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61. 发明授权

US07375330B2 Charged particle beam equipment 有权
标题翻译：带电粒子束设备
公开(公告)号：US07375330B2
公开(公告)日：2008-05-20
申请号：US11396654
申请日：2006-04-04
申请人： Hiromi Inada , Hiroyuki Tanaka , Shun-ichi Watanabe , Shigeto Isakozawa , Mitsugu Sato , Atsushi Takane , Satoshi Yamaguchi
发明人： Hiromi Inada , Hiroyuki Tanaka , Shun-ichi Watanabe , Shigeto Isakozawa , Mitsugu Sato , Atsushi Takane , Satoshi Yamaguchi
IPC分类号： G01N23/00
CPC分类号： H01J37/28 , H01J37/222 , H01J37/265 , H01J2237/15 , H01J2237/2487 , H01J2237/2826
摘要： Charged particle beam equipment has a processing unit for calibrating dimension values of an enlarged specimen image, and means for changing the amount by which a charged particle beam is scanned. Also, a specimen stand has a mechanism for holding a specimen having a periodical structure or a specimen simultaneously having a periodical structure and a non-periodica structure, and a storage device for automatically changing a magnification for an enlarged specimen image, and storing measured values at all magnifications.
摘要翻译：带电粒子束设备具有用于校准放大的标本图像的尺寸值的处理单元和用于改变扫描带电粒子束的量的装置。此外，试样台具有用于保持具有周期性结构的试样或同时具有周期性结构和非周期性结构的试样的机构，以及用于自动改变放大的试样图像的倍率的存储装置，并存储测量值在所有放大倍率。

62. 发明授权

US07301047B2 Salt suitable for an acid generator and a chemically amplified resist composition containing the same 有权
标题翻译：适用于酸产生剂的盐和含有它的化学放大抗蚀剂组合物
公开(公告)号：US07301047B2
公开(公告)日：2007-11-27
申请号：US11586640
申请日：2006-10-26
申请人： Isao Yoshida , Yukako Harada , Satoshi Yamaguchi
发明人： Isao Yoshida , Yukako Harada , Satoshi Yamaguchi
IPC分类号： C07C69/00
CPC分类号： C07C381/12 , C07C25/18 , C07C309/17 , C07C2601/14 , C07C2602/42 , C07D333/46 , G03F7/0045 , G03F7/0046 , G03F7/0395 , G03F7/0397
摘要： The present invention provides a salt of the formula (I): wherein ring X represents monocyclic or bicyclic hydrocarbon group having 3 to 30 carbon atoms, and one or more hydrogen atom in the ring X is optionally substituted with alkyl group having 1 to 6 carbon atoms, alkenyl group having 2 to 6 carbon atoms, alkoxy group having 2 to 6 carbon atoms or perfluoroalkyl group having 1 to 4 carbon atoms; Q1 and Q2 each independently represent fluorine atom or perfluoroalkyl group having 1 to 6 carbon atoms; A+ represents organic counter ion; and n shows an integer of 1 to 12. The present invention also provides a chemically amplified resist composition comprising the salt of the formula (I).
摘要翻译：本发明提供式（I）的盐：其中环X表示具有3-30个碳原子的单环或双环烃基，并且环X中的一个或多个氢原子任选被具有1至6个碳原子的烷基取代碳原子数2〜6的烯基，碳原子数2〜6的烷氧基或碳原子数1〜4的全氟烷基; Q 1和Q 2各自独立地表示氟原子或具有1至6个碳原子的全氟烷基; A ^{+ 代表有机抗衡离子; 并且n表示1至12的整数。本发明还提供包含式（I）的盐的化学放大抗蚀剂组合物。}

