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61. 发明授权

US6015509A Composition containing a polymer and conductive filler and use thereof 失效
标题翻译：含有聚合物和导电填料的组合物及其用途
公开(公告)号：US6015509A
公开(公告)日：2000-01-18
申请号：US928495
申请日：1997-09-12
申请人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
发明人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
IPC分类号： C08G61/12 , C08L33/00 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/12 , H01B1/22 , H01B1/24 , H05K3/32 , H05K9/00 , H01B1/06
CPC分类号： H05K9/0083 , C08G61/12 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/125 , H01B1/127 , H01B1/128 , H01B1/22 , H01B1/24 , H05K3/321 , H05K9/0079 , H05K9/0088 , C08L33/00 , H05K2201/0329 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/31529 , Y10T428/31533 , Y10T428/31605 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721 , Y10T428/31725 , Y10T428/31855
摘要： A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substituted and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. Compositions of the present invention are useful as corrosion protecting layers for metal substrates, for electrostatic discharge protection, electromagnetic interference shielding, and as adhesives for interconnect technology as alternatives to solder interconnections. In addition, films of polyanilines are useful as corrosion protecting layers with or without the conductive metal particles.
摘要翻译：提供含有聚合物基质和导电填料组分的组合物。导电填料组分包括导电颗粒和选自取代和未取代的聚苯胺，取代和未取代的聚对亚苯基亚乙烯基，取代和未取代的聚噻吩，取代和未取代的聚吡嗪，取代和未取代的聚对苯二甲酸，取代和未取代的聚呋喃，取代和未取代的聚吡咯取代和未取代的聚硒吩，取代和未取代的聚对苯硫醚和取代和未取代的聚乙炔及其混合物，及其共聚物。本发明的组合物可用作金属基材的防腐层，用于静电放电保护，电磁干扰屏蔽，以及作为焊接互连替代物的互连技术的粘合剂。此外，聚苯胺的膜可用作具有或不具有导电金属颗粒的防腐蚀层。

62. 发明授权

US5985458A Housing for electromagnetic interference shielding 失效
标题翻译：外壳用于电磁干扰屏蔽
公开(公告)号：US5985458A
公开(公告)日：1999-11-16
申请号：US928464
申请日：1997-09-12
申请人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
发明人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
IPC分类号： C08G61/12 , C08L33/00 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/12 , H01B1/22 , H01B1/24 , H05K3/32 , H05K9/00 , B32B15/08
CPC分类号： H05K9/0083 , C08G61/12 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/125 , H01B1/127 , H01B1/128 , H01B1/22 , H01B1/24 , H05K3/321 , H05K9/0079 , H05K9/0088 , C08L33/00 , H05K2201/0329 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/31529 , Y10T428/31533 , Y10T428/31605 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721 , Y10T428/31725 , Y10T428/31855
摘要： A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substiututed and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. Compositions of the present invention are useful as corrosion protecting layers for metal substrates, for electrostatic discharge protection, electromagnetic interference shielding, and as adhesives for interconnect technology as alternatives to solder interconnections. In addition, films of polyanilines are useful as corrosion protecting layers with or without the conductive metal particles.
摘要翻译：提供含有聚合物基质和导电填料组分的组合物。导电填料组分包括导电颗粒和选自取代和未取代的聚苯胺，取代和未取代的聚对亚苯基亚乙烯基，取代和未取代的聚噻吩，取代和未取代的聚吡嗪，取代和未取代的聚对苯二甲酸，取代和未取代的聚呋喃，取代和未取代的聚吡咯取代和未取代的聚硒吩，取代和未取代的聚对苯硫醚和取代和未取代的聚乙炔，及其混合物，及其共聚物。本发明的组合物可用作金属基材的防腐层，用于静电放电保护，电磁干扰屏蔽，以及作为焊接互连替代物的互连技术的粘合剂。此外，聚苯胺的膜可用作具有或不具有导电金属颗粒的防腐蚀层。

