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61. 发明申请

US20080229577A1 Seek-scan probe (SSP) memory with sharp probe tips formed at CMOS-compatible temperatures 有权
标题翻译：寻找扫描探针（SSP）存储器，在CMOS兼容温度下形成尖锐的探针尖
公开(公告)号：US20080229577A1
公开(公告)日：2008-09-25
申请号：US11725647
申请日：2007-03-19
申请人： John Heck
发明人： John Heck
IPC分类号： G01R1/06 , H01R43/00
CPC分类号： G11B9/1409 , G01Q80/00 , Y10T29/49147 , Y10T29/49222
摘要： Embodiments of a process comprising forming one or more micro-electro-mechanical (MEMS) probe on a conductive metal oxide semiconductor (CMOS) wafer, wherein each MEMS probe comprises a cantilever beam with a fixed end and a free end and wherein the CMOS wafer has circuitry thereon; forming an unsharpened tip at or near the free end of each cantilever beam; depositing a silicide-forming material over the tip; annealing the wafer to sharpen the tip; and exposing the sharpened tip. Embodiments of an apparatus comprising a conductive metal oxide semiconductor (CMOS) wafer including circuitry therein; one or more micro-electro-mechanical (MEMS) probes integrally formed on the CMOS wafer, wherein each MEMS probe comprises a cantilever beam with a fixed end and a free end and a sharpened tip at or near the free end, the sharpened tip formed by a process comprising forming an unsharpened tip at or near the free end of each cantilever beam, depositing a silicide-forming material over the unsharpened tip, annealing the wafer to sharpen the unsharpened tip, and exposing the sharpened tip.
摘要翻译：一种方法的实施例包括在导电金属氧化物半导体（CMOS）晶片上形成一个或多个微电机械（MEMS）探针，其中每个MEMS探针包括具有固定端和自由端的悬臂梁，并且其中所述CMOS晶片在其上有电路; 在每个悬臂梁的自由端处或附近形成未钝化的尖端; 在尖端上沉积硅化物形成材料; 退火晶片以锐化尖端; 并暴露锋利的尖端。包括其中包括电路的导电金属氧化物半导体（CMOS）晶片的装置的实施例; 在CMOS晶片上整体形成的一个或多个微机电（MEMS）探针，其中每个MEMS探针包括具有固定端和自由端的悬臂梁，以及在自由端处或附近的尖锐尖端，形成尖锐的尖端通过包括在每个悬臂梁的自由端处或附近形成未钝化的尖端的方法，在未钝化的尖端上沉积硅化物形成材料，退火晶片以锐化未钝化的尖端，以及暴露尖锐的尖端。

62. 外观设计

USD552423S1 Container 有权
公开(公告)号：USD552423S1
公开(公告)日：2007-10-09
申请号：US29267005
申请日：2006-10-04
申请人： Jason Friedland , Matthew Wadalawala , Angus MacLellan , John Heck , Glenn Shull , Gary Chisholm
设计人： Jason Friedland , Matthew Wadalawala , Angus MacLellan , John Heck , Glenn Shull , Gary Chisholm

63. 外观设计

USD551508S1 Container 有权
公开(公告)号：USD551508S1
公开(公告)日：2007-09-25
申请号：US29267006
申请日：2006-10-04
申请人： Jason Friedland , Matthew Wadalawala , Angus MacLellan , John Heck , Glenn Shull , Gary Chisholm
设计人： Jason Friedland , Matthew Wadalawala , Angus MacLellan , John Heck , Glenn Shull , Gary Chisholm

64. 外观设计

USD551505S1 Container 有权
公开(公告)号：USD551505S1
公开(公告)日：2007-09-25
申请号：US29267002
申请日：2006-10-04
申请人： Jason Friedland , Matthew Wadalawala , Angus MacLellan , John Heck , Glenn Shull , Gary Chisholm
设计人： Jason Friedland , Matthew Wadalawala , Angus MacLellan , John Heck , Glenn Shull , Gary Chisholm