63. 发明授权

US07276673B2 Solder bonding method and solder bonding device 有权
标题翻译：焊接方法和焊接接合装置
公开(公告)号：US07276673B2
公开(公告)日：2007-10-02
申请号：US10947294
申请日：2004-09-23
申请人： Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
发明人： Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
IPC分类号： B23K26/00
CPC分类号： H05K3/3494 , B23K1/0056 , H01L2224/11003 , H01L2224/742 , H05K3/3442 , H05K2203/041 , H05K2203/107
摘要： A solder bonding method and a solder bonding device are provided, in which solder is melted, and heating of electrode portions is performed by irradiating laser light to an inner side of a region where electrodes portions are provided, making the temperature difference between the electrode portions and the melted solder smaller to improve the wettability of the solder and increase bonding reliability. The solder bonding method and the solder bonding device perform bonding of the electrode portions that are formed on an object to be bonded by melting the solder. After supplying the solder onto the electrode portions before melting, a laser is irradiated to the solder and to the electrode portions in the periphery of the solder. The solder melts, and the electrode portions are heated. The wettability of the solder with respect to the electrode portions thus improves, and the reliability of an electrical connection between the electrode portions can be increased.
摘要翻译：提供焊料接合方法和焊接接合装置，其中焊料熔化，并且通过向设置有电极部分的区域的内侧照射激光来进行电极部分的加热，使得电极部分之间的温度差并且熔化的焊料更小以改善焊料的润湿性并增加焊接可靠性。焊接接合方法和焊接接合装置通过熔化焊料进行形成在待接合物体上的电极部分的接合。在熔融之前将焊料供应到电极部分之后，激光照射到焊料和焊料周围的电极部分。焊料熔化，电极部分被加热。因此焊料相对于电极部的润湿性提高，可以提高电极部之间的电连接的可靠性。

64. 发明授权

US07164097B2 Solder ball bonding method and bonding device 有权
标题翻译：焊球接合方法和接合装置
公开(公告)号：US07164097B2
公开(公告)日：2007-01-16
申请号：US10936747
申请日：2004-09-09
申请人： Osamu Shindo , Toru Mizuno , Youichi Andoh , Satoshi Yamaguchi
发明人： Osamu Shindo , Toru Mizuno , Youichi Andoh , Satoshi Yamaguchi
IPC分类号： B23K1/005
CPC分类号： B23K1/0056 , B23K1/0016 , B23K3/0623 , B23K2101/36 , H01L2224/11003 , H01L2224/11334 , H01L2224/742 , H05K3/3442 , H05K3/3478 , H05K3/3494 , H05K2203/0195 , H05K2203/041 , H05K2203/082 , H05K2203/107
摘要： Provided are a solder ball bonding method and a solder ball bonding device for performing bonding of a plurality of electrode portions formed on objects to be bonded by melting solder balls. The solder balls are suctioned by using a plurality of suction nozzles that follow the electrode portions of the objects to be bonded, and conveyed onto the electrode portions. A laser irradiation portion that is positioned above the suction nozzles is then moved in a direction along which the suction nozzles are arranged, while the solder balls are irradiated with laser light passing through suction openings of the suction nozzles by using the laser irradiation portion. Accordingly, it is possible to melt the plurality of solder balls on the electrode portions by using only a single laser irradiation portion.
摘要翻译：提供了一种焊球接合方法和焊球接合装置，用于通过熔化焊球进行形成在待接合物体上的多个电极部分的接合。通过使用跟随待接合物体的电极部分的多个吸嘴来吸引焊球，并将其输送到电极部分上。然后，在吸引喷嘴上方的激光照射部分沿吸引喷嘴排列的方向移动，同时通过使用激光照射部分通过吸嘴的吸入口的激光照射焊球。因此，可以仅使用单个激光照射部来熔化电极部上的多个焊球。

65. 发明授权

US07128255B2 Magnetic head, and device and method for manufacturing the same 失效
公开(公告)号：US07128255B2
公开(公告)日：2006-10-31
申请号：US10445027
申请日：2003-05-27
申请人： Toru Mizuno , Kouji Tanaka , Satoshi Yamaguchi
发明人： Toru Mizuno , Kouji Tanaka , Satoshi Yamaguchi
IPC分类号： B23K1/06
CPC分类号： G11B5/4853 , G11B5/4826 , Y10T29/49027 , Y10T29/4903
摘要： The present invention provides a magnetic head construction, a connection method and a connecting device by which excellent electrical connection can be carried out between a core electrode and a substrate land face on a flexure in a magnetic head employing the piggy back system. In order to attain the object of interest, in the present invention, a fine adjustment actuator is arranged between a core and a flexure; a projection portion which is projected from the fine adjustment actuator when viewed from the flexure is provided in the core; a hole is provided in the position, on the flexure, corresponding to the projection portion; only the core is fixed by a support portion provided through the hole portion and a clamp pin without applying any load to the fine adjustment actuator; and while maintaining this fixing state, an electrode and a substrate land are bonded to each other with a wire.