63. 发明授权

US5919596A Toughened photosensitive polycyanurate resist, and structure made therefrom and process of making 失效
标题翻译：增韧光敏聚氰脲酸酯抗蚀剂及其制造方法及制造方法
公开(公告)号：US5919596A
公开(公告)日：1999-07-06
申请号：US798592
申请日：1997-02-11
申请人： Jeffrey C. Hedrick , Konstantinos Papathomas , Stephen L. Tisdale , Alfred Viehbeck , Jeffrey D. Gelorme , Voya Rista Markovich , Thomas H. Lewis , Stephen Joseph Fuerniss
发明人： Jeffrey C. Hedrick , Konstantinos Papathomas , Stephen L. Tisdale , Alfred Viehbeck , Jeffrey D. Gelorme , Voya Rista Markovich , Thomas H. Lewis , Stephen Joseph Fuerniss
IPC分类号： G03F7/027 , C08L79/00 , G03F7/029 , G03F7/38 , H01L21/027 , G03F7/26
CPC分类号： G03F7/38 , Y10S430/106
摘要： Disclosed is an admixture which is curable to form a crack resistant, photosensitive polycyanurate resist. Also disclosed is a structure for its use and process of making. The resist can be tailored to be either positively or negatively sensitive to actinic radiation. Because of its improved thermal and mechanical properties, the cured resist is suitable for use at high temperature, such as in electronic packaging applications.
摘要翻译：公开了一种可固化以形成耐裂纹的光敏聚氰化脲抗蚀剂的混合物。还公开了其使用和制造过程的结构。抗蚀剂可以被定制为对光化辐射是积极或消极敏感的。由于其热和机械性能的改善，固化的抗蚀剂适合在高温下使用，例如在电子封装应用中。

64. 发明授权

US5898991A Methods of fabrication of coaxial vias and magnetic devices 失效
标题翻译：同轴通孔和磁性器件的制造方法
公开(公告)号：US5898991A
公开(公告)日：1999-05-04
申请号：US783738
申请日：1997-01-16
申请人： Keith Edward Fogel , Jeffrey Curtis Hedrick , David Andrew Lewis , Eva E. Simonyi , Alfred Viehbeck , Stanley Joseph Whitehair
发明人： Keith Edward Fogel , Jeffrey Curtis Hedrick , David Andrew Lewis , Eva E. Simonyi , Alfred Viehbeck , Stanley Joseph Whitehair
IPC分类号： H01F27/28 , H01F41/04 , H05K3/40 , H05K3/44 , H01F7/06
CPC分类号： H01F41/046 , H01F27/2804 , H05K3/445 , H05K2201/09881 , H05K3/4046 , Y10T29/4902
摘要： Methods are described for fabricating devices having vias containing more than one electrical conductor, in particular coaxial electrical conductors. A plurality of wires are bonded to a first substrate, such as a copper wire to a copper substrate. A second substrate having through-holes with side walls covered with an electrical conductor is disposed over the first substrate so that the wires are within the through-holes and spaced apart from the side walls. The first substrate is spaced apart from the second substrate by dielectric spacers. A polymer is injected into the space between the first and second substrates to provide electrical isolation therebetween. A polymer is injected into the space in the via between the elongated conductors and the conductive sidewall to provide dielectric isolation therebetween. The second substrate has electrically conductive pattern on both sides which are electrically interconnected by the electrically conductive sidewall to form an inner coil of electrical conductors. The first substrate is patterned to form an electrical conductive pattern. A pattern of electrical conductors is formed on the dielectric material on the side of the second substrate opposite the patterned first substrate and is electrically connected therewith through the elongated conductors on the through-hole to form an outer coil of electrical conductors around the inner coil of electrical conductors to from a transformer or an inductor.
摘要翻译：描述了用于制造具有包含多于一个电导体，特别是同轴电导体的通孔的器件的方法。多根导线被接合到诸如铜线的第一基底到铜基底上。具有覆盖有电导体的侧壁的通孔的第二基板设置在第一基板上，使得电线在通孔内并与侧壁间隔开。第一衬底通过介电间隔物与第二衬底间隔开。将聚合物注入到第一和第二基板之间的空间中以在它们之间提供电隔离。将聚合物注入到细长导体和导电侧壁之间的通孔中的空间中，以在它们之间提供电介质隔离。第二衬底在两侧上具有导电图案，其通过导电侧壁电互连以形成电导体的内部线圈。图案化第一衬底以形成导电图案。在第二基板的与图案化的第一基板相对的一侧上的电介质材料上形成电导体的图案，并且通过通孔上的细长导体与其电连接，以形成围绕内部线圈的电导体的外部线圈电导体来自变压器或电感器。

