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61. 发明授权

US07298265B2 RFID tag and method of manufacturing the same 失效
标题翻译： RFID标签及其制造方法
公开(公告)号：US07298265B2
公开(公告)日：2007-11-20
申请号：US11091934
申请日：2005-03-29
申请人： Naoki Ishikawa , Shunji Baba , Hidehiko Kira , Hiroshi Kobayashi
发明人： Naoki Ishikawa , Shunji Baba , Hidehiko Kira , Hiroshi Kobayashi
IPC分类号： G08B13/14
CPC分类号： H01L24/12 , G06K19/07749 , G06K19/0775 , H01L23/49855 , H01L24/11 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/10135 , H01L2224/10165 , H01L2224/1134 , H01L2224/131 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/2929 , H01L2224/293 , H01L2224/73203 , H01L2224/81136 , H01L2224/81139 , H01L2224/8114 , H01L2224/81191 , H01L2224/8159 , H01L2224/816 , H01L2224/81801 , H01L2224/81903 , H01L2224/83192 , H01L2224/83851 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , Y10T29/49018 , H01L2224/13099 , H01L2924/00012 , H01L2224/29075 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The present invention provides a radio frequency identification (RFID) tag which exchanges information with an external device in a noncontact manner, in which a paste is used as a material for an antenna, and which is designed to prevent sinking of bumps. A stopper for limiting sinking of bumps of a circuit chip caused by a pressing force when the circuit chip is connected to an antenna is provided on the circuit chip or a base at a position adjacent to the bumps.
摘要翻译：本发明提供了一种射频识别（RFID）标签，其以非接触方式与外部设备交换信息，其中使用糊料作为天线的材料，并且被设计成防止凸起的下沉。当电路芯片连接到天线时，用于限制由压力引起的电路芯片的凸块的下沉的止动器设置在电路芯片或与凸块相邻的位置的基座上。

62. 发明授权

US07214563B2 IC chip mounting method 有权
标题翻译： IC芯片安装方法
公开(公告)号：US07214563B2
公开(公告)日：2007-05-08
申请号：US11319652
申请日：2005-12-29
申请人： Naoki Ishikawa , Shunji Baba , Hidehiko Kira , Hiroshi Kobayashi , Shunichi Kikuchi , Tatsuro Tsuneno
发明人： Naoki Ishikawa , Shunji Baba , Hidehiko Kira , Hiroshi Kobayashi , Shunichi Kikuchi , Tatsuro Tsuneno
IPC分类号： H01L21/44
CPC分类号： G06K19/07749 , H01L21/67132 , H01L21/67144 , H01L21/6835 , H01L21/6836 , H01L24/75 , H01L24/81 , H01L24/97 , H01L2221/68327 , H01L2221/68354 , H01L2223/6677 , H01L2224/16 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/75314 , H01L2224/7565 , H01L2224/75745 , H01L2224/7598 , H01L2224/81001 , H01L2224/81005 , H01L2224/81121 , H01L2224/81203 , H01L2224/81801 , H01L2224/81907 , H01L2224/83192 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2224/81
摘要： An IC chip mounting method which mounts two or more IC chips on a base, includes: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; positioning the wafer to face the base in such a direction that the mounting surface to be attached to the base faces the base; sequentially pressing the IC chips on the wafer against the base and temporarily fixing the IC chips while the base is being fed in a prescribed one-dimensional direction along the wafer and while the wafer is being moved two-dimensionally along the base; and fixing the IC chips temporarily fixed on the base on the base by heating and pressurizing in a batch manner.
摘要翻译：一种将两个或更多个IC芯片安装在基座上的IC芯片安装方法，包括：通过在其表面上安装带子，准备晶片，该晶片具有安装在基座上的安装表面，并且通过在离开胶带的同时通过切割将晶片分成IC芯片; 将晶片定位成使得与基座相对的安装表面面向基座的方向面对基座; 在晶片沿着晶片沿指定的一维方向进给的同时沿着基座二维移动的同时，将晶片上的IC芯片依次按压在基板上并临时固定IC芯片; 并且通过间歇加热和加压将临时固定在基座上的IC芯片固定在基座上。

