专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明申请

US20130065136A1 LITHIUM ION SECONDARY BATTERY 审中-公开
标题翻译：锂离子二次电池
公开(公告)号：US20130065136A1
公开(公告)日：2013-03-14
申请号：US13697988
申请日：2011-06-17
申请人： Hideaki Sasaki , Takehiro Noguchi , Shinako Kaneko
发明人： Hideaki Sasaki , Takehiro Noguchi , Shinako Kaneko
IPC分类号： H01M10/0569
CPC分类号： H01M10/0525 , H01M4/505 , H01M4/525 , H01M10/0567 , H01M10/0569 , Y02T10/7011
摘要： A lithium ion secondary battery which meets the requirement [1] of satisfying the formulae (a) to (c) or the requirement [2] of satisfying the formulae (b), (d), and (e): (a) 5≦A≦25, (b) 10≦B≦60, (c) 40≦2A+B≦90, (d) 0.2≦C≦1.2, and (e) −80 200C
摘要翻译：满足式（a）〜（c）或满足式（b），（d）和（e）的要求[2]的要求[1]的锂离子二次电池：（a）5＆ ;（e）-80 200℃<3B＆nlE; 150，（b）10＆amp; NlE; B＆nlE; 60，（c）40和nlE; 2A + B和n; 90，（d）0.2＆ μm）表示正极活性物质的平均粒径; B（体积％）表示非水电解液中氟化醚的体积浓度; C（m2 / g）表示正极活性物质的比表面积。

62. 发明申请

US20130011747A1 LITHIUM ION SECONDARY BATTERY 审中-公开
标题翻译：锂离子二次电池
公开(公告)号：US20130011747A1
公开(公告)日：2013-01-10
申请号：US13635596
申请日：2011-03-18
申请人： Hideaki Sasaki , Takehiro Noguchi
发明人： Hideaki Sasaki , Takehiro Noguchi
IPC分类号： H01M10/056
CPC分类号： H01M4/0404 , C01B32/05 , C01B32/20 , H01M4/133 , H01M4/1393 , H01M4/587 , H01M4/625 , H01M10/052 , H01M10/0567 , Y02T10/7011
摘要： There is provided a lithium ion secondary battery excellent in cycle characteristics in which the conductivity of an electrode using a graphite material which is less deformed and oriented by pressurization is improved. A negative electrode mixture which includes at least a negative electrode active material comprising graphite as a main component, a binder, and a conductive aid has a ratio of a peak intensity of a (002) plane to a peak intensity of a (110) plane in an X-ray diffraction spectrum of 30 or more and 70 or less, the spectrum being measured after the negative electrode mixture is pressed at 98 MPa (1000 kgf/cm2), and the conductive aid includes carbon black having a DBP absorption (cm3/100 g) of 250 or more and 500 or less.
摘要翻译：提供了一种循环特性优异的锂离子二次电池，其中使用较少变形并通过加压取向的石墨材料的电极的导电性提高。至少包括以石墨作为主要成分的负极活性物质，粘合剂和导电助剂的负极混合物具有（002）面的峰强度与（110）面的峰强度的比在30以上且70以下的X射线衍射光谱中，在98MPa（1000kgf / cm 2）下对负极混合物进行压制后测定的光谱，导电助剂包含DBP吸收量为（cm3 / 100g）为250以上且500以下。

63. 发明授权

US07257058B2 Offset adjusting circuit for optical disc and offset adjusting method 有权
标题翻译：光盘偏移调整电路及偏移调整方法
公开(公告)号：US07257058B2
公开(公告)日：2007-08-14
申请号：US10850789
申请日：2004-05-20
申请人： Hideaki Sasaki
发明人： Hideaki Sasaki
IPC分类号： G11B7/00
CPC分类号： G11B7/094
摘要： An offset adjusting circuit for an optical disc comprises an offset-adjustment differential operational amplifier having an input terminal to which an output signal of an optical pickup is input and the other input terminal to which a control voltage is applied, an A/D converter that outputs a digital signal based on an output signal of the offset-adjustment differential operational amplifier, and a control voltage adjuster that varies the control voltage applied to the offset-adjustment differential operational amplifier based on the digital signal so as to remove an offset.
摘要翻译：一种用于光盘的偏移调整电路包括偏移调整差分运算放大器，其具有输入端，光拾取器的输出信号被输入到该输入端，另一个输入端施加到控制电压; A / D转换器，基于偏移调整差分运算放大器的输出信号输出数字信号，以及控制电压调节器，其基于数字信号改变施加到偏移调整差分运算放大器的控制电压，以消除偏移。