65. 发明授权

US5861757A Dynamic solvent permittivity instrument 失效
标题翻译：动态溶剂介电仪
公开(公告)号：US5861757A
公开(公告)日：1999-01-19
申请号：US758123
申请日：1996-11-25
申请人： Gareth Geoffrey Hougham , Alfred Viehbeck , Stanley Joseph Whitehair
发明人： Gareth Geoffrey Hougham , Alfred Viehbeck , Stanley Joseph Whitehair
IPC分类号： G01N27/22 , G01N33/44 , G01N31/06
CPC分类号： G01N27/226 , G01N27/221 , G01N33/44
摘要： An instrument for measuring the dielectric constant of samples with complex or uncertain geometries that can include unusually shaped single sample pieces or collections of differently shaped sample pieces such as powders. The premise of the measurement technique is that a reference capacitor plate and a sample capacitor plate are exposed to a dynamically-changing solvent mixture. When the capacitance of these two fixtures become equal at the point at which a particular solvent mixture is reached, the dielectric constant of the sample is then known.
摘要翻译：用于测量具有复杂或不确定几何形状的样品的介电常数的仪器，其可以包括异常形状的单个样品片或不同形状的样品片（例如粉末）的集合。测量技术的前提是参考电容器板和样品电容器板暴露于动态变化的溶剂混合物。当这两种固定装置的电容在达到特定溶剂混合物的点变得相等时，样品的介电常数就是已知的。

66. 发明授权

US5800858A Method for conditioning halogenated polymeric materials and structures fabricated therewith 失效
公开(公告)号：US5800858A
公开(公告)日：1998-09-01
申请号：US711894
申请日：1996-09-12
申请人： Harry Randall Bickford , Peter J. Duke , Elizabeth Foster , Martin Goldberg , Voya Rista Markovich , Linda Matthew , Donald G. McBride , Terrence Robert O'Toole , Stephen Leo Tisdale , Alfred Viehbeck
发明人： Harry Randall Bickford , Peter J. Duke , Elizabeth Foster , Martin Goldberg , Voya Rista Markovich , Linda Matthew , Donald G. McBride , Terrence Robert O'Toole , Stephen Leo Tisdale , Alfred Viehbeck
IPC分类号： C08J3/24 , C23C18/20 , C23C18/28 , C25D5/56 , H05K1/03 , H05K3/18 , H05K3/38 , H05K3/42 , B05D5/12
CPC分类号： H05K3/422 , C23C18/208 , C23C18/2093 , C23C18/30 , C25D5/56 , H05K3/381 , H05K1/034 , H05K3/181 , Y10S428/901 , Y10T428/24273 , Y10T428/24322 , Y10T428/24339 , Y10T428/24802 , Y10T428/3154 , Y10T428/31544 , Y10T428/31678
摘要： A halogenated polymeric material is exposed to a reducing agent and/or an electrolyte and applied voltage to render exposed portions capable of being metallized and of being etched. The exposed portions can also be doped to thereby induce electrical conductivity therein. Also, new structures containing a free standing halogenated polymeric-containing layer and electrical conductive pattern thereon are provided.

67. 发明授权

US5730890A Method for conditioning halogenated polymeric materials and structures fabricated therewith 失效
标题翻译：用于调节卤化聚合物材料和用其制造的结构的方法
公开(公告)号：US5730890A
公开(公告)日：1998-03-24
申请号：US715376
申请日：1996-09-12
申请人： Harry Randall Bickford , Elizabeth Foster , Martin Goldberg , Voya Rista Markovich , Linda Matthew , Stephen Leo Tisdale , Alfred Viehbeck
发明人： Harry Randall Bickford , Elizabeth Foster , Martin Goldberg , Voya Rista Markovich , Linda Matthew , Stephen Leo Tisdale , Alfred Viehbeck
IPC分类号： C08J3/24 , C23C18/20 , C23C18/28 , C25D5/56 , H05K1/03 , H05K3/18 , H05K3/38 , H05K3/42 , B44C1/22
CPC分类号： H05K3/422 , C23C18/208 , C23C18/2093 , C23C18/30 , C25D5/56 , H05K3/381 , H05K1/034 , H05K3/181 , Y10S428/901 , Y10T428/24273 , Y10T428/24322 , Y10T428/24339 , Y10T428/24802 , Y10T428/3154 , Y10T428/31544 , Y10T428/31678
摘要： A halogenated polymeric material is exposed to a reducing agent and/or an electrolyte and applied voltage to render exposed portions capable of being metallized and of being etched. The exposed portions can also be doped to thereby induce electrical conductivity therein. Also, new structures containing a free standing halogenated polymeric-containing layer and electrical conductive pattern thereon are provided.
摘要翻译：将卤化聚合物材料暴露于还原剂和/或电解质和施加的电压以使得能够被金属化并被蚀刻的暴露部分。暴露部分也可以被掺杂从而在其中诱导电导率。此外，提供了含有独立卤代聚合物层和在其上的导电图案的新结构。

