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61. 发明申请

US20060220260A1 Semiconductor chip package and manufacturing method thereof 有权
标题翻译：半导体芯片封装及其制造方法
公开(公告)号：US20060220260A1
公开(公告)日：2006-10-05
申请号：US11387690
申请日：2006-03-24
申请人： Norio Takahashi
发明人： Norio Takahashi
IPC分类号： H01L23/48
CPC分类号： B81C1/0023 , B81C2203/0154 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/1461 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An acceleration sensor chip package comprises a frame section, a first semiconductor chip corresponding to an MEMS chip having a plurality of first bumps, a second semiconductor chip having a plurality of second bumps, a substrate on which the first and second semiconductor chips are mounted in parallel with each other and which has a plurality of electrode pads directly connected to the first or second bumps in opposing relationship to the first or second bumps, and external terminals respectively connected to the electrode pads, a closed ring-shaped first sealing section which seals a space defined between the frame section and the substrate so as to surround arrangements of the plurality of first bumps, and a second sealing section which covers the first semiconductor chip, the second semiconductor chip and the first sealing section to seal them.
摘要翻译：加速度传感器芯片封装包括框架部分，对应于具有多个第一凸块的MEMS芯片的第一半导体芯片，具有多个第二凸块的第二半导体芯片，安装有第一和第二半导体芯片的基板彼此平行并且具有与第一或第二凸起相对的第一或第二凸块直接连接的多个电极焊盘以及分别连接到电极焊盘的外部端子，密封的环状的第一密封部分限定在所述框架部分和所述基板之间以围绕所述多个第一凸块的布置的空间;以及覆盖所述第一半导体芯片，所述第二半导体芯片和所述第一密封部分以将其密封的第二密封部。

62. 发明申请

US20050274541A1 Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder 失效
标题翻译：用于半导体器件的模块电路板，具有隔离I / O端子与焊料的障碍
公开(公告)号：US20050274541A1
公开(公告)日：2005-12-15
申请号：US10775232
申请日：2004-02-11
申请人： Norio Takahashi
发明人： Norio Takahashi
IPC分类号： H05K1/02 , H05K1/03 , H05K1/11 , H05K3/34 , H05K13/04
CPC分类号： H05K3/3452 , H05K1/117 , H05K13/0465 , H05K2201/0989 , H05K2201/09909 , H05K2203/0588
摘要： A module circuit board for a semiconductor device by a solder reflow process includes a plurality of pads on which the semiconductor device to be mounted, a plurality of terminals formed on a side edge of the board, a resist film covering an area between said pads and said terminal on the board, and a barrier formed between said pads and said terminals.
摘要翻译：用于通过焊料回流工艺的半导体器件的模块电路板包括多个焊盘，待安装的半导体器件，其上形成在板的侧边缘上的多个端子，覆盖所述焊盘之间的区域的抗蚀剂膜和板上的所述端子，以及形成在所述焊盘和所述端子之间的屏障。

63. 发明申请

US20050139985A1 Semiconductor chip package and multichip package 有权
标题翻译：半导体芯片封装和多芯片封装
公开(公告)号：US20050139985A1
公开(公告)日：2005-06-30
申请号：US10842486
申请日：2004-05-11
申请人： Norio Takahashi
发明人： Norio Takahashi
IPC分类号： H01L25/18 , H01L21/60 , H01L23/02 , H01L23/31 , H01L23/495 , H01L23/525 , H01L25/065 , H01L25/10 , H01L25/11
CPC分类号： H01L24/06 , H01L23/3128 , H01L23/49575 , H01L23/525 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/05553 , H01L2224/05624 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48235 , H01L2224/48247 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06541 , H01L2225/06555 , H01L2225/06562 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention provides a multichip package wherein a plurality of semiconductor chip packages (100) in each of which first electrode pads (16a) provided in a main surface of a semiconductor chip, and first bonding pads (20a) and first central bonding pads (18a) formed in an upper area of the main surface are respectively electrically connected by first redistribution wiring layers (24) in a one-to-one correspondence relationship, and second electrode pads (17b), and second bonding pads (22b) and second central bonding pads (18b) formed in an upper area of the main surface are respectively electrically connected by second redistribution wiring layers (26) in a one-to-one correspondence relationship, are stacked on one another.
摘要翻译：本发明提供一种多芯片封装，其中，在半导体芯片的主表面中设置有第一电极焊盘（16a）的多个半导体芯片封装（100）和第一焊盘（20a）和第一中心焊接形成在主表面的上部区域的焊盘（18A）分别以一一对应关系由第一再分配布线层（24）电连接，第二电极焊盘（17b）和第二焊盘（形成在主表面的上部区域的第二中心接合焊盘（18b）分别通过第二再分配布线层（26）以一对一对应关系彼此电连接。

