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    • 66. 发明授权
    • Semiconductor integrated circuit device
    • 半导体集成电路器件
    • US06226204B1
    • 2001-05-01
    • US09141450
    • 1998-08-27
    • Kazuko InuzukaKatsushi NagabaShigeo Ohshima
    • Kazuko InuzukaKatsushi NagabaShigeo Ohshima
    • G11C1604
    • G11C7/1057G11C7/1051G11C7/106G11C7/1072G11C7/22G11C7/222G11C11/4076G11C11/4093G11C11/4096
    • The data output circuit in a clock synchronous DRAM comprises a first data transfer circuit to which the data read from a memory is input and which transfers the input data to the output side in synchronization with an internal clock, an equalizing circuit to which the output of the first data transfer circuit is input during a read operation by a burst operation and to which high-impedance data is input after the read operation, a second data transfer circuit connected to the equalizing circuit, and an output buffer to which the output of the second data transfer circuit is input. The second data transfer circuit transfers all the data to the output buffer in synchronization with an output clock. This eliminates the dependence of the data access time and data hold time on data item and/or cycle and facilitates the timing control of the output control signal.
    • 时钟同步DRAM中的数据输出电路包括第一数据传输电路,从存储器读取的数据被输入到该第一数据传输电路,并且将输入数据与内部时钟同步地传送到输出端;均衡电路, 第一数据传送电路在读操作期间通过脉冲串操作输入,并且在读操作之后输入高阻数据,连接到均衡电路的第二数据传输电路和输出缓冲器 第二数据传输电路被输入。 第二数据传输电路与输出时钟同步地将所有数据传送到输出缓冲器。 这消除了数据访问时间和数据保持时间对数据项和/或周期的依赖性,并且便于输出控制信号的定时控制。
    • 68. 发明授权
    • Semiconductor memory device having a plurality of banks
    • 具有多个存储体的半导体存储器件
    • US5818785A
    • 1998-10-06
    • US764886
    • 1996-12-16
    • Shigeo Ohshima
    • Shigeo Ohshima
    • G11C7/10G11C8/12G11C8/00
    • G11C7/10G11C7/1051G11C8/12
    • A semiconductor memory device having a plurality of banks of memory cells is provided. The device has a data line provided in each of the banks for coupling to one of the memory cells in the corresponding bank. A common data line is shared by the banks, and is selectively coupled to one of the data lines through switches. Additionally, an amplifier is coupled to the common data line to amplify data read from a selected memory cell, and an I/O line is coupled to the amplifier to transmit the amplified data to an outer section. In the device, one of the banks of memory cells is selected by a bank select signal. Therefore, the amplifier is shared by the banks. Further the length of the I/O line can be shortened so that the load on the amplifier can be reduced. Accordingly, chip area is decreased and the speed of the memory device is improved.
    • 提供具有多个存储单元组的半导体存储器件。 该设备具有在每个存储体中提供的数据线,用于耦合到相应存储体中的一个存储单元。 公共数据线由存储体共享,并且通过开关选择性地耦合到数据线之一。 此外,放大器耦合到公共数据线以放大从所选择的存储器单元读取的数据,并且I / O线耦合到放大器以将放大的数据传输到外部部分。 在器件中,存储单元组之一由存储体选择信号选择。 因此,放大器由银行共享。 此外,可以缩短I / O线的长度,从而可以减小放大器的负载。 因此,芯片面积减小,存储器件的速度提高。
    • 70. 发明授权
    • Semiconductor integrated circuit
    • 半导体集成电路
    • US5703381A
    • 1997-12-30
    • US557731
    • 1995-11-13
    • Kiyoaki IwasaShigeo Ohshima
    • Kiyoaki IwasaShigeo Ohshima
    • G01R31/26G01R31/28H01L21/66H01L21/822H01L23/544H01L27/04H01L23/58
    • H01L22/34G01R31/2884
    • A semiconductor integrated circuit includes a rectangular semiconductor chip having a main surface, a plurality of pads formed in a peripheral portion of the main surface of the semiconductor chip, for connection to external connecting members, a plurality of circuit elements of an integrated circuit formed in an area of the main surface other than an area in which the plurality of pads are formed, and at least one characteristic evaluating circuit element connected to at least one of the plurality of circuit elements of the integrated circuit by sharing an impurity doped region which forms part of the at least one circuit element with the at least one circuit element of the integrated circuit in an area of the main surface other than the peripheral portion in which the plurality of pads are formed.
    • 半导体集成电路包括具有主表面的矩形半导体芯片,形成在半导体芯片的主表面的周边部分中的多个焊盘,用于连接到外部连接构件,多个集成电路的电路元件形成在 除了形成多个焊盘的区域之外的主表面的区域,以及至少一个特征评估电路元件,其通过共享形成的杂质掺杂区域而与集成电路的多个电路元件中的至少一个连接 所述至少一个电路元件的一部分与所述集成电路的所述至少一个电路元件在所述主表面的除了形成所述多个焊盘的外围部分之外的区域中。