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    • 62. 发明授权
    • Fabrication of field effect transistor with shallow junctions using low temperature activation of antimony
    • 使用低温活化锑制造具有浅结的场效应晶体管
    • US06893930B1
    • 2005-05-17
    • US10161452
    • 2002-05-31
    • Bin YuHaihong Wang
    • Bin YuHaihong Wang
    • H01L21/265H01L21/336
    • H01L29/66598H01L21/26513H01L29/665H01L29/6653
    • For fabricating a field effect transistor on an active device area of a semiconductor substrate, a gate dielectric and a gate electrode are formed on the active device area of the semiconductor substrate. Antimony (Sb) dopant is implanted into exposed regions of the active device area of the semiconductor substrate to form at least one of drain and source extension junctions and/or drain and source contact junctions. A low temperature thermal anneal process at a temperature less than about 950° Celsius is performed for activating the antimony (Sb) dopant within the drain and source extension junctions and/or drain and source contact junctions. In one embodiment of the present invention, the drain and source contact junctions are formed and thermally annealed before the formation of the drain and source extension junctions in a disposable spacer process for further minimizing heating of the drain and source extension junctions. In another embodiment of the present invention, the drain and source extension junctions and/or the drain and source contact junctions are formed to be amorphous before the thermal anneal process. In that case, a SPE (solid phase epitaxy) activation process in performed for activating the antimony (Sb) dopant within the amorphous drain and source extension junctions and/or the amorphous drain and source contact junctions at a temperature less than about 650° Celsius.
    • 为了在半导体衬底的有源器件区域上制造场效应晶体管,在半导体衬底的有源器件区域上形成栅极电介质和栅电极。 将锑(Sb)掺杂剂注入到半导体衬底的有源器件区域的暴露区域中,以形成漏极和源极延伸结和/或漏极和源极接触结中的至少一个。 在低于约950℃的温度下进行低温热退火工艺,以激活漏极和源极延伸结和/或漏极和源极接触接点内的锑(Sb)掺杂剂。 在本发明的一个实施例中,在一次性间隔器工艺中形成漏极和源极延伸接头之前,形成漏极和源极接触接头并进行热退火,以进一步最小化漏极和源极延伸接点的加热。 在本发明的另一实施例中,在热退火工艺之前,将漏极和源极延伸接头和/或漏极和源极接触接点形成为非晶体。 在这种情况下,在低于约650℃的温度下,在非晶漏极和源极延伸结和/或非晶漏极和源极接触点内激活用于激活锑(Sb)掺杂剂的SPE(固相外延)激活过程 。
    • 64. 发明授权
    • Method for forming fins in a FinFET device using sacrificial carbon layer
    • 在使用牺牲碳层的FinFET器件中形成翅片的方法
    • US06645797B1
    • 2003-11-11
    • US10310926
    • 2002-12-06
    • Matthew S. BuynoskiSrikanteswara Dakshina-MurthyCyrus E. TaberyHaihong WangChih-Yuh YangBin Yu
    • Matthew S. BuynoskiSrikanteswara Dakshina-MurthyCyrus E. TaberyHaihong WangChih-Yuh YangBin Yu
    • H01L2184
    • H01L29/785H01L29/66795
    • A method for forming a fin in a semiconductor device that includes a substrate, an insulating layer formed on the substrate, and a conductive layer formed on the insulating layer, includes forming a carbon layer over the conductive layer and forming a mask over the carbon layer. The method further includes etching the mask and carbon layer to form at least one structure, where the structure has a first width, reducing the width of the carbon layer in the at least one structure to a second width, depositing an oxide layer to surround the at least one structure, removing a portion of the oxide layer and the mask, removing the carbon layer to form an opening in a remaining portion of the oxide layer for each of the at least one structure, filling the at least one opening with conductive material, and removing the remaining portion of the oxide layer and a portion of the conductive layer to form the fin.
    • 一种在半导体器件中形成翅片的方法,包括:衬底,形成在衬底上的绝缘层和形成在绝缘层上的导电层,包括在导电层上形成碳层,并在碳层上形成掩模 。 该方法还包括蚀刻掩模和碳层以形成至少一种结构,其中结构具有第一宽度,将至少一个结构中的碳层的宽度减小到第二宽度,沉积氧化物层以围绕 至少一个结构,去除所述氧化物层和所述掩模的一部分,除去所述碳层以在所述至少一个结构中的每一个结构的氧化物层的剩余部分中形成开口,用导电材料填充所述至少一个开口 并且去除氧化物层的剩余部分和导电层的一部分以形成翅片。
    • 65. 发明授权
    • Germanium MOSFET devices and methods for making same
    • 锗MOSFET器件及其制造方法
    • US08334181B1
    • 2012-12-18
    • US12836378
    • 2010-07-14
    • Judy Xilin AnZoran KrivokapicHaihong WangBin Yu
    • Judy Xilin AnZoran KrivokapicHaihong WangBin Yu
    • H01L29/72
    • H01L29/7855H01L21/823821H01L29/42384H01L29/7843H01L29/78684
    • A double gate germanium metal-oxide semiconductor field-effect transistor (MOSFET) includes a germanium fin, a first gate formed adjacent a first side of the germanium fin, and a second gate formed adjacent a second side of the germanium fin opposite the first side. A triple gate MOSFET includes a germanium fin, a first gate formed adjacent a first side of the germanium fin, a second gate formed adjacent a second side of the germanium fin opposite the first side, and a top gate formed on top of the germanium fin. An all-around gate MOSFET includes a germanium fin, a first sidewall gate structure formed adjacent a first side of the germanium fin, a second sidewall gate structure formed adjacent a second side of the germanium fin, and additional gate structures formed on and around the germanium fin.
    • 双栅极锗金属氧化物半导体场效应晶体管(MOSFET)包括锗翅片,邻近锗翅片的第一侧形成的第一栅极和与第一侧相对的锗翅片第二侧附近形成的第二栅极 。 三栅极MOSFET包括锗翅片,与锗翅片的第一侧相邻形成的第一栅极,与第一侧相对的锗翅片的第二侧附近形成的第二栅极和形成在锗翅片顶部上的顶栅极 。 全栅极MOSFET包括锗翅片,邻近锗翅片的第一侧形成的第一侧壁栅极结构,邻近锗翅片的第二侧形成的第二侧壁栅极结构,以及形成在锗翅片上和周围的附近的栅极结构 锗鳍