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61. 发明授权

US09024424B2 Stacked electronic component and manufacturing method thereof 有权
公开(公告)号：US09024424B2
公开(公告)日：2015-05-05
申请号：US13586914
申请日：2012-08-16
申请人： Atsushi Yoshimura , Naoyuki Komuta , Hideo Numata
发明人： Atsushi Yoshimura , Naoyuki Komuta , Hideo Numata
IPC分类号： H01L23/02 , H01L23/48 , H01L23/52 , H01L29/40 , H01L25/065 , H01L25/03 , H01L23/495
CPC分类号： H01L25/0657 , H01L23/3107 , H01L23/49575 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed.

62. 发明申请

US20120306103A1 STACKED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 有权
标题翻译：堆叠式电子元件及其制造方法
公开(公告)号：US20120306103A1
公开(公告)日：2012-12-06
申请号：US13586914
申请日：2012-08-16
申请人： Atsushi Yoshimura , Naoyuki Komuta , Hideo Numata
发明人： Atsushi Yoshimura , Naoyuki Komuta , Hideo Numata
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L23/3107 , H01L23/49575 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed.
摘要翻译：堆叠的电子部件包括经由第一粘合剂层粘附在基板上的第一电子部件和通过使用第二粘合层粘附的第二电子部件。第二粘合剂层具有由相同材料形成且具有不同弹性模量的两层结构。双层结构的第二粘合剂层具有设置在第一电子部件侧的第一层和设置在第二电子部件侧的第二层。第一层在粘合剂温度下软化或熔化。第二层在粘合剂温度下保持层状。根据堆叠的电子元件，可以防止绝缘故障和短路的发生，并且还可以抑制电子部件之间的剥离故障，制造成本的增加等。

63. 发明授权

US07255493B2 Optical semiconductor module and its manufacturing method 有权
标题翻译：光半导体模块及其制造方法
公开(公告)号：US07255493B2
公开(公告)日：2007-08-14
申请号：US11442276
申请日：2006-05-30
申请人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
发明人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
IPC分类号： G02B6/36
CPC分类号： G02B6/4249 , G02B6/423
摘要： An optical semiconductor module comprises an optical transmission channel including a waveguide transmitting a light beam, a holding member whose holding member holds the channel with the end of the channel being exposed from the surface, electric wiring formed on the surface, an optical semiconductor element, mounted above the surface, including an active area to emit or receive a light beam and an electrode pad electrically connected to the electric wiring, the active area optically coupled to the waveguide at the end of the channel, and an electrical insulation film between the optical semiconductor element and the holding member, including openings each corresponding to an electrical connection between the electrode pad and the electric wiring, and an optically coupling portion between the active area and the waveguide, the electrical insulation film being in contact with a portion of the end of the channel.
摘要翻译：光学半导体模块包括：光传输通道，其包括透射光束的波导;保持部件，其保持部件保持沟道的端部从表面露出，形成在表面上的电布线，光学半导体元件，安装在所述表面上方，包括发射或接收光束的有源区域和电连接到所述电线路的电极焊盘，所述有源区域在所述通道的端部处光耦合到所述波导，以及在所述光学器件之间的电绝缘膜半导体元件和保持构件，包括各自对应于电极焊盘和电布线之间的电连接的开口以及有源区域和波导之间的光学耦合部分，电绝缘膜与端部的一部分接触的频道。

64. 发明申请

US20060215969A1 Optical semiconductor module and its manufacturing method 有权
公开(公告)号：US20060215969A1
公开(公告)日：2006-09-28
申请号：US11442276
申请日：2006-05-30
申请人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
发明人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
IPC分类号： G02B6/36
CPC分类号： G02B6/4249 , G02B6/423
摘要： An optical semiconductor module comprises an optical transmission channel including a waveguide transmitting a light beam, a holding member whose holding member holds the channel with the end of the channel being exposed from the surface, electric wiring formed on the surface, an optical semiconductor element, mounted above the surface, including an active area to emit or receive a light beam and an electrode pad electrically connected to the electric wiring, the active area optically coupled to the waveguide at the end of the channel, and an electrical insulation film between the optical semiconductor element and the holding member, including openings each corresponding to an electrical connection between the electrode pad and the electric wiring, and an optically coupling portion between the active area and the waveguide, the electrical insulation film being in contact with a portion of the end of the channel.