65. 发明授权

US07243833B2 Electrically-isolated interconnects and seal rings in packages using a solder preform 有权
标题翻译：使用焊料预制件的封装中的电隔离互连和密封环
公开(公告)号：US07243833B2
公开(公告)日：2007-07-17
申请号：US11174409
申请日：2005-06-30
申请人： Leonel R. Arana , John Heck
发明人： Leonel R. Arana , John Heck
IPC分类号： B23K35/12 , B23K31/02
CPC分类号： B23K3/0623 , B23K2101/38 , H01L2224/17
摘要： Embodiments include electronic assemblies and methods for forming electronic assemblies. One embodiment includes a method of forming a MEMS device assembly, including forming an active MEMS region on a substrate. A plurality of bonding pads electrically coupled to the active MEMS region are formed. A seal ring wetting layer is also formed on the substrate, the seal ring wetting layer surrounding the active MEMS region. A single piece solder preform is positioned on the bonding pads and on the seal ring wetting layer, the single piece solder preform including a seal ring region and a bonding pad region. The seal ring region is connected to the bonding pad region by a plurality of solder bridges. The method also includes heating the single piece solder preform to a temperature above the reflow temperature, so that the bridges split and the solder from the preform accumulates on the seal ring wetting layer and the bonding pads. A lid is coupled to the solder. In certain embodiments the lid may include vias having conductive material therein for providing electrical contact to the MEMS device.
摘要翻译：实施例包括用于形成电子组件的电子组件和方法。一个实施例包括形成MEMS器件组件的方法，包括在衬底上形成有源MEMS区域。形成电耦合到有源MEMS区域的多个接合焊盘。密封环润湿层也形成在衬底上，围绕有源MEMS区域的密封环润湿层。单块焊料预制件位于接合焊盘和密封环润湿层上，单件焊料预制件包括密封环区域和焊盘区域。密封圈区域通过多个焊接桥连接到焊盘区域。该方法还包括将单件焊料预制件加热到高于回流温度的温度，使得桥接器分裂，并且来自预制件的焊料积聚在密封环润湿层和接合焊盘上。盖子与焊料相连。在某些实施例中，盖可以包括其中具有导电材料的通孔，用于提供与MEMS器件的电接触。

66. 发明申请

US20060290443A1 Ultra-low voltage capable zipper switch 失效
标题翻译：超低电压拉链开关
公开(公告)号：US20060290443A1
公开(公告)日：2006-12-28
申请号：US11165795
申请日：2005-06-23
申请人： Tsung-Kuan Chou , Hanan Bar , Quan Tran , Joseph Melki , John Heck , Qing Ma
发明人： Tsung-Kuan Chou , Hanan Bar , Quan Tran , Joseph Melki , John Heck , Qing Ma
IPC分类号： H01P1/10
CPC分类号： H01H59/0009 , B81B3/0013 , B81B2201/014 , H01H2059/0063 , H01H2059/0072
摘要： An electromechanical switch includes an actuation electrode, an anchor, a cantilever electrode, a contact, and signal lines. The actuation electrode and anchor are mounted to a substrate. The cantilever electrode is supported by the anchor above the actuation electrode. The contact is mounted to the cantilever electrode. The signal lines are positioned to form a closed circuit with the contact when an actuation voltage is applied between the actuation electrode and the cantilever electrode causing the cantilever electrode to bend towards the actuation electrode in a zipper like movement starting from a distal end of the cantilever electrode.
摘要翻译：机电开关包括致动电极，锚，悬臂电极，触点和信号线。致动电极和锚固件安装到基板上。悬臂电极由致动电极上方的锚固件支撑。触点安装到悬臂电极。当在致动电极和悬臂电极之间施加致动电压时，信号线被定位成与触点形成闭合电路，导致悬臂电极以拉链的方式朝着致动电极弯曲，从悬臂的远端开始电极。

67. 发明授权

US07087451B2 Microfabricated hot wire vacuum sensor 有权
标题翻译：微型热丝真空传感器
公开(公告)号：US07087451B2
公开(公告)日：2006-08-08
申请号：US10807836
申请日：2004-03-24
申请人： Leonel R. Arana , Yuelin Lee Zou , John Heck
发明人： Leonel R. Arana , Yuelin Lee Zou , John Heck
IPC分类号： H01L21/00 , H01L31/058
CPC分类号： G01L11/002 , G01L21/12 , G01M3/186 , G01M3/3272 , H01L2224/48091 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A microfabricated vacuum sensor may be formed using semiconductor integrated circuit processes. The sensor may be formed inside an enclosure with a microfabricated component. The sensor may then be used to measure the pressure within the enclosure.
摘要翻译：可以使用半导体集成电路工艺形成微细真空传感器。传感器可以形成在具有微加工部件的外壳内。然后可以使用传感器来测量外壳内的压力。

