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61. 发明授权

US07832461B2 Cooling systems and methods 有权
标题翻译：冷却系统和方法
公开(公告)号：US07832461B2
公开(公告)日：2010-11-16
申请号：US11673410
申请日：2007-02-09
申请人： Christian L. Belady , Vance Murakami , Robert Allen Pereira
发明人： Christian L. Belady , Vance Murakami , Robert Allen Pereira
IPC分类号： F28F7/00
CPC分类号： H05K7/20836 , F25B41/003 , F25B2500/06 , G06F1/20 , H05K7/20609
摘要： An exemplary cooling method may comprise thermally coupling a network of cooling lines to each of a plurality of heat exchangers in a cooling system. The method may also comprise providing a first connection from a network of cooling lines to a first fluid source and a second connection from the network of cooling lines to an optional second fluid source. The method may also comprise delivering cooling fluid through the network of cooling lines to each of the plurality of heat exchangers whether the network of cooling lines is connected only to the first fluid source or to both the first and second fluid sources.
摘要翻译：示例性的冷却方法可以包括将冷却管网络热耦合到冷却系统中的多个热交换器中的每一个。该方法还可以包括提供从冷却管网到第一流体源的第一连接以及从冷却管网到任选的第二流体源的第二连接。该方法还可以包括将冷却流体网络输送到多个热交换器中的每个热交换器，无论冷却管线网络是仅连接到第一流体源，还是连接到第一和第二流体源。

62. 发明授权

US07821792B2 Cell board interconnection architecture 有权
标题翻译：电池板互连架构
公开(公告)号：US07821792B2
公开(公告)日：2010-10-26
申请号：US11932153
申请日：2007-10-31
申请人： Christian L. Belady , Eric Peterson
发明人： Christian L. Belady , Eric Peterson
IPC分类号： H05K5/00 , H05K7/00 , H05K1/14 , H05K1/00
CPC分类号： H05K7/20718 , H05K1/14 , H05K7/1445 , H05K7/1492 , H05K2201/044 , H05K2201/064
摘要： According to at least one embodiment, a cell board interconnection architecture comprises an interconnection structure for interconnecting a plurality of cell boards, the interconnection structure configured to allow air to pass therethrough in a direction in which the cell boards couple therewith.
摘要翻译：根据至少一个实施例，单元板互连架构包括用于互连多个单元板的互连结构，所述互连结构被配置为允许空气沿单元板与其耦合的方向通过。

63. 发明申请

US20100223085A1 MODULARIZATION OF DATA CENTER FUNCTIONS 有权
标题翻译：数据中心功能的模块化
公开(公告)号：US20100223085A1
公开(公告)日：2010-09-02
申请号：US12395556
申请日：2009-02-27
申请人： David Thomas Gauthier , Scott Thomas Seaton , Allan Joseph Wenzel , Cheerei Cheng , Brian Clark Andersen , Daniel Gerard Costello , Christian L. Belady , Jens Conrad Housley , Brian Jon Mattson , Stephan W. Gilges , Kenneth Allen Lundgren
发明人： David Thomas Gauthier , Scott Thomas Seaton , Allan Joseph Wenzel , Cheerei Cheng , Brian Clark Andersen , Daniel Gerard Costello , Christian L. Belady , Jens Conrad Housley , Brian Jon Mattson , Stephan W. Gilges , Kenneth Allen Lundgren
IPC分类号： G06Q50/00 , G06F1/28 , G05D23/19 , G06F1/30 , G06Q10/00 , A62C39/00
CPC分类号： H05K7/20781 , G06F1/182 , G06F1/189 , G06F1/30 , H02J9/061 , H05K7/1492 , H05K7/1495 , H05K7/1497 , H05K7/2079 , Y10T29/49002
摘要： In one example, a data center may be built in modular components that may be pre-manufactured and separately deployable. Each modular component may provide functionality such as server capacity, cooling capacity, fire protection, resistance to electrical failure. Some components may be added to the data center by connecting them to the center's utility spine, and others may be added by connecting them to other components. The spine itself may be a modular component, so that spine capacity can be expanded or contracted by adding or removing spine modules. The various components may implement functions that are part of standards for various levels of reliability for data centers. Thus, the reliability level that a data center meets may be increased or decreased to fit the circumstances by adding or removing components.
摘要翻译：在一个示例中，数据中心可以内置在可以被预先制造并可单独部署的模块化组件中。每个模块化组件可以提供诸如服务器容量，冷却能力，防火，电气故障的功能。一些组件可以通过将它们连接到中心的实用程序脊来添加到数据中心，并且可以通过将其连接到其他组件来添加其他组件。脊柱本身可以是模块化部件，因此通过添加或移除脊柱模块可以扩展或收缩脊柱的能力。各种组件可以实现作为数据中心的各种可靠性级别的标准的一部分的功能。因此，可以通过添加或删除组件来增加或减少数据中心满足的可靠性水平以适应这种情况。