64. 发明申请

US20050048259A1 Substrate frame 失效
标题翻译：基板框架
公开(公告)号：US20050048259A1
公开(公告)日：2005-03-03
申请号：US10911477
申请日：2004-08-05
申请人： Norio Takahashi
发明人： Norio Takahashi
IPC分类号： H01L23/12 , H01L23/498 , H05K3/00 , B32B3/10
CPC分类号： H05K3/0052 , H01L23/4985 , H01L24/48 , H01L24/73 , H01L2224/05554 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/10162 , H01L2924/15311 , H01L2924/181 , H05K3/0097 , H05K2201/09063 , H05K2201/09781 , H05K2201/2009 , H05K2203/1545 , Y10T29/49121 , Y10T29/4913 , Y10T29/49146 , Y10T428/24314 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A substrate frame includes an insulative board (10a) having a pair of ear portions (13) extending along its longitudinal edges; a plurality of wiring substrate regions (11) arranged on the insulative board (10a) between the ear portions (13) at predetermined intervals; and a plurality of slits (15) provided between the wiring substrate regions so as to extend across the ear portions (13) or a plurality grooves (18) around the wiring substrate regions (11).
摘要翻译：衬底框架包括具有沿其纵向边缘延伸的一对耳部（13）的绝缘板（10a）; 以预定间隔在所述耳部（13）之间布置在所述绝缘板（10a）上的多个布线基板区域（11）以及设置在所述布线基板区域之间以在所述布线基板区域（11）周围的所述耳部（13）或多个槽（18）延伸的多个狭缝（15）。

65. 发明申请

US20050021427A1 System and method for processing account data 有权
标题翻译：用于处理帐户数据的系统和方法
公开(公告)号：US20050021427A1
公开(公告)日：2005-01-27
申请号：US10752990
申请日：2004-01-08
申请人： Norio Takahashi , Toshiyuki Yamagishi , Taiki Sakata
发明人： Norio Takahashi , Toshiyuki Yamagishi , Taiki Sakata
IPC分类号： G06Q10/06 , G06F17/21 , G06Q10/00 , G06Q50/00 , G06F17/60
CPC分类号： G06Q40/02 , G06Q40/00 , G06Q40/12 , G06Q40/125
摘要： When inconsistency occurs between data presented from individual group enterprises, causes of the inconsistency cannot be specified easily in a conventional consolidated settlement processing method. In the embodiments of the invention, an XBRL conversion module converts inputted account data into data resulting from synthesis of standard data and extended data by using a mapping table and transmits the converted data to a data separation module. The data separation module separates the standard data and extended data of the received data and stores these types of data in corresponding storage tables while adding them with information for mutual relevancy. In this manner, when inconsistency occurs during a consolidated settlement process, causes of the inconsistency can be specified easily by acquiring the extended data.
摘要翻译：当个别集团企业提供的数据出现不一致时，常规合并结算处理方法不能轻易指定不一致的原因。在本发明的实施例中，XBRL转换模块通过使用映射表将输入的帐户数据转换为由标准数据和扩展数据的合成产生的数据，并将转换的数据发送到数据分离模块。数据分离模块将接收到的数据的标准数据和扩展数据进行分离，并将这些类型的数据存储在相应的存储表中，同时将它们添加到相互关联的信息中。以这种方式，当在合并结算过程中发生不一致时，通过获取扩展数据可以容易地指定不一致的原因。