63. 发明申请

US20070069849A1 Magnetic field detector and manufacturing method thereof 有权
标题翻译：磁场检测器及其制造方法
公开(公告)号：US20070069849A1
公开(公告)日：2007-03-29
申请号：US11378645
申请日：2006-03-20
申请人： Taisuke Furukawa , Hiroshi Kobayashi , Takashi Takenaga , Takeharu Kuroiwa , Beysen Sadeh , Masakazu Taki
发明人： Taisuke Furukawa , Hiroshi Kobayashi , Takashi Takenaga , Takeharu Kuroiwa , Beysen Sadeh , Masakazu Taki
IPC分类号： H01L43/00
CPC分类号： G01R33/093 , B82Y25/00
摘要： A magnetic field detector includes: a magnet; a magnetic resistance element used for detection having a layer structure containing a ferromagnetic layer, the resistance being changed when a direction of magnetization of the ferromagnetic layer is changed; and a magnetic resistance element used for reference having the substantially same layer structure as that of the magnetic resistance element used for detection, wherein a magnetic field, the magnetic intensity of which is higher than the saturation magnetic field, is impressed by the magnet in the direction which is felt by the ferromagnetic layer of the magnetic resistance element used for reference.
摘要翻译：磁场检测器包括：磁体; 用于检测的磁阻元件具有包含铁磁层的层结构，当铁磁层的磁化方向改变时，电阻改变; 以及用于参考的磁阻元件，其具有与用于检测的磁阻元件基本相同的层结构，其中磁场强度高于饱和磁场的磁场被磁体施加在由用于参考的磁阻元件的铁磁层感觉到的方向。

64. 发明授权

US07196512B2 Magnetic head tester 失效
标题翻译：磁头测试仪
公开(公告)号：US07196512B2
公开(公告)日：2007-03-27
申请号：US10722823
申请日：2003-11-26
申请人： Norio Kainuma , Hidehiko Kira , Kenji Kobae , Hiroshi Kobayashi , Katsutoshi Hirasawa , Takatoyo Yamakami , Masumi Katayama , Shinji Hiraoka
发明人： Norio Kainuma , Hidehiko Kira , Kenji Kobae , Hiroshi Kobayashi , Katsutoshi Hirasawa , Takatoyo Yamakami , Masumi Katayama , Shinji Hiraoka
IPC分类号： G01R33/12
CPC分类号： G11B5/4555 , G11B5/455 , G11B5/4806 , G11B5/60 , G11B2005/001
摘要： The magnetic head tester of the present invention drives a medium for rotation to float a slider from the medium so as to test a magnetic head for its characteristics, and the tester includes a holder removably holding the slider opposed to the surface of the medium, and suspension means provided in the holder which has the same function as a suspension supporting the slider in a real apparatus. With this tester, tests can be executed by exchanging the slider alone, and it is unnecessary to discard the suspension even when the magnetic head is judged to be defective, thus the loss of production costs for the suspension and processing costs for assembling the slider in the suspension can be avoided.
摘要翻译：本发明的磁头测试器驱动用于旋转的介质以从介质浮动滑动器，以便测试磁头的特性，并且测试仪包括可移除地保持与介质表面相对的滑块的保持架，以及悬挂装置设置在保持器中，其具有与在实际装置中支撑滑块的悬架相同的功能。使用该测试器，可以通过单独更换滑块来执行测试，即使当磁头被判断为有缺陷时也不必丢弃悬架，因此悬架的生产成本的损失和用于组装滑块的处理成本可以避免悬浮液。

65. 发明申请

US20070020978A1 Lever-type connector 有权
标题翻译：杠杆式连接器
公开(公告)号：US20070020978A1
公开(公告)日：2007-01-25
申请号：US11442139
申请日：2006-05-30
申请人： Takao Murakami , Takanori Yamawaki , Masao Nagano , Hiroshi Kobayashi , Masato Minakata
发明人： Takao Murakami , Takanori Yamawaki , Masao Nagano , Hiroshi Kobayashi , Masato Minakata
IPC分类号： H01R13/62
CPC分类号： H01R13/6295 , H01R13/62938
摘要： A lever-type connector 10 includes female and male connector housings 41 and 11 which have respective connection terminals 50 and 51, and can be fitted together. A lock lever 17 is pivotally supported on the male connector housing 11, and engagement lock projections 46, formed on the female connector housing 41, are engaged with the lock lever 17, and in this condition the lock lever 17 is pivotally moved so as to fit the female and male connector housings 41 and 11 together. The lock lever 17 has at least one projection 27 serving as a contact point at which the lock lever contacts the male connector housing 11.
摘要翻译：杠杆式连接器10包括具有各自的连接端子50和51的阴连接器壳体41和阳连接器壳体11，并且可以装配在一起。锁定杆17枢转地支撑在阳连接器壳体11上，并且形成在阴连接器壳体41上的接合锁定突起46与锁定杆17接合，并且在该状态下，锁定杆17被枢转地移动，以便将母连接器壳体41和阳连接器壳体11配合在一起。锁定杆17具有至少一个凸起27，凸起27用作接触点，锁定杆接触阳连接器壳体11。

