会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 64. 发明授权
    • LED unit
    • LED单元
    • US09434151B2
    • 2016-09-06
    • US13521783
    • 2010-12-30
    • Takashi Tanaka
    • Takashi Tanaka
    • B41F23/04B41J11/00H01L25/075
    • B41F23/0486B41F23/0453B41J11/002H01L25/0753H01L2224/48137
    • An LED unit includes: a plurality of LED modules each having an LED chip for generating ultraviolet ray provided in a package which has an opening formed on one surface and a lens formed to cover the opening of the package; a substrate-shaped base block where the LED modules are mounted in a first direction; and a heat radiation member where a plurality of the base blocks is provided in a second direction perpendicular to the first direction. The heat radiation member has a plurality of inclined surfaces where each of the base blocks is disposed. Further, one inclined surface and the other inclined surface of the heat radiation member are inclined to face each other in the second direction.
    • LED单元包括:多个LED模块,每个LED模块具有用于产生紫外线的LED芯片,所述LED芯片设置在具有在一个表面上形成的开口的封装件和形成为覆盖封装的开口的透镜; LED模块沿第一方向安装的基板形基座; 以及散热构件,其中在与第一方向垂直的第二方向上设置有多个基块。 散热构件具有多个倾斜面,其中设置每个基座。 此外,散热构件的一个倾斜表面和另一个倾斜表面在第二方向上相互倾斜。
    • 66. 发明申请
    • ELECTROCONDUCTIVE RESIN BELT, METHOD OF PREPARING THE SAME, AND IMAGE FORMING APPARATUS HAVING THE SAME
    • 电接枝树脂皮带,其制备方法以及具有相同成像装置的图像形成装置
    • US20150227090A1
    • 2015-08-13
    • US14619206
    • 2015-02-11
    • Sumio KamoiTakashi TanakaYumiko HayashiTomoko SatohTakuya Kohda
    • Sumio KamoiTakashi TanakaYumiko HayashiTomoko SatohTakuya Kohda
    • H01B1/24G03G15/16B28B1/14
    • G03G15/162B29L2029/00G03G15/0818G03G15/1685G03G15/2057
    • An electroconductive resin belt having a flame resistance of VTM-0 in UL94 standard when having a thickness of from 50 to 150 μm includes a first resin selected from the group consisting of polyetherimide-siloxane block copolymer, polyphenylene sulfide and polyimide; a second resin selected from the group consisting of polyetherimide, polyether sulfone, polyester, aliphatic polyamide, polyetherimide-siloxane block copolymer and polyamideimide; carbon as a first conductant; and at least one second conductant selected from the group consisting of particulate Al-doped ZnO, particulate Ga-doped ZnO, particulate Sb-doped SnO2, particulate In-doped SnO2, particulate P-doped SnO2 and the group consisting of metal oxides coated with any one of the second conductant group. The first resin forms a continuous phase, the second resin forms a dispersion phase, the carbon is unevenly distributed in the dispersion phase or an arc therearound, the second conductant is present in both of the dispersion phase and the continuous phase.
    • 当厚度为50〜150μm时,UL94标准中具有VTM-0的阻燃性的导电树脂带包括选自聚醚酰亚胺 - 硅氧烷嵌段共聚物,聚苯硫醚和聚酰亚胺的第一种树脂; 选自聚醚酰亚胺,聚醚砜,聚酯,脂族聚酰胺,聚醚酰亚胺 - 硅氧烷嵌段共聚物和聚酰胺酰亚胺的第二种树脂; 碳作为第一个导电剂; 以及至少一种第二导电剂,其选自颗粒Al掺杂的ZnO,掺杂粒子的ZnO,颗粒Sb掺杂的SnO 2,颗粒In掺杂的SnO 2,颗粒P掺杂的SnO 2和由金属氧化物 任何一个第二个导演组。 第一树脂形成连续相,第二树脂形成分散相,碳在分散相或其周围的电弧不均匀分布,第二导电体存在于分散相和连续相中。
    • 69. 发明申请
    • PLATING APPARATUS, PLATING METHOD AND STORAGE MEDIUM
    • 电镀设备,镀层方法和储存介质
    • US20140134345A1
    • 2014-05-15
    • US14129623
    • 2012-06-04
    • Yuichiro InatomiTakashi TanakaMitsuaki Iwashita
    • Yuichiro InatomiTakashi TanakaMitsuaki Iwashita
    • B05C5/00B05D1/02
    • B05C5/001B05D1/02C23C18/1619C23C18/1669C23C18/1676C23C18/168
    • A plating apparatus of performing a plating process by supplying a plating liquid onto a substrate includes a substrate holding/rotating device configured to hold and rotate the substrate; a discharging device configured to discharge the plating liquid toward the substrate; a plating liquid supplying device configured to supply the plating liquid to the discharging device; and a controller configured to control the discharging device and the plating liquid supplying device. Further, the discharging device includes a first nozzle having a discharge opening, and a second nozzle having a discharge opening configured to be positioned closer to a central portion of the substrate than the discharge opening of the first nozzle. Furthermore, the plating liquid supplying device is configured to set a temperature of the plating liquid supplied to the first nozzle to be higher than a temperature of the plating liquid supplied to the second nozzle.
    • 通过将电镀液体供给到基板上进行电镀处理的电镀装置包括:基板保持旋转装置,其构造成保持和旋转基板; 排出装置,被配置为将所述电镀液体朝向所述基板排出; 电镀液供给装置,其配置为将电镀液体供给到排出装置; 以及控制器,其被配置为控制所述排出装置和所述电镀液供给装置。 此外,排出装置包括具有排出口的第一喷嘴和具有排出口的第二喷嘴,其被配置为比第一喷嘴的排出口更靠近基板的中心部分。 此外,电镀液供给装置被配置为将供给到第一喷嘴的电镀液的温度设定为高于供给到第二喷嘴的电镀液的温度。
    • 70. 发明授权
    • Coating treatment method, computer-readable storage medium, and coating treatment apparatus
    • 涂布处理方法,计算机可读存储介质和涂布处理装置
    • US08574674B2
    • 2013-11-05
    • US13331307
    • 2011-12-20
    • Takashi Tanaka
    • Takashi Tanaka
    • B05D3/12
    • H01L21/6715G03F7/162
    • A substrate is first rotated at a first rotation speed, and a resist solution is applied. Rotation of the substrate is decelerated to a second rotation speed lower than the first rotation speed so that the substrate is rotated at the low speed to smooth the resist solution on the substrate. Rotation of the substrate is then accelerated to a third rotation speed higher than the second rotation speed, and a solvent for the coating solution and/or a dry gas are/is supplied to the resist solution on the substrate. The solvent gas is supplied to a portion of the resist solution on the substrate thicker than a set thickness, and the dry gas is supplied to a portion of the coating solution on the substrate thinner than the set thickness. This thins the thicker portion of the resist solution and thickens the thinner portion to uniform the resist solution.
    • 首先以第一转速旋转衬底,并施加抗蚀剂溶液。 基板的旋转减速到比第一旋转速度低的第二旋转速度,使得基板以低速旋转以平滑基板上的抗蚀剂溶液。 然后将衬底的旋转加速到高于第二转速的第三转速,并且将用于涂布溶液和/或干燥气体的溶剂供应到衬底上的抗蚀剂溶液。 将溶剂气体供给到比设定厚度厚的基板上的抗蚀剂溶液的一部分,并且将干燥气体供给到比设定厚度更薄的基板上的涂布溶液的一部分。 这使得抗蚀剂溶液的较厚部分变薄并使较薄部分变稠以使抗蚀剂溶液均匀。