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    • 63. 发明公开
    • REDUCING PLASMA IGNITION PRESSURE
    • 降低等离子点火压力
    • EP1765541A2
    • 2007-03-28
    • EP05761079.2
    • 2005-06-14
    • LAM RESEARCH CORPORATION
    • WIEPKING, MarkLYNDAKER, Bradford JKUTHI, AndrasFISCHER, Andreas
    • B23K9/00B23K9/02
    • H01J37/32009H01J37/32082H01J37/32706
    • A method in a plasma processing system for processing a semiconductor substrate is disclosed. The plasma processing system includes a plasma processing chamber and an electrostatic chuck coupled to a bias compensation circuit. The method includes igniting a plasma in a plasma ignition step. Plasma ignition step is performed while a first bias compensation voltage provided by the bias compensation circuit to the chuck is substantially zero and while a first chamber pressure within the plasma processing chamber is below about 90 mTorr. The method further includes processing the substrate in a substrate-processing step after the plasma is ignited. The substrate-processing step employs a second bias compensation voltage provided by the bias compensation circuit that is higher than the first bias compensation voltage and a second chamber pressure substantially equal to the first chamber pressure.
    • 公开了一种用于处理半导体衬底的等离子体处理系统中的方法。 等离子体处理系统包括等离子体处理室和耦合到偏置补偿电路的静电吸盘。 该方法包括在等离子体点火步骤中点燃等离子体。 等离子体点火步骤在由偏置补偿电路提供给卡盘的第一偏置补偿电压基本为零并且等离子体处理室内的第一室压低于约90毫托时执行。 该方法还包括在等离子体被点燃之后在衬底处理步骤中处理衬底。 衬底处理步骤采用由偏置补偿电路提供的高于第一偏置补偿电压的第二偏置补偿电压以及基本上等于第一室压力的第二室压力。
    • 67. 发明授权
    • Plasma processing system and method for delivering RF power to a plasma processing chamber
    • 用于等离子处理腔室的RF电源的等离子体处理装置和方法
    • EP1190437B1
    • 2007-08-22
    • EP00948512.9
    • 2000-06-15
    • LAM RESEARCH CORPORATION
    • FISCHER, AndreasKADKHODAYAN, BabakKUTHI, Andras
    • H01J37/32
    • H01J37/32174H01J37/32082H01J37/32577
    • The present invention provides a plasma processing apparatus, system, and method for providing RF power to a plasma processing chamber. The plasma processing system (300) includes an RF generator (310), a plasma chamber (304), a match network box (308), a first cable (314), a second cable (316), and means for electrically isolating (312) the match network box. The RF generator generates RF power for transmission to the plasma chamber. The plasma chamber receives the RF power for processing the wafer (302) and is characterized by an internal impedance during the plasma processing. The plasma chamber has one or more walls (344) for returning RF currents. The match network box is capable of receiving the RF currents and generates an impedance that matches the internal impedance of the plasma chamber to the impedance of the RF generator. The first cable is coupled between the RF generator and the match network box for transmitting RF power between the RF generator and the match network box. The second cable is coupled between the match network box and the plasma chamber for transmitting RF power between the match network and the plasma chamber. The second cable provides a return path for an RF return current from the plasma chamber to the match network box. The electrically isolating means electrically isolates the match network box from electrical contacts with the plasma chamber such that only the second cable provides the return path for the RF return current from the plasma chamber to the match network box.