66. 发明申请

US20050008849A1 Magneto-resistive device, and magnetic head, head suspension assembly and magnetic disk apparatus using magneto-resistive device 有权
标题翻译：磁阻装置，磁头，磁头悬挂装置和使用磁阻装置的磁盘装置
公开(公告)号：US20050008849A1
公开(公告)日：2005-01-13
申请号：US10880574
申请日：2004-07-01
申请人： Takeo Kagami , Takumi Uesugi , Satoshi Miura , Norio Takahashi
发明人： Takeo Kagami , Takumi Uesugi , Satoshi Miura , Norio Takahashi
IPC分类号： G11B5/39 , H01L43/08 , G11B5/17 , B32B5/16
CPC分类号： B82Y25/00 , B82Y10/00 , G11B5/3906 , G11B5/3909 , Y10T428/1114 , Y10T428/1121 , Y10T428/1143 , Y10T428/1164 , Y10T428/256
摘要： A magneto-resistive device is provided for contributing to a higher MR ratio and a reduced cleaning time for cleaning the surface of a cap layer. In the magneto-resistive device, a cap layer which serves as a protection layer is formed on a free layer which is the topmost layer of a magneto-resistive layer constituting a TMR devise. An upper electrode which is additionally used as an upper magnetic shield is electrically connected to the free layer through an upper metal layer. The cap layer comprised of a two-layer film made up of a conductive layer closer to the free layer and a topmost conductive layer. The conductive layer closer to the free layer is made of a material having higher oxygen bond energy than Ru, such as Zr, Hf, or the like. The topmost conductive layer is made of a material having lower oxygen bond energy, such as a noble metal or the like.
摘要翻译：提供了一种磁阻装置，用于有助于更高的MR比和减少的清洁时间以清洁盖层的表面。在磁阻装置中，作为保护层的盖层形成在作为构成TMR装置的磁阻层的最上层的自由层上。另外用作上磁屏蔽的上电极通过上金属层电连接到自由层。盖层由由更靠近自由层的导电层构成的双层膜和最上面的导电层组成。更靠近自由层的导电层由诸如Zr，Hf等的比Ru更高的氧键能的材料制成。最上面的导电层由具有较低氧键能的材料制成，例如贵金属等。

67. 发明授权

US06839205B2 Magneto-resistive device, and magnetic head and head suspension assembly using same 有权
标题翻译：磁阻元件，以及使用其的磁头和磁头悬挂组件
公开(公告)号：US06839205B2
公开(公告)日：2005-01-04
申请号：US10211366
申请日：2002-08-05
申请人： Takeo Kagami , Norio Takahashi , Takumi Uesugi
发明人： Takeo Kagami , Norio Takahashi , Takumi Uesugi
IPC分类号： G01R33/09 , G11B5/39 , G11B5/596 , H01L43/08 , G11B5/127
CPC分类号： B82Y25/00 , B82Y10/00 , G11B5/3903 , G11B5/59683 , G11B2005/3996 , H01L43/08
摘要： A magneto-resistive device has a magneto-resistive layer laminated between electrodes. The magneto-resistive layer has a non-magnetic layer, a pinned layer and a free layer sandwiching the non-magnetic layer, and a pin layer formed on the pinned layer on the opposite side to the free layer. The pin layer is formed in a region which substantially overlaps with an effective region in a film plane direction in which a current flows in a direction substantially perpendicular to the film plane between the electrodes in a predetermined thickness, and is formed in a region which does not substantially overlap with the effective region substantially in the same thickness as the predetermined thickness or in a thickness smaller than the predetermined thickness, continuous from the region which substantially overlaps with the effective region.

