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    • 61. 发明专利
    • GAS RATE SENSOR
    • JPH06331643A
    • 1994-12-02
    • JP11741693
    • 1993-05-19
    • HONDA MOTOR CO LTD
    • HOSOI TAKASHIDOI MIZUHOFUEKI NOBUHIROKURIYAMA NARIAKI
    • G01C19/00G01P9/00
    • PURPOSE:To provide a high-sensitivity gas rate sensor the offset voltage value of which is not fluctuated even with increase in the rate of flow of gas and the resistance value of which is hardly varied. CONSTITUTION:A gas rate sensor chip 1 comprises a lower semiconductor substrate 2 and an upper semiconductor substrate 3 combined to each other. The lower semiconductor substrate 2 is in the form of half of a box with a semigroove etched therein, with a warped heat wire bridge 5 stretched over the upper sides 4a, 4b of the longitudinal side walls thereof. A pair of detecting portions 6a, 6b for detecting change in the direction of gas flow is provided on the center side face of the heat wire bridge 5. The lower half of a gas injection hole 7 is formed in the opposite position to the detecting portions 6a, 6b. The upper semiconductor substrate 3 is also in the form of half of a box with a semigroove etched therein and a gas inlet 8 and a gas outlet 9 bored through the bottom face thereof near both of the longitudinal end portions thereof. The upper half of the gas injection hole 7 (not shown in the figure) is formed near the center of the gas inlet 8.
    • 62. 发明专利
    • 電解液供給型電池及びその操作方法
    • 电解电源类型电池及其操作方法
    • JP2014212048A
    • 2014-11-13
    • JP2013088012
    • 2013-04-19
    • 本田技研工業株式会社Honda Motor Co Ltd
    • DAN KOJIKURIYAMA NARIAKIFUJIWARA YOSHINARI
    • H01M2/40H01M10/04H01M10/0566H01M10/058
    • H01M10/04H01M10/05H01M2/40
    • 【課題】電解液供給型電池が休止状態にある際、活物質が変質することを回避するとともに自己放電を抑制する。【解決手段】電解液供給型電池10の筐体12には、電解液54を供給するための第1供給ライン30と、電解液としては機能しない液体(溶媒56)を供給するための第2供給ライン32及び第3供給ライン34が接続される。正極20及び負極16に電極反応を生起させて充放電(運転)を行うときには、第1供給ライン30から電解液54を供給するとともに、第2供給ライン32及び第3供給ライン34から溶媒56を供給する。筐体12内では、第2供給ライン32から供給された溶媒56と、第3供給ライン34から供給された溶媒56との間に電解液54が挟まれるように3層となった状態で、電解液54及び溶媒56が流通する。【選択図】図2
    • 要解决的问题:为了避免活性物质的变化,并且当电解质供给型电池处于休眠状态时抑制自放电。解决方案:用于供应电解质54和第二供应管线32的第一供应管线30和第三供应源 用于供给不用作电解质的液体(溶剂56)的管线34与电解质供给型电池10的壳体12连接。当在正极20和负极16中引起电极反应以进行充电 /放电(操作)时,电解质54从第一供应管线30供应,并且溶剂56从第二供应管线32和第三供应管线34供应。在壳体12中,电解质54和溶剂56在 电解质54被从第二供给管线32供给的溶剂56和从第三供给管线34供给的溶剂56夹持而形成三层的状态。
    • 63. 发明专利
    • Force sensor and manufacturing method therefor
    • 其传感器及其制造方法
    • JP2008051624A
    • 2008-03-06
    • JP2006227466
    • 2006-08-24
    • Honda Motor Co Ltd本田技研工業株式会社
    • KURIYAMA NARIAKISASAHARA JUNKUBOTA TADAHIROOKAMURA DAISUKEOSATO TAKESHI
    • G01L1/18H01L29/84
    • G01L1/2268G01L5/162Y10T29/49103Y10T29/49117Y10T29/49124Y10T29/49155
