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61. 发明授权

US08194406B2 Apparatus and method with forced coolant vapor movement for facilitating two-phase cooling of an electronic device 有权
标题翻译：具有强制冷却剂蒸汽运动的装置和方法，用于促进电子装置的两相冷却
公开(公告)号：US08194406B2
公开(公告)日：2012-06-05
申请号：US12565175
申请日：2009-09-23
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20827
摘要： Apparatus and method are provided for two-phase dielectric cooling of an electronic device. The apparatus includes a coolant flow path, a vapor condenser and one or more vapor fans. The coolant flow path is in fluid communication with the electronic device, where liquid dielectric coolant within the flow path vaporizes upon contacting the electronic device, forming dielectric coolant vapor, and thereby facilitating cooling of the electronic device. The vapor condenser is also in fluid communication with the coolant flow path and facilitates condensate formation from the dielectric coolant vapor. The one or more vapor fans are disposed within the flow path to actively move dielectric coolant vapor into contact with the vapor condenser, and thereby enhance cooling of the electronic device by facilitating coolant condensate formation and thus recirculation of the coolant condensate as liquid dielectric coolant.
摘要翻译：提供了用于电子设备的两相电介质冷却的装置和方法。该装置包括冷却剂流路，蒸汽冷凝器和一个或多个蒸气风扇。冷却剂流动路径与电子设备流体连通，其中流动路径内的液体电介质冷却剂在接触电子设备时蒸发，形成电介质冷却剂蒸汽，从而便于电子设备的冷却。蒸汽冷凝器还与冷却剂流动路径流体连通，并且有助于从电介质冷却剂蒸气形成冷凝物。一个或多个蒸汽风扇设置在流动路径内以主动地移动介质冷却剂蒸汽与蒸汽冷凝器接触，从而通过促进冷却剂冷凝物的形成并因此使冷却剂冷凝物作为液体电介质冷却剂再循环来增强电子设备的冷却。

62. 发明授权

US08184436B2 Liquid-cooled electronics rack with immersion-cooled electronic subsystems 失效
标题翻译：液冷电子机架，带有浸没式电子子系统
公开(公告)号：US08184436B2
公开(公告)日：2012-05-22
申请号：US12825781
申请日：2010-06-29
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： H05K7/20809
摘要： Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vapor-condensing heat exchanger to condense dielectric fluid vapor egressing from the immersion-cooled electronic subsystems; a dielectric fluid vapor return coupling in fluid communication the vapor outlets of the immersion-cooled electronic subsystems and the vapor-condensing heat exchanger; a reservoir for holding dielectric fluid; a gravity drain line coupled to drain dielectric fluid condensate from the vapor-condensing heat exchanger to the reservoir; an immersed, sub-cooling heat exchanger disposed within the reservoir; a dielectric fluid supply manifold coupling in fluid communication the reservoir and the dielectric fluid inlets of the immersion-cooled electronic subsystems; and a pump for supplying under pressure dielectric fluid from the reservoir to the dielectric fluid supply manifold for maintaining dielectric fluid in a liquid state within the immersion-cooled electronic subsystems.
摘要翻译：提供液冷电子机架，包括：浸入式冷却电子子系统; 蒸气冷凝热交换器，用于冷凝从浸没冷却的电子子系统排出的介质流体蒸气; 介电流体蒸汽返回联接器，其使浸没冷却的电子子系统的蒸汽出口和蒸汽冷凝热交换器流体连通; 用于保持介电流体的储存器; 重力排放管线，其耦合以将介电流体冷凝物从所述蒸汽冷凝热交换器排出到所述储存器; 设置在储存器内的浸没式次冷热交换器; 介质流体供应歧管联接以使浸没冷却的电子子系统的储存器和电介质流体入口流体连通; 以及用于将压力介质流体从储存器供应到介电流体供应歧管的泵，用于将浸没冷却的电子子系统内的介质流体保持在液态。