66. 发明申请

US20070020801A1 IC chip mounting method 失效
标题翻译： IC芯片安装方法
公开(公告)号：US20070020801A1
公开(公告)日：2007-01-25
申请号：US11324600
申请日：2006-01-04
申请人： Naoki Ishikawa , Tatsuro Tsuneno , Hidehiko Kira , Hiroshi Kobayashi
发明人： Naoki Ishikawa , Tatsuro Tsuneno , Hidehiko Kira , Hiroshi Kobayashi
IPC分类号： H01L21/00
CPC分类号： G06K19/07745 , G06K19/07718 , H01L21/67144 , H01L21/6836 , H01L24/75 , H01L24/97 , H01L2221/68327 , H01L2223/6677 , H01L2224/16225 , H01L2224/75743 , H01L2224/75822 , H01L2224/7598 , H01L2224/81203 , H01L2224/81801 , H01L2224/97 , H01L2924/14 , H01L2924/00 , H01L2224/81
摘要： The present invention provides an IC chip mounting method for mounting two or more IC chips on a base, including: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; sequentially pressing the IC chips on the wafer against a first roller to allow the chips to be sucked onto the first roller; subsequently transferring the IC chips sucked onto the first roller to a second roller; and subsequently mounting the IC chips transferred to the second roller on the traveling base.
摘要翻译：本发明提供了一种用于在基座上安装两个或更多个IC芯片的IC芯片安装方法，包括：通过在其表面上安装带来准备晶片，该晶片具有安装在其上的安装表面并且通过在离开胶带的同时通过切割将晶片分成IC芯片; 依次将晶片上的IC芯片压靠在第一辊上，以使芯片被吸入到第一辊上; 随后将吸入第一辊的IC芯片传送到第二辊; 随后将传送到第二辊的IC芯片安装在行进基座上。

67. 发明授权

US07143963B2 Rotary atomizer and coating method by it 有权
标题翻译：旋转雾化器及其涂布方法
公开(公告)号：US07143963B2
公开(公告)日：2006-12-05
申请号：US10937385
申请日：2004-09-10
申请人： Shinji Tani , Masahito Sakakibara , Michio Mitsui , Hiroshi Kobayashi , Kimiyoshi Nagai , Toshio Hosoda
发明人： Shinji Tani , Masahito Sakakibara , Michio Mitsui , Hiroshi Kobayashi , Kimiyoshi Nagai , Toshio Hosoda
IPC分类号： B05B1/32 , B05B1/28
CPC分类号： B05B7/0807 , B05B1/1681 , B05B3/1014 , B05B5/0426
摘要： A coating machine 3 serving as a rotary atomizer comprises a hollow unrotary paint nozzle shaft 5 provided in the center of a motor shaft 10 serving as its rotary shaft. The paint nozzle shaft 5 is provided at a tip thereof with a gun-spray paint nozzle 5g and a gun-spray air nozzle 5f on the outside of the gun-spray paint nozzle 5g in the diametrical direction, and a needle shaft 21 is disposed in a paint passage 5b in the paint nozzle shaft 5 so as to serve as a valve mechanism for selectively supplying paint to either a bell cup 4 or the gun-spray paint nozzle 5g.
摘要翻译：作为旋转雾化器的涂布机3包括设置在作为其旋转轴的电机轴10的中心的中空的非旋转涂料喷嘴轴5。油漆喷嘴轴5的前端在喷枪喷嘴5g的直径方向的外侧设有喷枪喷嘴5g和喷枪喷嘴5f，针轴 21设置在涂料喷嘴轴5中的涂料通道5b中，以用作用于选择性地向钟形杯4或喷枪涂料喷嘴5g供应涂料的阀机构。