64. 发明授权

US06533162B2 Paste providing method, soldering method and apparatus and system therefor 失效
标题翻译：糊剂提供方法，焊接方法及其设备及系统
公开(公告)号：US06533162B2
公开(公告)日：2003-03-18
申请号：US09733096
申请日：2000-12-11
申请人： Fumio Yoshikawa , Hideyuki Fukasawa , Mitsugu Shirai , Hideaki Sasaki , Toshitaka Murakawa , Kenichi Hamamura
发明人： Fumio Yoshikawa , Hideyuki Fukasawa , Mitsugu Shirai , Hideaki Sasaki , Toshitaka Murakawa , Kenichi Hamamura
IPC分类号： B23K3102
CPC分类号： H05K3/3484 , B23K3/0638 , B23K2101/42 , H05K3/1216 , H05K3/1233 , H05K3/3415 , H05K3/3447 , H05K3/42 , H05K2201/09572 , H05K2203/0143
摘要： An improved soldering system which reduces the numbers of steps for paste supply and soldering in soldering lead provided parts and surface mounting parts onto a printed circuit board. A printed circuit board has through holes through which a lead of each lead provided part is to be inserted and lands for surface mounting parts. A printing mask is matched with the through holes and lands and a paste receiving plate having holes to which solder paste is to be supplied corresponding to each of the through holes is disposed. A printing roller is swept by forcibly rotating it so as to fill with solder paste, then a printing squeegee is swept following that printing roller so as to further fill with solder paste. Parts are loaded on the through holes and lands of the printed circuit board loaded with solder paste and reflowing is carried out on the printed circuit board and paste receiving plate at the same time, so that the lead provided parts and surface mounting parts are soldered to the printed circuit board at the same time.
摘要翻译：一种改进的焊接系统，其减少了在焊接引线中的糊料供应和焊接的步骤数量，将部件和表面安装部件提供到印刷电路板上。印刷电路板具有通孔，每个引线设置部分的引线将被插入，并且用于表面安装部件的平台。印刷掩模与通孔和焊盘匹配，并且设置具有孔的糊状物接收板，相应于每个通孔向其供应焊膏。通过将印刷辊强制旋转以便填充焊膏，然后在该印刷辊之后扫描印刷刮板，以进一步填充焊膏。部件装载在装载有焊锡膏的印刷电路板的通孔和平台上，并且同时在印刷电路板和糊状物接收板上进行回流，使得引线提供部件和表面安装部件被焊接到印刷电路板同时进行。

65. 发明授权

US06423405B1 Surface reformation method of high polymer material 失效
标题翻译：高分子材料表面改性方法
公开(公告)号：US06423405B1
公开(公告)日：2002-07-23
申请号：US09384105
申请日：1999-08-27
申请人： Tsutomu Shibuya , Kaoru Katayama , Mitugu Shirai , Shinichi Kazui , Hideaki Sasaki , Yasuhiro Iwata
发明人： Tsutomu Shibuya , Kaoru Katayama , Mitugu Shirai , Shinichi Kazui , Hideaki Sasaki , Yasuhiro Iwata
IPC分类号： B32B712
CPC分类号： H01L21/6835 , H01L21/563 , H01L24/81 , H01L2224/16 , H01L2224/73203 , H01L2224/81191 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H05K3/22 , H05K3/303 , H05K3/305 , H05K3/3436 , H05K3/3452 , H05K2201/0154 , H05K2201/10674 , H05K2201/10734 , H05K2203/0783 , H05K2203/107 , Y02P70/613 , Y10T29/49144 , Y10T428/24917 , Y10T428/2809 , H01L2924/00
摘要： There is disclosed a surface reformation method of a high polymer material such that by irradiating and excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface, wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be soldered with preferable durability by a fluxess reflow soldering.
摘要翻译：公开了一种高分子材料的表面改性方法，使得通过仅在其上将电子部件等暂时固定在预定区域上的预定区域照射和准分子激光束，所述预定区域通过液体在具有高聚合物层的基底上仅用于临时固定的液体的表面润湿性相对于预定面积得到改善。在通过使用该方法将电子部件暂时固定在基板上之后，可以通过无电流回流焊接将电子部件焊接在优选的耐久性上。