65. 发明申请

US20060055050A1 Semiconductor device and manufacturing method thereof 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：US20060055050A1
公开(公告)日：2006-03-16
申请号：US11221762
申请日：2005-09-09
申请人： Hideo Numata , Hirokazu Ezawa , Chiaki Takubo , Kenji Takahashi , Hideo Aoki , Susumu Harada , Hisashi Kaneko , Hiroshi Ikenoue , Mie Matsuo , Ichiro Omura
发明人： Hideo Numata , Hirokazu Ezawa , Chiaki Takubo , Kenji Takahashi , Hideo Aoki , Susumu Harada , Hisashi Kaneko , Hiroshi Ikenoue , Mie Matsuo , Ichiro Omura
IPC分类号： H01L23/48
CPC分类号： H01L25/50 , H01L21/76898 , H01L23/481 , H01L25/0657 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05147 , H01L2224/05569 , H01L2224/13025 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H01L2924/15311 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device comprises a semiconductor substrate having an through hole, a first insulation resin layer formed on an inner surface of the through hole, a second insulation resin layer formed on at least one of front and rear surfaces of the semiconductor substrate, and a first conductor layer formed in the through hole to connect at least both front and rear surfaces of the semiconductor substrate and insulated from the inner surface of the through hole with the first insulation resin layer. A second conductor layer (wiring pattern) which is electrically connected to the first conductor layer in the through hole is further provided on the second insulation resin layer. The conductor layer formed in the through hole and constituting a connecting plug has a high insulation reliability. Therefore, a semiconductor device suitable for a multi-chip package and the like can be obtained. Further, since the forming ability of the conductor layer connecting the front and rear surfaces and the insulation layer is high, the manufacturing cost can be reduced.
摘要翻译：半导体器件包括具有通孔的半导体衬底，形成在通孔的内表面上的第一绝缘树脂层，形成在半导体衬底的前后表面中的至少一个上的第二绝缘树脂层，以及第一绝缘树脂层形成在所述通孔中的导体层至少连接半导体衬底的前表面和后表面，并与所述通孔的内表面与所述第一绝缘树脂层绝缘。在第二绝缘树脂层上还设置有与通孔中的第一导体层电连接的第二导体层（布线图案）。形成在通孔中并构成连接插头的导体层具有高的绝缘可靠性。因此，可以获得适合于多芯片封装等的半导体器件。此外，由于连接前后表面和绝缘层的导体层的形成能力高，所以可以降低制造成本。

66. 发明申请

US20060045434A1 Optical semiconductor module and semiconductor device including the same 失效
标题翻译：光半导体模块及其半导体装置
公开(公告)号：US20060045434A1
公开(公告)日：2006-03-02
申请号：US11200045
申请日：2005-08-10
申请人： Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： G02B6/36
CPC分类号： G02B6/3644 , G02B6/3652 , G02B6/4201 , G02B6/4253 , G02B6/4255 , G02B6/428 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/1305 , H01L2924/15311 , H05K1/0274 , H01L2924/00 , H01L2224/0401
摘要： An optical semiconductor module comprises a guide which has a positioning portion for an optical transmission line, an optical semiconductor mounting surface from which one end face of the optical transmission line disposed in the positioning portion is exposed, and a wiring layer formed on the optical semiconductor mounting surface. An optical semiconductor element is mounted on the optical semiconductor mounting surface of the guide, with a light-emitting surface or a light-receiving surface thereof facing the one. end face of the optical transmission line, and is electrically connected to the wiring layer.
摘要翻译：光学半导体模块包括具有用于光传输线路的定位部分的引导件，设置在定位部分中的光传输线的一个端面从该半导体安装表面露出的光学半导体安装表面和形成在光学半导体上的布线层安装面。光学半导体元件安装在引导件的光学半导体安装表面上，其发光表面或其光接收表面面向一个。并且与导线层电连接。

