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61. 发明申请

US20050082666A1 Liquid cooling device 审中-公开
标题翻译：液体冷却装置
公开(公告)号：US20050082666A1
公开(公告)日：2005-04-21
申请号：US10950736
申请日：2004-09-27
申请人： Hsieh-Kun Lee , Cheng-Tien Lai , Shi-Wen Zhou
发明人： Hsieh-Kun Lee , Cheng-Tien Lai , Shi-Wen Zhou
IPC分类号： F28F27/02 , H01L23/473 , F25B41/00 , H01L23/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： F28D15/00 , F28F3/12 , F28F9/0265 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling device includes a casing (10) having a container (14) for accommodating liquid therein, a liquid inlet port (18) in communication with the container, and a diversion member (20, 20′) located in the casing, for leading liquid from the liquid inlet port to a bottom of the container.
摘要翻译：液体冷却装置包括具有用于容纳液体的容器（14）的壳体（10），与容器连通的液体入口（18）和位于壳体中的分流构件（20,20'），用于引导液体从液体入口到容器的底部。

62. 发明授权

US08579017B2 Heat dissipation device with multiple heat sinks 有权
标题翻译：具有多个散热片的散热装置
公开(公告)号：US08579017B2
公开(公告)日：2013-11-12
申请号：US12620500
申请日：2009-11-17
申请人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/427 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipation device includes a connecting plate, a first heat sink, a second heat sink, and a second flattened heat pipe. The first heat sink includes a substrate mounted on a bottom of the connecting plate and a plurality of cylindrical pins inserted in the connecting plate and contacting the substrate. The second heat sink includes a heat spreader and a plurality of rectangular solid fins integrally extending from the heat spreader. The heat spreader engages in the connecting plate. The heat pipe thermally connects the substrate of the first heat sink and the second heat spreader of the second heat sink.
摘要翻译：示例性散热装置包括连接板，第一散热器，第二散热器和第二平坦化热管。第一散热器包括安装在连接板的底部上的基板和插入连接板中并接触基板的多个圆柱形销。第二散热器包括散热器和从散热器一体延伸的多个矩形固体翅片。散热器接合连接板。热管将第一散热器的基板和第二散热器的第二散热器热连接。

63. 发明授权

US08579016B2 Heat dissipation device with heat pipe 失效
标题翻译：散热装置带热管
公开(公告)号：US08579016B2
公开(公告)日：2013-11-12
申请号：US12688794
申请日：2010-01-15
申请人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28D15/02
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipation device dissipating heat generated by an electronic element mounted on a printed circuit board includes a supporter, a heat conducting base, a first fin assembly and a heat pipe. The heat conducting base is securely attached to a bottom side of the supporter and thermally contacting the electronic element. The first fin assembly is securely attached to a top side of the supporter. The heat pipe includes an evaporator sandwiched between the supporter and the heat conducting base, and a condenser extending through the supporter and extending in the first fin assembly.
摘要翻译：散发由安装在印刷电路板上的电子元件产生的热的示例性散热装置包括支撑件，导热基座，第一翅片组件和热管。导热基座牢固地附接到支撑件的底侧并与电子元件热接触。第一翅片组件牢固地附接到支撑件的顶侧。热管包括夹在支撑件和导热基座之间的蒸发器，以及延伸穿过支撑件并在第一翅片组件中延伸的冷凝器。

64. 发明授权

US08004843B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US08004843B2
公开(公告)日：2011-08-23
申请号：US12565712
申请日：2009-09-23
申请人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen
发明人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is provided for dissipating heat generated by a plurality of electronic components mounted on a printed circuit board and having different heights. The heat dissipation device includes a connecting member and a first base mounted on the connecting member and located at above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the first base to assemble the first base on the one of the electronic components on the printed circuit board. A distance between the first base and the one of the electronic components is adjustable by adjusting the joining members to make the first base intimately contact with the one of the electronic components.
摘要翻译：散热装置用于散发由安装在印刷电路板上并具有不同高度的多个电子部件产生的热量。散热装置包括连接构件和安装在连接构件上并位于上述一个电子部件上的第一基座。多个连接构件延伸穿过印刷电路板并与第一基座接合以在印刷电路板上的电子部件之一上组装第一基座。第一基座和电子部件之间的距离可通过调节连接部件来调节，以使第一基座与电子部件之一紧密接触。