66. 发明申请

US20060232890A1 Method of head stack assembly flexible circuit assembly attached to an actuator arm 失效
公开(公告)号：US20060232890A1
公开(公告)日：2006-10-19
申请号：US11454599
申请日：2006-06-16
申请人： Yiu Sing Ho , Hiroshi Fukaya , Kam Fung Yip , Satoshi Yamaguchi , Jeffery Wang , Can Hua Chen
发明人： Yiu Sing Ho , Hiroshi Fukaya , Kam Fung Yip , Satoshi Yamaguchi , Jeffery Wang , Can Hua Chen
IPC分类号： H05K1/00
CPC分类号： G11B5/4853 , G11B5/4846 , G11B5/486 , H05K1/189 , H05K3/0061 , H05K3/328 , H05K3/3447 , H05K2201/10303 , Y10T29/49025
摘要： A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.

67. 发明授权

US07104051B2 Exhaust gas purification device 失效
标题翻译：废气净化装置
公开(公告)号：US07104051B2
公开(公告)日：2006-09-12
申请号：US10715820
申请日：2003-11-19
申请人： Yuichi Shimasaki , Satoshi Yamaguchi
发明人： Yuichi Shimasaki , Satoshi Yamaguchi
IPC分类号： F01N3/00
CPC分类号： F02D41/029 , F01N3/0253 , F01N3/027 , F01N9/002 , F01N13/009 , F01N2560/025 , F01N2560/06 , F01N2560/08 , F02B37/00 , F02D41/405 , F02D2041/1418 , Y02T10/47
摘要： The invention provides an exhaust gas purification device that can prevent deterioration of the emission during a regeneration process for a particular filter for trapping particulates contained in the exhaust gas.Particulate filter regeneration timing determining unit estimates the amount of particulates trapped by the particulate filter to determine the filter regeneration timing based on the estimated particular amount. In response to the regeneration timing determination, heating unit heats the particulate filter to raise an exhaust gas temperature, so that a particulate filter regeneration process starts. At this time, intake air amount reducing unit reduces the intake air amount to raise the exhaust gas temperature while combustion maintaining unit controls the combustion in the internal-combustion engine so as to be maintained in a desired condition.
摘要翻译：本发明提供了一种排气净化装置，其可以防止用于特定过滤器的再生过程中的发射劣化，以捕获包含在排气中的微粒。颗粒过滤器再生定时确定单元估计微粒过滤器捕获的微粒的量，以基于估计的特定量确定过滤器再生定时。响应于再生时间确定，加热单元加热颗粒过滤器以提高排气温度，从而开始颗粒过滤器再生过程。此时，进气量减少单元减少进气量以提高排气温度，同时燃烧保持单元控制内燃机中的燃烧，从而保持在期望的状态。

68. 发明申请

US20060108400A1 Soldering method and apparatus 审中-公开
标题翻译：焊接方法和装置
公开(公告)号：US20060108400A1
公开(公告)日：2006-05-25
申请号：US11274420
申请日：2005-11-16
申请人： Hiroshi Fukaya , Satoshi Yamaguchi
发明人： Hiroshi Fukaya , Satoshi Yamaguchi
IPC分类号： B23K31/02 , B23K35/24
CPC分类号： B23K1/0056 , B23K35/3013 , B23K2101/40 , H05K3/3442 , H05K3/3494 , H05K2201/10727 , H05K2203/107 , H05K2203/1476 , Y02P70/613
摘要： It is to provide a soldering method and apparatus, which can achieve highly reliable soldering while suppressing damages to a component to be soldered. There is provided a method for soldering an electronic component to a substrate, which comprises a first heating step for heating the entire solder junction area, and a second heating step for heating a part of the solder junction area, which is distant from the electronic component.
摘要翻译：提供焊接方法和装置，其可以实现高可靠性焊接，同时抑制对要焊接的部件的损坏。提供了一种将电子部件焊接到基板上的方法，其包括用于加热整个焊接区域的第一加热步骤和用于加热远离电子部件的焊接区域的一部分的第二加热步骤。

