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61. 发明专利

JPH07106759A THIN-FILM MULTILAYERED SUBSTRATE 失效
公开(公告)号：JPH07106759A
公开(公告)日：1995-04-21
申请号：JP26809393
申请日：1993-09-30
申请人： SONY CORP
发明人： ISHIKAWA MINORU
IPC分类号： H05K1/02 , H01P3/08 , H01P5/00 , H01P5/02 , H05K1/00 , H05K3/46
摘要： PURPOSE:To obtain impedance matching between device lines and between lines without connecting any chip resistance element by partially changing the shape of a signal line so as to change the impedance. CONSTITUTION:A thin film multilayered substrate is constituted by putting a dielectric substrate composed of, for example, a polyimide resin between a signal line 13 and ground layer. Both ends of the line 13 are respectively connected to devices 15 and 16. The line 13 is composed of broad parts 13A and 13C having widths of about 30mum and a narrow part 13B having a width of about 10mum. When the characteristic impedance of the line 13 is set against a prescribed chip by adjusting the length of the narrow part 13B, impedance matching can be obtained between the line 13 and the connected devices 15 and 16 without connecting any chip resistance element. Therefore, impedance setting can be made in a more easily way during the manufacture of the thin film multilayered substrate.

62. 发明专利

JPH076804A ELECTRIC CONNECTOR 失效
公开(公告)号：JPH076804A
公开(公告)日：1995-01-10
申请号：JP17264493
申请日：1993-06-18
申请人： SONY CORP
发明人： SHINOHARA MIKA , YAMADA YUKIO , ISHIKAWA MINORU
IPC分类号： H01R4/58
摘要： PURPOSE:To surely carry out connection without any precise positioning, to easily carry out attachment/removal, and to occupy a little space by bringing the surface of a positive side connector part and the surface of a negative side connector part into slight contact with each other and engaging hook-shaped engaging parts with loop-shaped engaging parts. CONSTITUTION:An electric connector 10 consists of a positive side connector part 11 and a negative connector side 12. The positive connector side 11 is constructed of a flexible sheet and is provided with plural engaging parts 11a, each of which is made of a conductive material and is formed into a hook-shape. On the other hand, the negative side connector 12 is constructed of a flexible sheet similarly, and its surface is provided with plural engaging parts 12a, each of which is formed into a loop and is made of a conductive material. When connection is carried out in the connector 10, the surface of the positive side connector 11 and the surface of the negative side connector 12 are lightly fitted with each other so that the hook-shape engaging parts 11a of the positive side connector part 11 are engaged with the engaging parts 12a of the negative side connector part 12.

63. 发明专利

JPH06283874A HEAT DISSIPATING MEMBER AND HEAT DISSIPATING AUXILIARY PIN 失效
公开(公告)号：JPH06283874A
公开(公告)日：1994-10-07
申请号：JP9539393
申请日：1993-03-29
申请人： SONY CORP
发明人： AKASAKA TAKASHI , NAKAMURA TOSHIFUMI , OKUHORA AKIHIKO , ISHIKAWA MINORU
IPC分类号： H01L23/36 , H01L23/40 , H05K7/20
摘要： PURPOSE:To efficiently dissipate heat in response to the temperature distribution of a heat generator in a heat dissipating member for adhering the generator to conduct heat generated from the generator to be radiated, thereby reducing a temperature rise of the generator. CONSTITUTION:A heat dissipating auxiliary pin 12 is disposed on a heat conducting flat plate 11 in a disposing density responsive to a temperature distribution of a heat generator thereby to remarkably effectively dissipate heat in response to the distribution of the generator.

64. 发明专利

JPH0645402A WIRING BOARD AND METHOD OF CONNECTION THEREOF 失效
公开(公告)号：JPH0645402A
公开(公告)日：1994-02-18
申请号：JP19561792
申请日：1992-07-22
申请人： SONY CORP
发明人： HASEGAWA KIYOSHI , NAKAMURA TOSHIFUMI , ISHIKAWA MINORU
IPC分类号： H01L21/60 , H01L21/321 , H01L23/50
摘要： PURPOSE:To ensure satisfactory connection at all times. CONSTITUTION:In a connection method of a wiring board in which an IC chip 1 is connected onto a wiring board 2 through a bump, heights of bumps 5 located at four corners of the IC chip 1 are formed to be higher than those of other bumps 3, and thereafter the IC chip 1 is connected onto the wiring board 2 through the bumps 3, 5.

65. 发明专利

JPH05136532A FLEXIBLE WIRING BOARD 失效
公开(公告)号：JPH05136532A
公开(公告)日：1993-06-01
申请号：JP32509591
申请日：1991-11-14
申请人： SONY CORP
发明人： HAKUTA TATSUO , FUJIHIRA KAZUHIRO , ISHIKAWA MINORU , OGAWA MICHIKO
IPC分类号： H05K1/02 , H05K1/00 , H05K1/14 , H05K1/18 , H05K3/36
摘要： PURPOSE:To mount electronic parts in high density at low cost by a method wherein protrusions protruding integrally with a part of the title flexible wiring board mounting the electronic parts to be interposed between other parts are arranged on said part. CONSTITUTION:For example, electronic parts 16a such as ICs having lead parts or semiconductor chips, etc., are mounted on the surface side of the title flexible wiring board 10 while the other electrode parts 16b are mounted on the rear surface side of the same. Furthermore, a protrusion 17 is arranged on the flexible wiring board 10. At this time, the protrusion 17 is formed by protruding a part of the flexible wiring board 10 to one side thereof as if the section were to form almost angle shape. In such a constitution, the protrusions 17 (17a, 17b) function as spacers or connectors between the boards vertically overlapped with each other. Accordingly, any spacers or connectors need not be arranged as spacers or connectors as a result, the part numbers can be reduced as well as the larger space need not be given to these parts.

66. 发明专利

JPH05110264A WIRING BOARD 失效
公开(公告)号：JPH05110264A
公开(公告)日：1993-04-30
申请号：JP29357891
申请日：1991-10-14
申请人： SONY CORP
发明人： ISHIKAWA MINORU
IPC分类号： H01L23/12 , H05K1/16 , H05K3/46
摘要： PURPOSE:To obtain a wiring board applicable to a high-frequency digital circuit by forming a capacitor into the board for the wiring. CONSTITUTION:A board 1 for a wiring has a wiring layer on a silicon substrate 2, and a capacitor 5, in which a first electrode layer 2, a dielectric layer 3 and a second electrode layer 4 are piled up successively, is formed into the board 1 for the wiring. It is favorable that the silicon substrate 2 is used as the first electrode layer of the capacitor 5.

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