64. 发明授权

US07773385B2 Computer server receiving a plurality of different power supply modules 有权
标题翻译：计算机服务器接收多个不同的电源模块
公开(公告)号：US07773385B2
公开(公告)日：2010-08-10
申请号：US11191368
申请日：2005-07-27
申请人： Christian L. Belady
发明人： Christian L. Belady
IPC分类号： H05K7/16
CPC分类号： G06F1/189 , H05K7/1492
摘要： A computer server is configured to electrically and mechanically couple with a plurality of different power modules. These power modules are interchangeable, and all fit within the form factor of the server, eliminating the use of PDUs within the server rack. The server may be configured in the factory or in the field to use either the single-phase AC power configuration, the 3-phase AC power configuration, or any other power configuration, such as DC, desired.
摘要翻译：计算机服务器被配置为与多个不同的功率模块电气和机械耦合。这些电源模块是可互换的，并且都符合服务器的外形尺寸，无需在服务器机架中使用PDU。服务器可以在工厂或现场进行配置，以使用单相交流电源配置，三相交流电源配置或任何其他电源配置，如所需的DC。

65. 发明申请

US20090254763A1 MANAGEMENT OF POWER-EFFICIENT DATA CENTER 有权
标题翻译：功率有效数据中心的管理
公开(公告)号：US20090254763A1
公开(公告)日：2009-10-08
申请号：US12060876
申请日：2008-04-02
申请人： Christian L. Belady , James R. Hamilton , Sean M. James
发明人： Christian L. Belady , James R. Hamilton , Sean M. James
IPC分类号： G06F1/00
CPC分类号： G06F1/206 , H05K7/1497 , H05K7/1498 , H05K7/20745 , H05K7/20836 , Y02D10/16
摘要： An illustrative power-efficient data center is described for operating in an uncontrolled environment in one scenario. The data center includes an air moving system that applies unconditioned air to resource items. The resource items are stripped down to provide a substantially minimum set of components for performing the data center'core functions. Various illustrative techniques for managing a power-efficient data center are also described.
摘要翻译：描述了一种说明性的功率效率数据中心，用于在一种情况下在不受控制的环境中运行。数据中心包括一个空中移动系统，将无条件的空气应用于其资源项目。资源项被删除以提供用于执行数据中心的核心功能的基本上最小的组件集合。还描述了用于管理功率效率数据中心的各种说明性技术。

66. 发明授权

US07499281B2 Multi-chip module with power system 有权
标题翻译：带电源系统的多芯片模块
公开(公告)号：US07499281B2
公开(公告)日：2009-03-03
申请号：US11968520
申请日：2008-01-02
申请人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady
发明人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K1/141 , H01L23/433 , H01L23/467 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
摘要翻译：实施例包括具有电力系统的多芯片模块的装置，方法和系统。示例性电子模块包括具有存储器和多个处理器的印刷电路板（PCB）。电力系统耦合到并垂直放置在PCB上方。散热装置设置在电力系统和PCB之间，用于通过来自电力系统和多个处理器的直接热交换来散热。

67. 发明申请

US20080270691A1 DYNAMIC STORAGE BASED ON PERFORMANCE THROTTLING 有权
标题翻译：基于性能曲线的动态存储
公开(公告)号：US20080270691A1
公开(公告)日：2008-10-30
申请号：US11742094
申请日：2007-04-30
申请人： Christian L. Belady
发明人： Christian L. Belady
IPC分类号： G06F12/06
CPC分类号： G11B33/144 , G06F1/20 , G06F1/206 , G06F3/0614 , G06F3/0625 , G06F3/0646 , G06F3/0689 , G11B33/128 , G11B33/142 , Y02D10/154
摘要： A system and method for dynamic storage based on performance throttling. The method comprises providing an array of storage devices coupled to a computing device. The method comprises determining a status of a system condition, such as ambient temperature. The method comprises throttling the operating speed of one or more storage devices in the array based on the status of the system condition. The method comprises determining relative frequency of access to data to be stored by the computing device in the array of storage devices. The method comprises optimizing storage of data by the computing device in the array of storage devices based at least in part on 1) relative frequency of access to data and 2) which of the one or more storage devices are throttled.
摘要翻译：一种基于性能调节的动态存储系统和方法。该方法包括提供耦合到计算设备的存储设备阵列。该方法包括确定诸如环境温度的系统状况的状态。该方法包括基于系统状态的状态来调节阵列中的一个或多个存储设备的操作速度。该方法包括确定存储设备阵列中计算设备要存储的数据的相对频率。该方法包括至少部分地基于1）对数据的访问的相对频率和2）限制所述一个或多个存储设备中的哪一个来优化存储设备阵列中的计算设备对数据的存储。

