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    • 61. 发明授权
    • Lighting apparatus
    • 照明设备
    • US06286969B1
    • 2001-09-11
    • US09352324
    • 1999-07-12
    • Shuji KurokawaKenji Kobayashi
    • Shuji KurokawaKenji Kobayashi
    • G03B1502
    • G01N21/8806
    • A lighting apparatus 1 has a convex lens 11 arranged so that its optical axis is at an angle &thgr; with respect to the normal of an observation portion 3a (e.g., a semiconductor substrate or the like), with a camera 5 arranged in the path of the reflected light rays. When a light-emitting portion 13 is arranged along the optical axis of the lens 11, a bright field illumination takes place. If a knob 29 is turned, the light-emitting portion 13 moves along a ball screw 25, thereby changing the illumination from a bright field illumination to a dark field illumination. When a knob 37 is turned, the light exiting the lens 11 will diverge if the light-emitting portion 13 is moved close to the lens 11, converge if the light-emitting portion 13 is moved far away from the lens 11, and be parallel if the light-emitting portion 13 is positioned at the focal point of the lens 11. By changing the position of the light-emitting portion 13 in this way, it is possible to change the illuminating angle and the illuminating angle distribution, and by adjusting the position of the light-emitting portion 13 in accordance with the optical characteristics of the object 3, it is possible to obtain a high contrast image. It is also possible for these adjustments to be carried out automatically by using an actuator, microcomputer or the like.
    • 照明装置1具有凸透镜11,其布置成使得其光轴相对于观察部分3a(例如,半导体衬底等)的法线成角度θ,其中照相机5布置在 反射光线。 当沿着透镜11的光轴布置发光部分13时,发生明场照明。 如果旋钮29转动,则发光部13沿着滚珠丝杠25移动,从而将照明从亮场照明改变为暗场照明。 当旋钮37转动时,如果发光部分13靠近透镜11移动,离开透镜11的光将发散,如果发光部分13远离透镜11移动则会聚,并且平行 如果发光部分13位于透镜11的焦点处。通过以这种方式改变发光部分13的位置,可以改变照明角度和照明角度分布,并且通过调节 根据物体3的光学特性的发光部分13的位置,可以获得高对比度图像。 这些调整也可以通过使用致动器,微型计算机等自动进行。
    • 62. 发明授权
    • Wafer transfer apparatus
    • 晶圆传送装置
    • US06238515B1
    • 2001-05-29
    • US09376996
    • 1999-08-18
    • Masaki TsujimotoKenji KobayashiHideo NumataKeisuke Tokubuchi
    • Masaki TsujimotoKenji KobayashiHideo NumataKeisuke Tokubuchi
    • H01L2178
    • H01L21/67132H01L21/68H01L2221/6839Y10S414/137Y10S414/141Y10T156/1705Y10T156/1983
    • A wafer transfer apparatus for sticking a wafer, which is divided into a multiplicity of chips and which has its surface stuck with a protective tape, to a ring frame by a transfer tape, includes: a positioning unit capable of disposing the protective tape stuck wafer on a positioning table and capable of performing a position adjustment of the wafer in longitudinal, lateral and rotational directions, so that the wafer is located in a reference position; a transfer tape mount unit capable of disposing the protective tape stuck wafer, which has been located in the reference position by the positioning unit, on a transfer tape mount table, and capable of sticking a transfer tape to both a ring frame disposed round periphery of the wafer and back of the wafer, so that the wafer and the ring frame are stuck to each other and integrated; and a protective tape peeling unit capable of disposing the wafer, which has its back covered with the transfer tape and which has been integrated with the ring frame by the transfer tape mount unit, on a protective tape peeling table, and capable of bonding an end of a peeling tape to an end of the protective tape stuck to the wafer surface, and capable of pulling the peeling tape so that the protective tape is peeled from the wafer surface.