68. 发明申请

US20060240716A1 Connector 有权
公开(公告)号：US20060240716A1
公开(公告)日：2006-10-26
申请号：US11395308
申请日：2006-04-03
申请人： Seiji Kozono , Takashi Matsunaga , Hiroshi Kobayashi , Masato Minakata , Atsushi Nishida
发明人： Seiji Kozono , Takashi Matsunaga , Hiroshi Kobayashi , Masato Minakata , Atsushi Nishida
IPC分类号： H01R13/502
CPC分类号： H01R13/6315
摘要： A connector includes a female connector housing, that has a male terminal, and a male connector housing that has a female terminal for electrical connecting to the male terminal, and that is adapted to be fitted into the female connector. The male connector housing includes an inner housing which has the female terminal, and which is adapted to be fitted in the female connector housing so that the female terminal is connected to the male terminal, and an outer housing which is adapted to support the inner housing so that the inner housing is movable in a first direction in which the inner housing is fitted in the female connector housing and in a second direction perpendicular to the first direction. When the inner housing is fitted into the female connector housing, the inner housing is disposed so as to separate from the outer housing in the second direction with a first gap.

69. 发明申请

US20060236928A1 Treating solution supply nozzle, a substrate treating apparatus having this nozzle, and a method of manufacturing a treating solution supply nozzle 有权
标题翻译：处理溶液供给喷嘴，具有该喷嘴的基板处理装置以及处理液供给喷嘴的制造方法
公开(公告)号：US20060236928A1
公开(公告)日：2006-10-26
申请号：US11472612
申请日：2006-06-22
申请人： Shigehiro Goto , Hiroshi Kobayashi
发明人： Shigehiro Goto , Hiroshi Kobayashi
IPC分类号： B05B7/16
CPC分类号： H01L21/6715 , B05C11/08 , B05C11/1042
摘要： A resin block has a treating solution channel extending between and opening at front and back surfaces thereof. Heat conductive members are face-bonded to the front and back surfaces of the resin block, respectively, for closing the channel. Consequently, no air is present between the resin block and heat conduction members, thereby improving the efficiency of heat exchange. A nozzle of simple construction is realized only by face-bonding the two heat conductive members to the open front and rear surfaces of the resin block. Temperature control plates hold the heat conductive m embers along with the resin block to effect a temperature control, whereby the temperature of a treating solution in the treating solution channel is controlled effectively through the heat conductive members. The treating solution adjusted to a desired temperature is delivered from a discharge opening to a substrate for performing substrate treatment with high accuracy.
摘要翻译：树脂块具有在其前表面和后表面之间延伸并在其前后开口的处理溶液通道。导热构件分别面对粘合到树脂块的前表面和后表面，用于封闭通道。因此，树脂块和导热构件之间不存在空气，从而提高热交换的效率。仅通过将两个导热构件面对粘合到树脂块的敞开的前表面和后表面上来实现简单结构的喷嘴。温度控制板与树脂块一起保持导热填料以进行温度控制，由此通过导热构件有效地控制处理溶液通道中的处理溶液的温度。调节到期望温度的处理溶液从排出口输送到基板，以高精度进行基板处理。

70. 发明申请

US20060214195A1 Solid-state imaging device 有权
标题翻译：固态成像装置
公开(公告)号：US20060214195A1
公开(公告)日：2006-09-28
申请号：US11249332
申请日：2005-10-14
申请人： Hiroshi Kobayashi , Katsuyoshi Yamamoto , Tadao Inoue , Toshitaka Mizuguchi
发明人： Hiroshi Kobayashi , Katsuyoshi Yamamoto , Tadao Inoue , Toshitaka Mizuguchi
IPC分类号： H01L29/768
CPC分类号： H01L27/14636 , H01L27/14609 , H01L27/14621 , H01L27/14625 , H01L27/14629 , H01L27/14643 , H01L27/14685
摘要： A solid-state imaging device has a substrate in which are formed a pixel array portion having a plurality of pixels, and a peripheral circuitry portion. The device is characterized in that a first multilevel metallization structure is formed over the peripheral circuitry portion, and a second multilevel metallization structure thinner than the first multilevel metallization structure is formed over the pixel array portion.
摘要翻译：固态成像装置具有其中形成有具有多个像素的像素阵列部分和外围电路部分的基板。该器件的特征在于，在外围电路部分上形成第一多层金属化结构，并且在像素阵列部分上形成比第一多层金属化结构更薄的第二多层金属化结构。

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