63. 发明授权

US07961475B2 Apparatus and method for facilitating immersion-cooling of an electronic subsystem 有权
标题翻译：用于促进电子子系统的浸入冷却的装置和方法
公开(公告)号：US07961475B2
公开(公告)日：2011-06-14
申请号：US12256618
申请日：2008-10-23
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Vinod Kamath , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Vinod Kamath , Robert E. Simons
IPC分类号： H05K1/00 , H05K7/20 , H05K5/00 , H01R13/40 , H02B1/01 , F28F7/00 , F25D23/12
CPC分类号： H05K7/20772 , H01L2924/0002 , H01L2924/00
摘要： Apparatus and method are provided for facilitating immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a hermetically sealed electrical connector disposed on a wall of the container. The electrical connector is sized and configured to receive an electrical and network connector of the electronic subsystem when the electronic subsystem is operatively inserted into the container, and to facilitate external electrical and network coupling to the subsystem. The apparatus further includes coolant inlet and outlet ports coupled to the container for facilitating ingress and egress of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant flows through the container, the electronic subsystem is immersion-cooled by the coolant.
摘要翻译：提供了一种装置和方法，用于促进具有要浸没冷却的多种不同类型组件的电子子系统的浸入式冷却。该装置包括一个容纳电子子系统的容器，以及一个设置在容器壁上的气密密封电连接器。电连接器的尺寸和构造被设计成当电子子系统可操作地插入容器中时接收电子子系统的电气和网络连接器，并且便于外部电气和网络耦合到子系统。该装置还包括联接到容器的冷却剂入口和出口，用于促进冷却剂通过容器的进入和流出。当电子子系统可操作地插入容器并且冷却剂流过容器时，电子子系统被冷却剂浸没冷却。

64. 发明授权

US07907406B1 System and method for standby mode cooling of a liquid-cooled electronics rack 失效
标题翻译：液冷电子机架待机模式冷却的系统和方法
公开(公告)号：US07907406B1
公开(公告)日：2011-03-15
申请号：US12567954
申请日：2009-09-28
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/2079 , H05K7/202 , H05K7/20609
摘要： System and method are provided for cooling an electronics rack. A modular cooling unit (MCU) is associated with the rack to provide system coolant to an electronics subsystem and a bulk power assembly. The MCU includes a liquid-to-liquid heat exchanger, and defines portions of facility and system coolant loops. Chilled coolant from a facility source is passed through the liquid-to-liquid heat exchanger to cool system coolant flowing through the system coolant loop. The system also includes an air-to-liquid heat exchanger in fluid communication with the system coolant loop, a pump in fluid communication with the system coolant loop, and a controller. The controller controls operation of the pump to adjust flow of system coolant through the system coolant loop dependent upon a mode of operation. In a standby mode, system coolant flows through the air-to-liquid heat exchanger at a lower flow rate, and expels heat to ambient air.
摘要翻译：提供了系统和方法来冷却电子机架。模块化冷却单元（MCU）与机架相关联，以向电子子系统和大容量电源组件提供系统冷却剂。 MCU包括液 - 液热交换器，并且限定设备和系统冷却剂回路的部分。来自设备源的冷冻冷却剂通过液体 - 液体热交换器以冷却流过系统冷却剂回路的系统冷却剂。该系统还包括与系统冷却剂回路流体连通的空气 - 液体热交换器，与系统冷却剂回路流体连通的泵和控制器。控制器控制泵的操作，以根据操作模式来调节通过系统冷却剂回路的系统冷却剂流动。在备用模式下，系统冷却剂以较低的流量流过空气对液体热交换器，并将热量排放到周围空气。

65. 发明申请

US20100147490A1 APPARATUS AND METHOD FOR PROVIDING IN SITU COOLING OF COMPUTER DATA CENTERS DURING SERVICE CALLS 失效
标题翻译：计算机数据中心在服务呼叫期间提供现场冷却的装置和方法
公开(公告)号：US20100147490A1
公开(公告)日：2010-06-17
申请号：US12332656
申请日：2008-12-11
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： F28F7/00
CPC分类号： H05K7/20736 , H05K7/2079
摘要： An apparatus and method for cooling electronic components housed in a computer rack while performing maintenance operations is provided. The apparatus, in one embodiment, comprises a heat exchange assembly disposed within an outlet door cover of the computer rack, having one or more perforations. One or more air moving device(s) are also disposed on the outlet door and activated by an activator when the door is opened such that the devices when activated force hot air into the heat exchanger. Cool air is then exhausted through a planar containment plate having a plurality of edges. The plate is secured to top of the outlet door along one of its edges.
摘要翻译：提供一种用于在执行维护操作时冷却容纳在计算机机架中的电子部件的装置和方法。在一个实施例中，该装置包括设置在计算机机架的出口门盖内的热交换组件，其具有一个或多个穿孔。当门打开时，一个或多个空气移动装置也设置在出口门上并由致动器启动，使得装置在被激活时迫使热空气进入热交换器。冷空气然后通过具有多个边缘的平面容纳板排出。板沿其一个边缘固定在出口门的顶部。