68. 发明授权

US5599582A Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
标题翻译：多层包装中的粘合层和有机材料作为金属扩散屏障
公开(公告)号：US5599582A
公开(公告)日：1997-02-04
申请号：US475412
申请日：1995-06-07
申请人： Eleftherios Adamopoulos , Jungihl Kim , Kang-Wook Lee , Tae S. Oh , Terrence R. O'Toole , Sampath Purushothaman , John J. Ritsko , Jane M. Shaw , Alfred Viehbeck , George F. Walker
发明人： Eleftherios Adamopoulos , Jungihl Kim , Kang-Wook Lee , Tae S. Oh , Terrence R. O'Toole , Sampath Purushothaman , John J. Ritsko , Jane M. Shaw , Alfred Viehbeck , George F. Walker
IPC分类号： B32B7/10 , B32B15/08 , B32B15/088 , B32B27/00 , C08G73/00 , C08G73/10 , H01B3/30 , H01L21/52 , H05K1/03 , H05K3/46 , B05D5/10
CPC分类号： C08G73/1089 , C08G73/1003 , C08G73/1007 , C08G73/101 , H01B3/306 , Y10S428/901 , Y10T428/24917 , Y10T428/31721
摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate. A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.
摘要翻译：本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层的末端不饱和粘合聚酰亚胺和聚酰亚胺。在另一个实施方案中，制品具有粘附到金属基底或诸如集成电路的电路部件的至少一个粘合聚酰亚胺层，或用于在电路中形成电连接的装置，例如电路上的金属管道或布线网络嵌入在陶瓷和/或聚合物基材内。还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物 - 铜界面的铜扩散阻挡层。

69. 发明授权

US5591285A Fluorinated carbon polymer composites 失效
标题翻译：氟化碳聚合物复合材料
公开(公告)号：US5591285A
公开(公告)日：1997-01-07
申请号：US475670
申请日：1995-07-24
申请人： Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
IPC分类号： C08J7/00 , C08K3/04 , C08K9/02 , H01B3/30 , H01L21/312 , H05K1/03 , H05K3/10 , B32B31/28 , B32B27/16
CPC分类号： H05K1/0373 , C08K3/04 , C08K9/02 , H05K1/0346 , H05K2201/0154 , H05K2201/0239 , H05K2201/0323 , H05K2201/068 , H05K3/105 , Y10T428/31544
摘要： Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns.The composite can be made conductive by irradiating it with an UV excimer laser.
摘要翻译：公开了包含分散在聚合物中的氟化颗粒碳的复合物的结构，氟化碳的存在量足以降低组合物的介电常数，该结构还包括电导体图案。可以通过用UV准分子激光器照射该复合材料来导电。

70. 发明授权

US5536921A System for applying microware energy in processing sheet like materials 失效
标题翻译：将微软件的能量应用于加工板材的系统
公开(公告)号：US5536921A
公开(公告)日：1996-07-16
申请号：US548262
申请日：1995-10-25
申请人： Jeffrey C. Hedrick , David A. Lewis , Jane M. Shaw , Alfred Viehbeck , Stanley J. Whitehair
发明人： Jeffrey C. Hedrick , David A. Lewis , Jane M. Shaw , Alfred Viehbeck , Stanley J. Whitehair
IPC分类号： H05B6/80 , H05B6/62 , H05B6/78
CPC分类号： H05B6/788
摘要： A microwave processing system is provided wherein the material to be processed is in the form of a web type quantity configuration with a thickness that is small in relation to the wavelength of a particular microwave frequency. The material is passed through the field associated with a plurality of microwave standing waves of the particular frequency, each adjacent standing wave being offset 1/4 wavelength along the direction of movement of the web. A carrier gas removes volatile solvents from the material surfaces. Control is provided for the interrelationship of temperature, rate of movement, flow of carrier gas, and microwave power.
摘要翻译：提供了一种微波处理系统，其中待处理的材料是相对于特定微波频率的波长具有较小厚度的幅材类型数量构型的形式。材料通过与特定频率的多个微波驻波相关联的场，每个相邻驻波沿着幅材的移动方向偏移1/4波长。载气从材料表面除去挥发性溶剂。提供温度，运动速率，载气流量和微波功率的相互关系的控制。

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