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    • 69. 发明授权
    • Method and apparatus for sensing temperature
    • 检测温度的方法和装置
    • US07598722B1
    • 2009-10-06
    • US11589846
    • 2006-10-30
    • Ohad Falik
    • Ohad Falik
    • G01N27/00G01K7/00H03K5/22H01L35/00
    • G01K15/00G01K7/01
    • Method and system for periodically measuring the junction temperature of a semiconductor device. The junction exited by at least two sequential predetermined currents of different magnitudes. The voltage response of the junction to the at least two currents is measured and the temperature of the junction is calculated, while substantially canceling ohmic effects, by using the voltage response and a correction factor obtained by periodically. Whenever desired, the junction is exited by a set of at least four sequential different currents having known ratios. The voltage response to the set is measured and the correction factor is calculated by using each voltage response to the set.
    • 用于周期性测量半导体器件的结温的方法和系统。 接点由不同幅度的至少两个顺序的预定电流退出。 测量结到至少两个电流的电压响应,并且通过使用电压响应和通过周期性获得的校正因子来计算结点的温度,同时基本上消除欧姆效应。 无论何时,通过一组具有已知比例的至少四个顺序的不同电流退出结。 测量对该组的电压响应,并通过使用对该组的每个电压响应来计算校正因子。