The evaporator contains therein a working fluid. The condenser is in fluid communication with the evaporator. The evaporator and the condenser are received in the air passage defined by the fan duct. The working fluid turns into vapor in the evaporator upon receiving heat from a heat-generating component (70) and the vapor turns into condensate upon releasing the heat to the condenser. The electric fan is attached to the fan duct. The electric fan produces an airflow flowing through the air passage for removing the heat away from the condenser.
    • 热交换模块(1)包括风扇管道,蒸发器(22),冷凝器(26)和电风扇(50)。 风扇导管包括下部(10)和上部(30)。 下部与上部配合以在其间限定空气通道(90)。 蒸发器包含工作流体。 冷凝器与蒸发器流体连通。 蒸发器和冷凝器容纳在由风扇管道限定的空气通道中。 当从发热部件(70)接收热量时,工作流体在蒸发器中变成蒸气,并且在将热量释放到冷凝器时,蒸汽变成冷凝物。 电风扇安装在风扇导管上。 电风扇产生流过空气通道的气流,用于从冷凝器中除去热量。
    • 67. 发明授权
    • Performance testing apparatus for heat pipes
    • 热管性能试验装置
    • US07674037B2
    • 2010-03-09
    • US11309332
    • 2006-07-27
    • Tay-Jian LiuChao-Nien TungChih-Hsien SunChuen-Shu HouCheng-Hui Lin
    • Tay-Jian LiuChao-Nien TungChih-Hsien SunChuen-Shu HouCheng-Hui Lin
    • G01K1/16G01K25/00
    • G01K15/00F28F2200/005G01K1/14
    • A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe to be tested. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.
    • 一种用于热管的性能测试装置包括具有限定在其中的冷却结构的不可移动部分,用于冷却待测试的热管。 可移动部分能够相对于不可移动部分移动并且具有限定在其中的冷却结构以冷却热管。 接收结构位于不可移动部分和可移动部分之间,用于在其中容纳热管。 至少一个温度传感器附接到不可移动部分和可移动部分中的至少一个,用于热接触接收结构中的热管以检测热管的温度。 外壳将不可移动部分和可移动部分包围在其中,并且其侧壁可滑动地接触不动部分和可移动部分中的至少一个。
    • 68. 发明授权
    • Cooling device incorporating boiling chamber
    • 包含沸腾室的冷却装置
    • US07661463B2
    • 2010-02-16
    • US11166313
    • 2005-06-24
    • Tay-Jian Liu
    • Tay-Jian Liu
    • F28D15/04H05K7/20
    • H01L23/427F28D15/0233F28F3/022H01L2924/0002H01L2924/00
    • A cooling device includes a boiling chamber containing working fluid therein. The chamber includes a bottom wall for contacting with a heat generating component and a cover hermetically connected with the bottom wall. The cover includes a top wall and a bulge formed at a periphery thereof. The bulge includes a pair of spaced side walls, one of the side walls connecting with the top wall and the other of the side walls connecting with the bottom wall. A buffering region is formed between the side walls, which is capable of absorbing agitation wave generated by boiling fluid to thereby allow the boiling fluid to be capabling of continuously and stably contacting with and exchanging heat from the top wall of the boiling chamber when the fluid boils. A heat sink is arranged on the cover of the boiling chamber for transferring heat from the boiling chamber to environment.
    • 冷却装置包括其中包含工作流体的沸腾室。 该室包括用于与发热部件接触的底壁和与底壁密封连接的盖。 盖子包括形成在其周边的顶壁和凸起。 凸起包括一对间隔开的侧壁,与顶壁连接的一个侧壁和与底壁连接的另一侧壁。 在侧壁之间形成缓冲区域,该缓冲区域能够吸收由沸腾流体产生的搅动波,从而允许沸腾流体在流体流动时能够连续地稳定地接触并与沸腾室的顶壁交换热量 煮沸 在沸腾室的盖上布置有散热器,用于将热量从沸腾室转移到环境中。
    • 69. 发明授权
    • Performance testing apparatus for heat pipes
    • 热管性能试验装置
    • US07648267B2
    • 2010-01-19
    • US11309559
    • 2006-08-22
    • Tay-Jian LiuChuen-Shu HouChao-Nien Tung
    • Tay-Jian LiuChuen-Shu HouChao-Nien Tung
    • G01K1/16G01K25/00
    • F28D15/0283F28F2200/005
    • A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member for heating an evaporating section of a heat pipe requiring test. The movable portion is movable relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached in the immovable portion and the movable portion for detecting temperature of the heat pipe.
    • 用于热管的性能测试装置包括不可移动部分和可移动部分,每个具有用于加热需要测试的热管的蒸发部分的加热部件。 可移动部分可相对于不可移动部分移动。 在不可移动部分和可移动部分之间限定接收结构,用于接收热管的蒸发部分。 在不动部和可动部中限定有凹凸配合结构,以确保接收结构能够精确地接收热管。 温度传感器安装在不动部分和可移动部分中,用于检测热管的温度。
    • 70. 发明授权
    • Apparatus for simulation of heat generation of electronic components
    • 用于模拟电子部件的发热的装置
    • US07637659B2
    • 2009-12-29
    • US11309183
    • 2006-07-07
    • Tay-Jian LiuShang-Chih Liang
    • Tay-Jian LiuShang-Chih Liang
    • G01K1/00G01K7/00
    • G01N25/20
    • Disclosed is an apparatus (10) for simulation of heat generation of a heat-generating electronic component. The apparatus includes a heat-transfer simulation device (110), a base (120) and at least one supporting post (150). The base is made of a heat-insulation material, and defines therein a recess (122). The heat-transfer simulation device is used for simulating heat generation from a heat-generating electronic component. The supporting post supportively mounts the heat-transfer simulation device within the recess defined in the base. A method of evaluating heat removal capacity of a heat dissipation device is also disclosed based on this apparatus.
    • 公开了一种用于模拟发热电子部件的发热的装置(10)。 该装置包括热传递模拟装置(110),基座(120)和至少一个支撑柱(150)。 基座由绝热材料制成,并在其中限定有凹部(122)。 传热模拟装置用于模拟来自发热电子部件的发热。 支撑柱支撑地将传热模拟装置安装在基座中限定的凹部内。 还公开了一种评估散热装置的散热能力的方法。