65. 发明授权

US07898809B2 Heat sink and method of manufacturing the same 有权
标题翻译：散热器及其制造方法
公开(公告)号：US07898809B2
公开(公告)日：2011-03-01
申请号：US12252373
申请日：2008-10-16
申请人： Yi-Jiun Li , Peng Liu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Yi-Jiun Li , Peng Liu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/3677 , H01L21/4882 , H01L2924/0002 , H01L2924/3011 , Y10T29/4935 , H01L2924/00
摘要： A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mounting portion. The mounting portion is interferentially fitted in a lower part of a corresponding aperture of the base plate. The engaging portion has a diameter smaller than that of the mounting portion. The engaging portion is cramped by an interior wall of the base plate defining an upper part of the corresponding aperture of the base plate by punching an upper surface of the base plate downwardly at a rim of the corresponding aperture.
摘要翻译：散热器包括基板和从基板向上延伸的多个圆柱形销。圆柱销每个包括上消散部分，下安装部分和消散部分和安装部分之间的接合部分。安装部分周向地装配在基板的相应孔的下部中。接合部的直径小于安装部的直径。接合部分被基板的内壁夹住，通过在对应的孔的边缘处向下冲压基板的上表面来限定基板的相应孔的上部。

66. 发明授权

US07391615B2 Clip for heat sink 失效
标题翻译：夹子为散热片
公开(公告)号：US07391615B2
公开(公告)日：2008-06-24
申请号：US11309839
申请日：2006-10-10
申请人： Meng Fu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Meng Fu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2224/16 , Y10T24/44427 , Y10T24/4447
摘要： A clip includes a body with opposite first and second legs, a movable fastener, an actuating member and a sliding axle. The movable fastener has a retaining hole defined therein for engaging with a retention module and an elongated slot above the retaining hole. The actuating member includes a curving slot and is pivotally coupled to the movable fastener via a pivot. The sliding axle extends through the second leg of the body and the elongated slot of the movable fastener to couple them together, and the sliding axle has one portion inserted into the curving slot of the actuating member. When the actuating member is rotated about the pivot, the movable fastener is driven to move relative to the sliding axle between a relaxed position and a locked position.
摘要翻译：夹具包括具有相对的第一和第二腿部的主体，可移动紧固件，致动构件和滑动轴。可移动紧固件具有限定在其中的保持孔，用于与保持模块和保持孔上方的细长狭槽接合。致动构件包括弯曲槽，并且经由枢轴枢转地联接到可动紧固件。滑动轴延伸穿过主体的第二腿部和可移动紧固件的细长槽以将它们联接在一起，并且滑动轴具有插入致动构件的弯曲槽中的一个部分。当致动构件围绕枢轴旋转时，可移动紧固件被驱动以在松弛位置和锁定位置之间相对于滑动轴线移动。

67. 发明申请

US20080055854A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20080055854A1
公开(公告)日：2008-03-06
申请号：US11309616
申请日：2006-09-01
申请人： Shi-Wen Zhou , Peng Liu , Guo Chen
发明人： Shi-Wen Zhou , Peng Liu , Guo Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28D15/0275 , F28F3/04 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat-absorbing member having two arched concave walls formed at opposite sides thereof, and a plurality of fins extending outwardly and slantwise from each of the two arched concave walls of the heat-absorbing member toward a middle between a front and a rear of the heat dissipation device.
摘要翻译：散热装置包括一个吸热构件，它具有形成在其相对两侧的两个拱形凹壁，以及从吸热构件的两个拱形凹壁中的每一个向外并向前倾斜的多个翅片朝向前部和散热装置的后部。