69. 发明授权

US06951463B2 Dental and oralogic composition 有权
标题翻译：牙科和口头组成
公开(公告)号：US06951463B2
公开(公告)日：2005-10-04
申请号：US09728121
申请日：2000-12-04
申请人： Eiichi Masuhara , Yoshinori Kadoma , Junichi Yamauchi , Koichi Okada , Satoshi Yamaguchi
发明人： Eiichi Masuhara , Yoshinori Kadoma , Junichi Yamauchi , Koichi Okada , Satoshi Yamaguchi
IPC分类号： A61K6/02 , A61K6/083 , A61C15/00 , A61C5/00 , A61K7/18 , A61K7/20
CPC分类号： A61K6/0017 , A61K6/007
摘要： The first embodiment of present invention provides a composition, which includes:(a) a photocatalytic titanium oxide or a photocatalytic titanium oxide precursor;(b) at least one selected from the group including: a silicon compound having the following formula (I): wherein X1, X2, X3 and X4 each independently represent an alkoxy group or a halogen atom, a hydrolyzate of the silicon compound (I), a silicone resin, silicone resin precursor and silica; and (c) a liquid medium. Another embodiment of the present invention provides a dental and oralogic composition, that includes a photocatalytic titanium oxide or a photocatalytic titanium oxide precursor. Another embodiment of the present invention provides a dental and oralogic composition, that includes a photocatalytic titanium oxide or a photocatalytic titanium oxide precursor, and a liquid medium. The composition of the present invention is particularly suitable in dental and oral care, and other embodiments of the present invention provide methods of making and using the above-described compositions.
摘要翻译：本发明的第一个实施方案提供一种组合物，其包括：（a）光催化氧化钛或光催化氧化钛前体; （b）选自下列的至少一种：包括具有下式（I）的硅化合物：其中X 1，X 2，X 3， / O 4和X 4各自独立地表示烷氧基或卤素原子，硅化合物（I）的水解产物，有机硅树脂，有机硅树脂前体和二氧化硅; 和（c）液体介质。本发明的另一个实施方案提供了一种牙科和口腔学组合物，其包括光催化氧化钛或光催化氧化钛前体。本发明的另一个实施方案提供了一种牙科和口腔学组合物，其包括光催化氧化钛或光催化氧化钛前体和液体介质。本发明的组合物特别适用于牙科和口腔护理，本发明的其它实施方案提供制备和使用上述组合物的方法。

70. 发明申请

US20050117254A1 Suspension holder pallet 有权
标题翻译：悬架托盘
公开(公告)号：US20050117254A1
公开(公告)日：2005-06-02
申请号：US10997901
申请日：2004-11-29
申请人： Kazuaki Takanuki , Osamu Shindo , Akimasa Nakao , Satoshi Yamaguchi
发明人： Kazuaki Takanuki , Osamu Shindo , Akimasa Nakao , Satoshi Yamaguchi
IPC分类号： G11B21/21 , G11B3/00 , G11B5/48 , G11B5/60 , G11B23/107
CPC分类号： G11B23/107 , G11B5/40 , G11B5/4813 , G11B5/54 , G11B21/22
摘要： A pallet main body is provided with a block holding member which presses a positioning surface of an actuator block against a block reference surface formed in the pallet main body, and a movable arm. An insertion member, which can be inserted between a plurality of opposing suspensions, is formed at a distal end of the movable arm. As a suspension to which a slider is to be attached contacts a first contact surface formed on the side in contact with this suspension, a distal end of the suspension to which the slider is to be attached is held at a prescribed height from the block reference surface, thereby forming a gap between this suspension and a suspension opposed to this suspension.
摘要翻译：托盘主体设置有将致动器块的定位表面压靠在形成在托盘主体中的块基准面的块保持构件和可动臂上。可插入在多个相对悬架之间的插入构件形成在可动臂的远端。作为待附接滑块的悬架，接触形成在与该悬架接触的一侧上的第一接触表面，滑块将被附接到的悬架的远端保持在与块参考相关的规定高度从而在该悬浮液与悬浮液相对的悬浮液之间形成间隙。

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