66. 发明授权

US06249242B1 High-frequency transmitter-receiver apparatus for such an application as vehicle-onboard radar system 失效
标题翻译：用于诸如机载车载雷达系统的高频发射机 - 接收机设备
公开(公告)号：US06249242B1
公开(公告)日：2001-06-19
申请号：US09369400
申请日：1999-08-06
申请人： Kenji Sekine , Hiroshi Kondoh , Keigo Kamozaki , Hideyuki Nagaishi , Kazuo Matsuura , Terumi Nakazawa , Michio Tanimoto , Hideaki Sasaki , Yuzo Taniguchi
发明人： Kenji Sekine , Hiroshi Kondoh , Keigo Kamozaki , Hideyuki Nagaishi , Kazuo Matsuura , Terumi Nakazawa , Michio Tanimoto , Hideaki Sasaki , Yuzo Taniguchi
IPC分类号： G01S1393
CPC分类号： H01L23/66 , G01S7/03 , G01S7/032 , G01S2013/9325 , H01L24/48 , H01L2223/6627 , H01L2223/6677 , H01L2224/05599 , H01L2224/48091 , H01L2224/85399 , H01L2924/00014 , H01L2924/0102 , H01L2924/01078 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/1517 , H01L2924/16152 , H01L2924/1903 , H01Q1/3233 , H01Q21/0087 , H01Q23/00 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A high-frequency transmitter-receiver apparatus includes a transceiver circuit realized in a planar structure by a dielectric substrate and a semiconductor chip and a planar antenna formed on a dielectric substrate are provided on front and rear surfaces, respectively, of a single electrically conductive base plate. Signal lines of the planar circuit and the planar antenna are electrically interconnected by a coaxial line which extends through said base plate.
摘要翻译：一种高频发射机 - 接收机设备包括分别由介质基片和半导体芯片实现的平面结构的收发器电路以及形成在电介质基片上的平面天线分别设置在单个导电基底盘子。平面电路和平面天线的信号线通过延伸穿过所述基板的同轴线电互连。

67. 发明授权

US06196441B1 Solder bump measuring method and apparatus 失效
标题翻译：焊点测量方法和装置
公开(公告)号：US06196441B1
公开(公告)日：2001-03-06
申请号：US09289386
申请日：1999-04-12
申请人： Yutaka Hashimoto , Hideaki Sasaki , Mamoru Kobayashi , Shinichi Kazui
发明人： Yutaka Hashimoto , Hideaki Sasaki , Mamoru Kobayashi , Shinichi Kazui
IPC分类号： B23K3102
CPC分类号： H05K13/08 , G01B11/0608 , H01L22/12
摘要： A method of measuring solder bumps formed on a substrate mounting a semiconductor element thereon includes mounting a work to be measured on a work position mechanism, and scanning the work by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be satisfactory.
摘要翻译：测量在其上安装半导体元件的衬底上形成的焊料凸块的方法包括：将待测量的工件安装在工件位置机构上，并通过光学微头扫描工件以测量工件的安装姿势的误差。控制每个阶段以校正误差，然后扫描和测量凸块的顶点位置。测量结果由个人计算机收集，测量结果连同每个轴的控制数据发送到主个人计算机并显示在其屏幕上。从回归平面计算每个凸起的顶点位置的误差，如果误差小于参考值，则判断为满意。

68. 发明授权

US06193144B1 Paste providing method, soldering method and apparatus and system therefor 失效
标题翻译：糊剂提供方法，焊接方法及其设备及系统
公开(公告)号：US06193144B1
公开(公告)日：2001-02-27
申请号：US09102212
申请日：1998-06-22
申请人： Fumio Yoshikawa , Hideyuki Fukasawa , Mitsugu Shirai , Hideaki Sasaki , Toshitaka Murakawa , Kenichi Hamamura
发明人： Fumio Yoshikawa , Hideyuki Fukasawa , Mitsugu Shirai , Hideaki Sasaki , Toshitaka Murakawa , Kenichi Hamamura
IPC分类号： B23K500
CPC分类号： H05K3/3484 , B23K3/0638 , B23K2101/42 , H05K3/1216 , H05K3/1233 , H05K3/3415 , H05K3/3447 , H05K3/42 , H05K2201/09572 , H05K2203/0143
摘要： An improved soldering system which reduces the numbers of steps for paste supply and soldering in soldering lead provided parts and surface mounting parts onto a printed circuit board. A printed circuit board has through holes through which a lead of each lead provided part is to be inserted and lands for surface mounting parts. A printing mask is matched with the through holes and lands and a paste receiving plate having holes to which solder paste is to be supplied corresponding to each of the through holes is disposed. A printing roller is swept by forcibly rotating it so as to fill with solder paste, then a printing squeegee is swept following that printing roller so as to further fill with solder paste. Parts are loaded on the through holes and lands of the printed circuit board loaded with solder paste and reflowing is carried out on the printed circuit board and paste receiving plate at the same time, so that the lead provided parts and surface mounting parts are soldered to the printed circuit board at the same time.
摘要翻译：一种改进的焊接系统，其减少了在焊接引线中的糊料供应和焊接的步骤数量，将部件和表面安装部件提供到印刷电路板上。印刷电路板具有通孔，每个引线设置部分的引线将被插入，并且用于表面安装部件的平台。印刷掩模与通孔和焊盘匹配，并且设置具有孔的糊状物接收板，相应于每个通孔向其供应焊膏。通过将印刷辊强制旋转以便填充焊膏，然后在该印刷辊之后扫描印刷刮板，以进一步填充焊膏。部件装载在装载有焊锡膏的印刷电路板的通孔和平台上，同时在印刷电路板和糊状物接收板上进行回流，使得引线提供部件和表面安装部件被焊接到印刷电路板同时进行。