68. 发明申请

US20070077880A1 Computer system airflow-guiding device 审中-公开
标题翻译：计算机系统导风装置
公开(公告)号：US20070077880A1
公开(公告)日：2007-04-05
申请号：US11241910
申请日：2005-10-03
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Chi Liang
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Chi Liang
IPC分类号： F24F13/06
CPC分类号： H05K7/20172 , G06F1/20
摘要： An airflow-guiding device for being mounted into a computer system to periodically change airflow passing therethrough, comprises a motor, a gearing driven by the motor and a plurality of airflow-guiding plates pivoted to a frame and linked to the gearing and driven thereby to turn back and forth periodically. The gearing comprises a cam driven by the motor and a sliding board slideably mounted on a supporting member. The sliding board has a lateral side always in contact with the cam so that when the cam rotates, the sliding plate slides on the supporting member. The airflow-guiding plates each have a linking rod linked to the sliding board. The airflow-guiding plates periodically turn within a given angle following the rotation of the cam so as to change direction of airflow passing through the airflow-guiding plates.
摘要翻译：一种用于安装到计算机系统中以周期性地改变通过其中的气流的气流引导装置，包括电动机，由电动机驱动的齿轮传动装置和多个气流引导板，其枢转到框架并连接到齿轮传动装置并被驱动，周期性地来回转。传动装置包括由马达驱动的凸轮和可滑动地安装在支撑构件上的滑动板。滑动板具有总是与凸轮接触的侧面，使得当凸轮旋转时，滑动板在支撑构件上滑动。气流引导板各自具有连接到滑动板的连接杆。气流引导板在凸轮旋转之后周期性地转动给定的角度，以改变通过气流引导板的气流的方向。

69. 发明申请

US20060054307A1 Heat sink 失效
标题翻译：散热器
公开(公告)号：US20060054307A1
公开(公告)日：2006-03-16
申请号：US11221285
申请日：2005-09-07
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for dissipating heat of an electronic device comprises a base, a first fin group comprising a plurality of fins stacked together, a second fin group comprising a plurality of fins and overlapping the first fin group, and a sinuous heat pipe attached to the base. The first and second fin groups are respectively engaged with the heat pipe twice at different locations of the first and second fin groups.
摘要翻译：一种用于散热电子装置的散热器包括：基座，包括堆叠在一起的多个翅片的第一翅片组，包括多个翅片并与第一翅片组重叠的第二翅片组，以及连接到第一翅片组的弯曲热管基础。第一和第二翅片组分别在第一和第二翅片组的不同位置与热管接合两次。

70. 发明申请

US20060032617A1 Heat sink electronic components 审中-公开
标题翻译：散热器电子元件
公开(公告)号：US20060032617A1
公开(公告)日：2006-02-16
申请号：US11012958
申请日：2004-12-14
申请人： Chun-Chi Chen , Shi-Wen Zhou , Chi Liang , Meng Fu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Chi Liang , Meng Fu
IPC分类号： F28D15/00
CPC分类号： H01L23/427 , F28D15/0275 , F28F3/02 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for electronic component includes a base, a first heat dissipation member coupled to the base, heat pipes embedded in the base and a second heat dissipation member coupled to the base. The base is made of a first metal material and includes a heat absorbing portion having a bottom surface for contacting with the electronic component and a heat conductive portion extending from a top surface of heat absorbing portion. The first heat dissipation member is made of a second metal material and coupled to the heat absorbing portion of the base. The second heat dissipation member is made of second metal material and coupled to the heat conductive portion of the base. The first metal material differs from and has higher heat conductivity than the second metal material.
摘要翻译：一种用于电子部件的散热器包括基座，耦合到基座的第一散热构件，嵌入在基座中的热管和耦合到基座的第二散热构件。基座由第一金属材料制成，并且包括具有用于与电子部件接触的底面的吸热部和从吸热部的顶面延伸的导热部。第一散热构件由第二金属材料制成并且联接到基座的吸热部分。第二散热构件由第二金属材料制成并且连接到基座的导热部分。第一金属材料与第二金属材料不同并且具有比第二金属材料更高的热导率。

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