    • 将通过转印带将被分割为多个芯片并且其表面粘贴有保护带的晶片的晶片传送装置包括:能够将保护带粘贴的晶片 并且能够在纵向,横向和旋转方向上执行晶片的位置调整,使得晶片位于参考位置; 一种转印带安装单元,其能够将位于参考位置的定位单元的保护带粘贴的晶片放置在转印带安装台上,并且能够将转印带粘附到设置在圆周周围的环形框架 晶片和晶片的背面,使得晶片和环形框架彼此粘合并集成; 以及保护带剥离单元,其能够将其后面被转印带覆盖并且通过转印带安装单元与环形框架一体化的晶片设置在保护带剥离台上,并且能够将端部 剥离胶带粘附到保护胶带的端部,粘贴在晶片表面上,并且能够拉动剥离带使得保护带从晶片表面剥离。
    • 63. 发明授权
    • Method of die bonding electronic component and die bonding apparatus thereof
    • 电子部件和芯片接合装置的芯片接合方法
    • US06176966B1
    • 2001-01-23
    • US09095739
    • 1998-06-11
    • Masaki TsujimotoKenji Kobayashi
    • Masaki TsujimotoKenji Kobayashi
    • B32B3500
    • H01L21/6836H01L21/67132H01L2221/68327Y10S156/941Y10T29/49819Y10T29/49821Y10T29/49822Y10T156/11Y10T156/1132Y10T156/19
    • A method of die bonding electronic components. A wafer is mounted on a dicing tape (17) comprising at least one layer of shrink film and a pressure sensitive adhesive layer so that the wafer is stuck thereto by the pressure sensitive adhesive layer. The wafer is then diced so that the wafer is cut apart into a multiplicity of chips (16). The dicing tape (17) having the multiplicity of chips stuck thereto is placed on a table equipped with heating means. This is followed by shrinking the shrink film forming part of the dicing tape by the heating means (3, 7) so that an area of adhesion and adhesive strength between the chips and the adhesive layer are decreased and so that the chips are arranged with predetermined spacings. The final step is suctioning the chips (16) arranged with predetermined spacings one at a time by a suction collet (19) disposed above the chips so that the chips are separated from each other. This method enables effective die bonding without damaging the chips. Apparatus for effecting the method is also provided.
    • 一种将电子元件贴合的方法。 将晶片安装在包括至少一层收缩膜和压敏粘合剂层的切割带(17)上,使得晶片通过压敏粘合剂层粘附到其上。 然后对晶片进行切割,使得晶片被切割成多个芯片(16)。 将具有多个芯片的切割胶带(17)放置在装有加热装置的工作台上。 然后,通过加热装置(3,7)使形成切割带的部分的收缩膜收缩,使得芯片和粘合剂层之间的粘附面积和粘合强度降低,使得芯片以预定的方式排列 间距。 最后一步是通过设置在芯片上方的吸入夹头(19)一次抽吸以预定间隔布置的芯片(16),使得芯片彼此分离。 该方法能够有效地进行裸片接合而不损坏芯片。 还提供了用于实现该方法的装置。
    • 70. 发明授权
    • Set of iron golf club heads having a shifting back surface
    • 一组具有移动后表面的铁质高尔夫球杆头
    • US5524880A
    • 1996-06-11
    • US286266
    • 1994-08-05
    • Kenji Kobayashi
    • Kenji Kobayashi
    • A63B53/00A63B53/04
    • A63B53/00A63B2053/005
    • A set of iron golf club heads for correction of each tendency to hook balls for short irons, and to slice balls for long irons respectively. As the number of the iron golf club head increases, the back of each head body is shifted crosswise away from the neck relative to the face. Thus, as the number of the iron golf club head increases, the center of gravity of each head body is generally shifted crosswise away from the neck as well. Particularly, a position of a middle point M of the face of the 5th iron golf club head is approximately consistent with that of the center of gravity with respect to the lateral direction. Owing to the above position-settings of the center of gravity, balls are given slicing rotation for short irons, while balls are given hooking rotation for long irons, thereby decreasing either a habitual hooking or slicing tendency.
    • 一组铁质高尔夫球杆头,用于校正短铁杆钩球的各种倾向,并分别对较长的铁杆切片。 随着铁质高尔夫球杆头数量的增加,每个头部主体的背面相对于面部横向偏离颈部。 因此,随着铁质高尔夫球杆头的数量的增加,每个头部主体的重心通常也与颈部横向偏离。 特别地,第五铁高尔夫球杆头的面的中点M的位置与重心相对于横向方向的位置近似一致。 由于上述重心的位置设定,对于较短的铁杆,球被赋予了切片旋转,而球被长时间的熨斗旋转,从而降低了惯性钩或切片的倾向。