69. 发明授权

US6137687A Printed circuit board, IC card, and manufacturing method thereof 失效
标题翻译：印刷电路板，IC卡及其制造方法
公开(公告)号：US6137687A
公开(公告)日：2000-10-24
申请号：US487171
申请日：2000-01-19
申请人： Mitsugu Shirai , Shinichi Kazui , Hideaki Sasaki , Keiji Fujikawa , Makoto Matsuoka
发明人： Mitsugu Shirai , Shinichi Kazui , Hideaki Sasaki , Keiji Fujikawa , Makoto Matsuoka
IPC分类号： H01L23/498 , H05K3/46 , H05K1/18
CPC分类号： H05K3/4664 , H01L23/49855 , H01L2224/16225 , H01L2924/01322 , Y10T29/49126 , Y10T29/4913
摘要： In a method for manufacturing a printed circuit board, this printed circuit board can be manufactured by executing a simple manufacturing step within a short time period at in low cost without requiring a complex manufacturing process. A conductive material is pattern-printed on a base board and the printed conductive material is hardened to form a first conductor layer. Subsequently, an insulating material is pattern-printed on the first conductor layer, and the printed insulating material is hardened to thereby form a first insulating layer. A manufacturing step similar to the above-described step is repeatedly performed to thereby form a second conductor layer, a second insulating layer, and a third conductor layer. Furthermore, a manufacturing step similar to the above-explained step is repeatedly performed, so that a printed circuit board having a multi-conductor layer can be manufactured.
摘要翻译：在制造印刷电路板的方法中，该印刷电路板可以通过在短时间内以低成本执行简单的制造步骤而不需要复杂的制造工艺来制造。将导电材料图案印刷在基板上，并且印刷的导电材料被硬化以形成第一导体层。随后，将绝缘材料图案印刷在第一导体层上，并且印刷的绝缘材料被硬化从而形成第一绝缘层。重复执行类似于上述步骤的制造步骤，从而形成第二导体层，第二绝缘层和第三导体层。此外，重复进行与上述步骤类似的制造步骤，从而可以制造具有多导体层的印刷电路板。

70. 发明授权

US6069701A Method and apparatus for measuring the height of an object 失效
标题翻译：测量物体高度的方法和装置
公开(公告)号：US6069701A
公开(公告)日：2000-05-30
申请号：US982509
申请日：1997-12-02
申请人： Yutaka Hashimoto , Hideaki Sasaki , Shinichi Kazui
发明人： Yutaka Hashimoto , Hideaki Sasaki , Shinichi Kazui
IPC分类号： G01B11/02 , G01B11/06 , G01N21/88 , H01L21/60 , G01B11/24 , G01B11/00 , G01N21/00
CPC分类号： G01B11/0608 , G01N21/88
摘要： A method and an apparatus for measuring the height of an apex of an object with high accuracy without influence of the surface state of the object are disclosed. Correlation coefficients of respective positions of a waveform formed from digital data indicative of the height of the object detected by a head portion of a detector and a previously prepared standard waveform are calculated while moving the waveforms in the vertical and horizontal directions and the height of an apex position of the standard waveform at a position having a largest correlation coefficient from the calculated result is decided as the height of the apex of the object. Accordingly, the height of the apex can be decided from the whole detected waveforms without influence of local abnormality of the reflected light quantity waveform due to minute ruggedness or discoloration of the surface of the object.
摘要翻译：公开了一种用于在不影响物体的表面状态的情况下以高精度测量物体顶点的高度的方法和装置。计算表示由检测器的头部检测到的物体的高度的数字数据和预先准备的标准波形形成的波形的相应位置的相关系数，同时移动垂直和水平方向上的波形以及在从计算结果具有最大相关系数的位置处的标准波形的顶点位置被确定为对象的顶点的高度。因此，顶点的高度可以由整个检测波形确定，而不受由于物体表面的微小的凹凸或变色而引起的反射光量波形的局部异常的影响。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式