66. 发明申请

US20100146996A1 DATA CENTER COOLING ENERGY RECOVERY SYSTEM 审中-公开
标题翻译：数据中心冷却能源回收系统
公开(公告)号：US20100146996A1
公开(公告)日：2010-06-17
申请号：US12332708
申请日：2008-12-11
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： F25D15/00 , F25B39/02
CPC分类号： F25B27/02 , F02G2254/00 , H05K7/2079
摘要： A method and associated system is provided for cooling of a data center. The method includes providing coolant to multiple cooling elements in the data center using a heat pump refrigeration cycle to cool the coolant and provide a high temperature at the condenser. This allows the reclaiming of at least a portion of the heat removed from the refrigeration cycle using a heat engine. The engine is disposed between the refrigeration condenser and the ambient environment or cooling medium.
摘要翻译：提供了一种用于冷却数据中心的方法和相关系统。该方法包括使用热泵制冷循环向数据中心中的多个冷却元件提供冷却剂以冷却冷却剂并在冷凝器处提供高温。这允许使用热引擎回收从制冷循环中去除的热量的至少一部分。发动机设置在制冷冷凝器和周围环境或冷却介质之间。

67. 发明授权

US08955346B2 Coolant-buffered, vapor-compression refrigeration apparatus and method with controlled coolant heat load 有权
标题翻译：冷却剂缓冲，蒸气压缩制冷装置和控制冷却剂热负荷的方法
公开(公告)号：US08955346B2
公开(公告)日：2015-02-17
申请号：US12939546
申请日：2010-11-04
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： F25D23/12 , F25B49/02 , F25B25/00 , H05K7/20
CPC分类号： F25B49/02 , F25B25/005 , F25B2400/01 , F25B2400/06 , F25B2500/28 , F25B2600/13 , F25B2700/21171 , H05K7/20809 , H05K7/20836 , Y02B30/745
摘要： Apparatus and method are provided for cooling an electronic component. The apparatus includes a coolant-cooled structure in thermal communication with the component(s) to be cooled, and a coolant-to-refrigerant heat exchanger coupled in fluid communication with the coolant-cooled structure via a coolant loop to receive coolant from and supply coolant to the coolant-cooled structure. The apparatus further includes a refrigerant loop coupled in fluid communication with the coolant-to-refrigerant heat exchanger, and the heat exchanger cools coolant passing therethrough by dissipating heat from the coolant in the coolant loop to refrigerant in the refrigerant loop. A controllable coolant heater is associated with the coolant loop for providing an adjustable heat load on the coolant in the coolant loop to ensure at least a minimum heat load is dissipated from the coolant to the refrigerant passing through the heat exchanger.
摘要翻译：提供了用于冷却电子部件的装置和方法。该装置包括与要冷却的部件热连通的冷却剂冷却结构，以及通过冷却剂回路与冷却剂冷却结构流体连通地连接以冷却和供应的冷却剂与制冷剂热交换器冷却剂冷却剂冷却结构。该装置还包括与冷却剂 - 制冷剂热交换器流体连通的制冷剂回路，并且热交换器通过从冷却剂回路中的冷却剂向制冷剂回路中的制冷剂散热而冷却通过其中的冷却剂。可控制的冷却剂加热器与冷却剂回路相关联，以在冷却剂回路中的冷却剂上提供可调整的热负荷，以确保至少最小的热负荷从冷却剂消耗到通过热交换器的制冷剂。

68. 发明授权

US08369091B2 Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack 有权
标题翻译：用于电子机架的电子子系统的交错式浸入式冷却装置和方法
公开(公告)号：US08369091B2
公开(公告)日：2013-02-05
申请号：US12825761
申请日：2010-06-29
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： F28F3/04 , F28D2021/0031 , F28F3/12 , G06F1/20 , G06F2200/201 , H05K7/20236 , H05K7/20827
摘要： Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment so that the electronic subsystem is immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment. The condenser fins facilitate cooling and condensing of dielectric fluid vapor generated within the sealed compartment. Within the sealed compartment, multiple thermally conductive condenser fins are interleaved with multiple electronic components immersed within the dielectric fluid to facilitate localized cooling and condensing of dielectric fluid vapor between the multiple electronic components.
摘要翻译：提供冷却装置和方法用于电子机架的电子子系统的浸没冷却。冷却装置包括至少部分围绕电子子系统和形成密封隔室的壳体，以及设置在密封隔间内的电介质流体，使得电子子系统浸没在电介质流体内。提供了液体冷却的蒸汽冷凝器，其包括在密封隔室内延伸的多个导热冷凝器翅片。冷凝器翅片促进在密封隔室内产生的介电流体蒸气的冷却和冷凝。在密封隔室内，多个导热冷凝器翅片与浸没在电介质流体内的多个电子部件交错，以便于多个电子部件之间的介电流体蒸气的局部冷却和冷凝。