67. 发明授权

US06774011B2 Chip pickup device and method of manufacturing semiconductor device 失效
标题翻译：芯片拾取装置及半导体装置的制造方法
公开(公告)号：US06774011B2
公开(公告)日：2004-08-10
申请号：US09920628
申请日：2001-08-03
申请人： Takahito Nakazawa , Tetsuya Kurosawa , Hideo Numata , Shinya Takyu
发明人： Takahito Nakazawa , Tetsuya Kurosawa , Hideo Numata , Shinya Takyu
IPC分类号： H01L2146
CPC分类号： H01L21/67276 , H01L21/67132 , H01L2221/68318
摘要： A pickup device comprises a thrusting mechanism, a carrying mechanism and a controller. The thrusting mechanism is configured to thrust the chips sequentially by using pins from a back side of the adhesive tape with the adhesive tape between the chips and the pins so as to peel the chips off the adhesive tape. The carrying mechanism is configured to sequentially absorb the chips with use of a collet, hold the chips to be absorbed until the chips are peeled off the adhesive tape, thereafter pick the chips up by ascending the collet in order to be carried the chips to a subsequent process stage. The controller is configured to controlling the thrust of the chip by thrusting mechanism, the controller control an ascend time and a descend time of the pins, and keeping a predetermined period of a time when the pins arrive at their peak.
摘要翻译：拾取装置包括推压机构，承载机构和控制器。推力机构构造成通过使用来自胶带的背面的销从而将芯片顺序地推出，并且将芯片与销之间的粘合带剥离，从而将芯片从胶带剥离。携带机构被配置为使用夹头顺序地吸收芯片，保持待吸收的芯片直到芯片从胶带剥离，然后通过升高夹头来拾取芯片，以将芯片运送到后续流程阶段。控制器被配置为通过推压机构控制芯片的推力，控制器控制销的上升时间和下降时间，并且当销到达其峰值时保持预定的一段时间。

68. 发明授权

US4511819A Electrode connections for a piezoelectric sensor 失效
标题翻译：压电传感器的电极连接
公开(公告)号：US4511819A
公开(公告)日：1985-04-16
申请号：US534915
申请日：1983-09-22
申请人： Naoki Matsubara , Hideo Numata
发明人： Naoki Matsubara , Hideo Numata
IPC分类号： G01F1/00 , G01F1/32 , G01L1/16 , H01L41/08 , H01L41/113
CPC分类号： H01L41/1132 , G01L1/16 , H01L41/08
摘要： A piezoelectric sensor for measuring an external force is disclosed which is accommodated in a cassette through a sealing member and provided with a pair of electrodes which are respectively bonded to opposite sides of a piezoelectric element. A masking strip made of a highly insulative material covers the whole area of and end face of the piezoelectric element, which is exposed to the outside of the sensor, and a desired width of an end face of each of the electrodes adjacent to the end face of the piezoelectric element. This maintains a high resistance between the electrodes having the piezoelectric element therebetween and thereby promotes accurate measurement without being effected by changes in the resistance of the sealing member due to temperature variation. The sensor is effectively applicable to a vortex flow meter.
摘要翻译：公开了一种用于测量外力的压电传感器，其通过密封构件容纳在盒中，并且设置有分别结合到压电元件的相对侧的一对电极。由绝缘性高的绝缘材料构成的掩模条覆盖了暴露于传感器外部的压电元件的整个区域和端面以及与端面相邻的每个电极的端面的期望宽度的压电元件。这在其间具有压电元件的电极之间保持高电阻，从而促进精确的测量，而不受由温度变化引起的密封构件的电阻变化的影响。该传感器可有效应用于涡街流量计。

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