68. 发明授权

US06038882A Absorption chiller-heater and method for forming initial anticorrosive film therefor 有权
标题翻译：吸收式制冷机及其形成初始防腐膜的方法
公开(公告)号：US06038882A
公开(公告)日：2000-03-21
申请号：US177113
申请日：1998-10-22
申请人： Tetsuo Kuroda , Matsuho Miyasaka , Norio Takahashi
发明人： Tetsuo Kuroda , Matsuho Miyasaka , Norio Takahashi
IPC分类号： F25B15/00 , C09K5/04 , C23C22/40 , C23F11/18 , F25B15/06 , F25B47/00 , F25B41/00
CPC分类号： C09K5/047 , C23F11/185 , F25B15/06 , F25B47/003 , Y02B30/62 , Y02P20/124
摘要： An object of the present invention is to provide a method for forming an initial anticorrosive film in an absorption chiller-heater, by selecting optimal conditions of absorbent solution, steel material surface and film-forming operation for forming a good initial anticorrosive film. In the process for forming an initial anticorrosion film in an absorption chiller-heater having steel parts and containing an absorbent solution comprising lithium bromide as its main component and containing a lithium molybdate corrosion inhibitor according to the present invention, the main characteristics are that at least part of the steel parts of the absorption chiller-heater contacting with an absorbent solution at a temperature of higher than 100.degree. C. include a bare metal surface having an arithmetic mean surface roughness of not more than 1.0 .mu.m; the absorbent solution supplied comprises lithium bromide as its main component and contains a lithium molybdate corrosion inhibitor dissolved in the solution at a level of 450-750 ppm; and that an initial anticorrosion film forming operation is conducted at a condition such that amount of the lithium molybdate dissolved in the absorbent solution is maintained at not less than 200 ppm.
摘要翻译：本发明的目的是提供一种在吸收式冷却器加热器中形成初始防腐膜的方法，通过选择吸收剂溶液的最佳条件，钢材表面和用于形成良好的初始防腐蚀膜的成膜操作。在具有钢部件并含有以溴化锂为主要成分并含有本发明的钼酸锂腐蚀抑制剂的吸收剂溶液的吸收式制冷机中形成初始防腐蚀膜的方法中，主要特征是至少在高于100℃的温度下与吸收剂溶液接触的吸收式制冷机的一部分钢部件包括具有不大于1.0μm的算术平均表面粗糙度的裸金属表面; 提供的吸收剂溶液包括溴化锂作为其主要成分，并含有以450-750ppm的水平溶解在溶液中的钼酸锂腐蚀抑制剂; 并且在使溶解在吸收剂溶液中的钼酸锂的量保持在200ppm以上的条件下进行初始的防腐蚀成膜操作。

69. 发明授权

US5873476A Cap opening and closing mechanism 失效
标题翻译：盖开闭机构
公开(公告)号：US5873476A
公开(公告)日：1999-02-23
申请号：US986533
申请日：1997-12-08
申请人： Norio Takahashi , Yukio Ojima
发明人： Norio Takahashi , Yukio Ojima
IPC分类号： B65D43/26 , B65D47/08 , B65D43/16 , B65D51/18
CPC分类号： B65D47/0885 , B65D43/26 , B65D47/0857 , B65D2251/1075 , B65D2251/20
摘要： A cap includes a cap body attached to a discharge port portion of a container and having a pouring port through which a content of the container can be discharged, and a lid pivotally supported by the cap body and capable of opening and closing the pouring port. The cap is provided with: a pushing member whose intermediate portion is pivotally supported by a pivotally supporting portion on a side surface of the cap body, the pushing member being swingable about the pivotally supporting portion; and a thin-walled hinge for connecting an end portion of the pushing member and a rotatably supporting portion of the lid, the thin-walled hinge being adapted to convert swinging motion of the pushing member into motion for opening or closing the lid as an upper portion or a lower portion of the pushing member is operated by being pushed.
摘要翻译：帽包括附接到容器的排出口部分的帽体，并且具有可以排出容器的内容物的排出口和由帽体可枢转地支撑并能够打开和关闭倾倒口的盖。盖设有：推动构件，其中间部分由盖主体的侧表面上的枢轴支撑部枢转地支撑，推动构件围绕枢转支撑部摆动; 以及用于连接推动构件的端部和盖的可旋转地支撑部分的薄壁铰链，所述薄壁铰链适于将推动构件的摆动运动转换为运动以打开或关闭盖子作为上部推动构件的部分或下部通过被推动操作。

70. 发明授权

US5746338A Cap opening and closing mechanism 失效
公开(公告)号：US5746338A
公开(公告)日：1998-05-05
申请号：US538400
申请日：1995-10-03
申请人： Norio Takahashi , Yukio Ojima
发明人： Norio Takahashi , Yukio Ojima
IPC分类号： B65D43/26 , B65D47/08 , B65D43/16 , B65D51/18
CPC分类号： B65D47/0885 , B65D43/26 , B65D47/0857 , B65D2251/1075 , B65D2251/20
摘要： A cap includes a cap body attached to a discharge port portion of a container and having a pouring port through which a content of the container can be discharged, and a lid pivotally supported by the cap body and capable of opening and closing the pouring port. The cap is provided with: a pushing member whose intermediate portion is pivotally supported by a pivotally supporting portion on a side surface of the cap body, the pushing member being swingable about the pivotally supporting portion; and a thin-walled hinge for connecting an end portion of the pushing member and a rotatably supporting portion of the lid, the thin-walled hinge being adapted to convert swinging motion of the pushing member into motion for opening or closing the lid as an upper portion or a lower portion of the pushing member is operated by being pushed.

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