68. 发明申请

US20080047694A1 Heat transfer apparatus and methods 审中-公开
标题翻译：传热装置及方法
公开(公告)号：US20080047694A1
公开(公告)日：2008-02-28
申请号：US11511054
申请日：2006-08-27
申请人： Andrew D. Delano , Christian L. Belady
发明人： Andrew D. Delano , Christian L. Belady
IPC分类号： F28D15/00 , B29C47/88 , H05K7/20
CPC分类号： F28F3/12 , F28D15/00 , F28F3/022 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Liquid heat exchangers and methods for removing heat from a central processing unit. An exemplary heat exchanger comprises a body having an open cavity whose periphery is sealable to the central processing unit from which heat is to be removed, a cooling liquid inlet port coupled through the body to the open cavity, and a liquid outlet port coupled through the body to the open cavity. Cooling liquid is pumped through the cavity when the body is sealed to the central processing unit, thereby contacting the central processing unit and removing heat from the central processing unit. A plurality of heat conducting elements may be provided that extend from an inner surface of the body into the open cavity, at least some of which have a length that is operative to contact the central processing unit. The heat conducting elements allow convective cooling of the central processing unit.
摘要翻译：液体热交换器和从中央处理单元去除热量的方法。示例性的热交换器包括具有开放空腔的主体，其外围可以密封到中央处理单元，中心处理单元将从其中除去热量，通过主体连接到开放空腔的冷却液入口和通过身体到开放的腔。当主体被密封到中央处理单元时，冷却液体被泵送通过空腔，从而接触中央处理单元并从中央处理单元去除热量。可以提供多个导热元件，其从主体的内表面延伸到开放空腔中，其中至少一些导热元件的长度可操作以接触中央处理单元。导热元件允许中央处理单元的对流冷却。

69. 发明授权

US07336490B2 Multi-chip module with power system 有权
标题翻译：带电源系统的多芯片模块
公开(公告)号：US07336490B2
公开(公告)日：2008-02-26
申请号：US10996721
申请日：2004-11-24
申请人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady
发明人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady
IPC分类号： H05K7/20 , F28F7/00 , F28D15/00
CPC分类号： H05K1/141 , H01L23/433 , H01L23/467 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
摘要翻译：实施例包括具有电力系统的多芯片模块的装置，方法和系统。示例性电子模块包括具有存储器和多个处理器的印刷电路板（PCB）。电力系统耦合到并垂直放置在PCB上方。散热装置设置在电力系统和PCB之间，用于通过来自电力系统和多个处理器的直接热交换来散热。

70. 发明授权

US07254027B2 Processor module for system board 有权
标题翻译：系统板处理器模块
公开(公告)号：US07254027B2
公开(公告)日：2007-08-07
申请号：US11021504
申请日：2004-12-21
申请人： Christian L. Belady , Gary W. Williams , Shaun L. Harris , Steven A. Belson , Eric C. Peterson
发明人： Christian L. Belady , Gary W. Williams , Shaun L. Harris , Steven A. Belson , Eric C. Peterson
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H05K1/0203 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/0061 , H05K2201/045 , H05K2201/064 , H05K2201/09054 , H05K2201/10189 , H05K2201/1056 , H05K2201/10689 , H05K2203/1572
摘要： Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to the system board. The first portion connects to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device dissipates heat, via a heat exchange, from the processor. The second portion is disposed in a space created between the first portion and the system board. The second portion has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.
摘要翻译：实施例包括用于系统板的处理器模块的装置，方法和系统。在一个实施例中，具有第一和第二部分的电子模块可拆卸地连接到系统板。第一部分连接到系统板，并且包括散热装置和印刷电路板（PCB），处理器连接到PCB的第一侧。散热装置通过热交换从处理器散热。第二部分设置在第一部分和系统板之间产生的空间中。第二部分具有用于向处理器提供电力的电力系统板。电源系统板相邻并平行于PCB的第二侧延伸。

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