69. 发明授权

US08322154B2 Control of system coolant to facilitate two-phase heat transfer in a multi-evaporator cooling system 有权
标题翻译：控制系统冷却液，以便于多蒸发器冷却系统中的两相热传递
公开(公告)号：US08322154B2
公开(公告)日：2012-12-04
申请号：US12556031
申请日：2009-09-09
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： F25B5/02 , F25D17/02 , F28D15/02
CPC分类号： H05K7/20381 , F28D15/0266 , F28D15/06
摘要： A cooling system and method are provided for facilitating two-phase heat transfer from an electronics system including a plurality of electronic devices to be cooled. The cooling system includes a plurality of evaporators coupled to the electronic devices, and a coolant loop for passing system coolant through the evaporators. The coolant loop includes a plurality of coolant branches coupled in parallel, with each coolant branch being coupled in fluid communication with a respective evaporator. The cooling system further includes a control unit for maintaining pressure of system coolant at a system coolant supply side of the coolant branches within a specific pressure range at or above saturation pressure of the system coolant for a given desired saturation temperature of system coolant into the evaporators to facilitate two-phase heat transfer in the plurality of evaporators from the electronic devices to the system coolant at the given desired saturation temperature.
摘要翻译：提供了一种冷却系统和方法，用于促进包括要冷却的多个电子设备的电子系统的两相热传递。冷却系统包括耦合到电子设备的多个蒸发器和用于使系统冷却剂通过蒸发器的冷却剂回路。冷却剂回路包括并联联接的多个冷却剂分支，每个冷却剂分支与相应的蒸发器流体连通地联接。冷却系统还包括一个控制单元，用于在系统冷却剂进入蒸发器的给定期望饱和温度下，在系统冷却剂的饱和压力或更高的特定压力范围内，保持冷却剂分支的系统冷却剂供应侧的系统冷却剂的压力。以促进在给定的所需饱和温度下从电子装置到系统冷却剂的多个蒸发器中的两相热传递。

70. 发明授权

US08208258B2 System and method for facilitating parallel cooling of liquid-cooled electronics racks 失效
标题翻译：用于促进液冷电子机架并联冷却的系统和方法
公开(公告)号：US08208258B2
公开(公告)日：2012-06-26
申请号：US12556053
申请日：2009-09-09
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/2079
摘要： A cooling system and method are provided for facilitating cooling of multiple liquid-cooled electronics racks. The cooling system includes a main system coolant supply loop with a plurality of system coolant supply branch lines for facilitating supply of cooled system coolant to the electronics racks, and a main system coolant return loop with a plurality of system coolant return branch lines for facilitating return of exhausted system coolant from the electronics racks. When operational, cooled system coolant circulates through the coolant supply loop and exhausted system coolant circulates through the coolant return loop. A plurality of modular cooling units are coupled to the coolant supply loop and coolant return loop. Each modular cooling unit includes a heat exchanger to facilitate cooling of a portion of the exhausted coolant circulating through the main system coolant return loop for return as cooled system coolant to the main system coolant supply loop.
摘要翻译：提供了一种用于促进多个液冷电子机架的冷却的冷却系统和方法。冷却系统包括主系统冷却剂供应回路，其具有多个系统冷却剂供应分支管线，以便于将冷却的系统冷却剂供应到电子机架，以及具有多个系统冷却剂返回分支管线以便于返回的主系统冷却剂回流回路从电子机架排出的系统冷却液。冷却系统冷却剂在运行时循环通过冷却剂供应回路，排气系统冷却剂循环通过冷却液回流回路。多个模块化冷却单元联接到冷却剂供应回路和冷却剂回流回路。每个模块化冷却单元包括热交换器，以便于冷却循环通过主系统冷却剂回流回路的排出冷却剂的一部分，以便作为冷却系统冷却剂返回到主系统冷却剂供应回路。

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