68. 发明授权

US07061099B2 Microelectronic package having chamber sealed by material including one or more intermetallic compounds 失效
标题翻译：微电子封装，其具有由包括一种或多种金属间化合物的材料密封的腔室
公开(公告)号：US07061099B2
公开(公告)日：2006-06-13
申请号：US10955872
申请日：2004-09-30
申请人： Daoqiang Lu , John Heck
发明人： Daoqiang Lu , John Heck
IPC分类号： H01L23/12 , H01L23/10
CPC分类号： B81C1/00269 , H01L2224/45144 , H01L2224/48463 , Y10S257/924 , H01L2924/00
摘要： Microelectronic packages having chambers and sealing materials, and methods of making the packages, and sealing the chambers, are disclosed. An exemplary package may include a first surface, a second surface, a solid sealing material including an intermetallic compound, such as, for example, of gallium or another relatively low melting material, between the first surface and the second surface, and a chamber defined by the first surface, the second surface, and the sealing material. An exemplary method may include disposing a ring of a sealing material including a liquid metal between a first surface and a second surface to define a chamber between the first surface, the second surface, and the ring of the sealing material, and sealing the chamber by heating the sealing material to react the liquid metal with a metal that is capable of forming an intermetallic compound with the liquid metal.
摘要翻译：公开了具有室和密封材料的微电子封装，以及制造封装的方法和密封室。示例性包装可以包括在第一表面和第二表面之间的第一表面，第二表面，包括金属间化合物（例如镓或另一种较低熔点的材料）的固体密封材料，通过第一表面，第二表面和密封材料。示例性方法可以包括在第一表面和第二表面之间设置包括液体金属的密封材料的环，以在第一表面，第二表面和密封材料的环之间限定腔室，并且通过加热密封材料以使液态金属与能够与液态金属形成金属间化合物的金属反应。

69. 发明申请

US20060001123A1 Module integrating MEMS and passive components 有权
标题翻译：集成MEMS和无源元件的模块
公开(公告)号：US20060001123A1
公开(公告)日：2006-01-05
申请号：US10882635
申请日：2004-06-30
申请人： John Heck , Qing Ma , Eyal Bar-Sadeh
发明人： John Heck , Qing Ma , Eyal Bar-Sadeh
IPC分类号： H01L29/00
CPC分类号： B81C1/0023 , Y10S977/701 , Y10S977/724
摘要： An apparatus may include a first substrate, one or more microelectromechanical systems (MEMS) coupled to the first substrate, a second substrate coupled with the first substrate, and one or more passive components coupled to the second substrate. A method may include aligning a first substrate having one or more MEMS coupled thereto and a second substrate having one or more passive components coupled thereto, and coupling the aligned substrates.
摘要翻译：装置可以包括第一基板，耦合到第一基板的一个或多个微机电系统（MEMS），与第一基板耦合的第二基板以及耦合到第二基板的一个或多个无源部件。一种方法可以包括对准具有耦合到其上的一个或多个MEMS的第一基板和具有耦合到其上的一个或多个无源部件的第二基板，以及连接对准的基板。

70. 发明申请

US20050007219A1 Microelectromechanical (MEMS) switching apparatus 有权
标题翻译：微机电（MEMS）开关装置
公开(公告)号：US20050007219A1
公开(公告)日：2005-01-13
申请号：US10912413
申请日：2004-08-04
申请人： Qing Ma , Valluri Rao , John Heck , Li-Peng Wang , Dong Shim , Quan Tran
发明人： Qing Ma , Valluri Rao , John Heck , Li-Peng Wang , Dong Shim , Quan Tran
IPC分类号： H01H59/00 , H01H51/22
CPC分类号： H01H59/0009 , H01H2001/0078 , H01H2059/0036
摘要： This application discloses a microelectromechanical (MEMS) switch apparatus comprising an anchor attached to a substrate and an electrically conductive beam attached to the anchor and in electrical contact therewith. The beam comprises a tapered portion having a proximal end and a distal end, the proximal end being attached to the anchor, an actuation portion attached to the distal end of the tapered portion, a tip attached to the actuation portion, the tip having a contact dimple thereon. The switch apparatus also includes an actuation electrode attached to the substrate and positioned between the actuation portion and the substrate. Additional embodiments are also described and claimed.
摘要翻译：本申请公开了一种微机电（MEMS）开关设备，其包括附接到基板的锚固件和附接到锚固件并与其接触的导电梁。所述梁包括具有近端和远端的锥形部分，所述近端附接到所述锚固件，附接到所述锥形部分的远端的致动部分，附接到所述致动部分的尖端，所述尖端具有触点在其上的凹坑。开关装置还包括附接到基板并位于致动部分和基板之间的致动电极。还描述和要求保护附加实施例。

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