    • PROBLEM TO BE SOLVED: To prevent any bonding from degrading when a force sensor-use chip and a damping device are subjected to an anodic bonding through a glass layer. SOLUTION: A manufacturing method for a force sensor which includes the force sensor-use chip 2 for detecting a transmitted external force F by using a strain-resistance element and the damping device 3 for fixing the force sensor-use chip 2 and transmitting the external force F to the force sensor-use chip while damping it, and which is made up such that the force sensor-use chip 2 is bonded to the damping device 3 through the glass layer, comprises: a step (a) of forming a glass thin film 10 as the glass layer on the force sensor-use chip 2; and a step (b) of bonding the glass thin film 10 formed on the force sensor-use chip 2 to the damping device 3 by using the anodic bonding which applies a negative voltage to the force sensor-use chip 2 side, and a positive voltage to the damping device 3 side. Moreover, the glass thin film 10 is formed by using an evaporation method or a sputtering method. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:为了防止当力传感器使用的芯片和阻尼装置通过玻璃层进行阳极接合时的任何接合降解。 解决方案:一种用于力传感器的制造方法,其包括通过使用应变阻力元件检测传递的外力F的力传感器用芯片2和用于固定力传感器用芯片2的阻尼装置3, 将力F传递到力传感器使用芯片同时进行阻尼,并且将力传感器用芯片2通过玻璃层结合到阻尼装置3构成为包括:步骤(a), 在力传感器用芯片2上形成作为玻璃层的玻璃薄膜10; 以及通过使用向力传感器用芯片2侧施加负电压的阳极接合将形成在力传感器用芯片2上的玻璃薄膜10与阻尼装置3接合的工序(b) 电压到阻尼装置3侧。 此外,通过使用蒸发法或溅射法形成玻璃薄膜10。 版权所有(C)2008,JPO&INPIT
    • 64. 发明专利
    • Method for manufacturing fine carbon fiber
    • 制造精细碳纤维的方法
    • JP2006069805A
    • 2006-03-16
    • JP2004251437
    • 2004-08-31
    • Honda Motor Co Ltd本田技研工業株式会社
    • OKAMURA DAISUKESASAHARA JUNKUBOTA TADAHIROKURIYAMA NARIAKI
    • C01B31/02B01J23/745D01F9/127
    • PROBLEM TO BE SOLVED: To provide a method for manufacturing a long fine carbon fiber by a thermal CVD method. SOLUTION: A substrate 1 having a catalyst metal layer 3 is treated by the CVD method under the stream of a gaseous starting material containing a reducing gas at a predetermined treating temperature. The mixing ratio of the reducing gas to the gaseous starting material is 0.5-1.5, and the treating temperature is 250-900°C. The gaseous starting material is a hydrocarbon gas or an alcohol gas. The reducing gas is one kind selected from H 2 , NH 3 , O 2 , CF 4 and SF 6 . The substrate 1 has a diffusion prevention layer 4 comprising any of nitrides, oxides or carbides, preferably silicon nitride or silicon oxide between a base body 2 and the catalyst metal layer 3. The substrate 1 is accommodated in a reaction furnace 11, and after filling the gaseous starting material containing the reducing gas and a carrier gas, only the carrier gas is filled. Thereafter, the inside of the reaction furnace is heated to the treating temperature under the gas stream comprising only the carrier gas or the carrier gas and the reducing gas, and the substrate 1 is treated by the CVD method under the gas stream comprising the gaseous starting material containing the reducing gas and the carrier gas. COPYRIGHT: (C)2006,JPO&NCIPI
    • 待解决的问题:提供通过热CVD法制造长细碳纤维的方法。 解决方案:具有催化剂金属层3的基板1通过CVD法在预定处理温度下在含有还原气体的气态原料流下进行处理。 还原气体与气态原料的混合比为0.5〜1.5,处理温度为250〜900℃。 气态原料是烃气体或醇气体。 还原气体是从H 2 ,NH 3 ,O 2 ,CF 4 和SF < SB> 6 。 基板1具有在基体2和催化剂金属层3之间包含氮化物,氧化物或碳化物,优选氮化硅或氧化硅中的任一种的扩散防止层4.基板1容纳在反应炉11中,填充后 含有还原气体和载气的气态原料仅填充载气。 此后,在仅包含载气或载气和还原气体的气流下将反应炉的内部加热至处理温度,并且通过CVD法在包括气体起始 含有还原气体和载气的材料。 版权所有(C)2006,JPO&NCIPI
    • 66. 发明专利
    • FUEL CELL
    • JP2002141084A
    • 2002-05-17
    • JP2001135048
    • 2001-05-02
    • HONDA MOTOR CO LTD
    • KUBOTA TADAHIROSASAHARA JUNKURIYAMA NARIAKIISOTANI YUJI
    • H01M4/86H01M4/88H01M8/02H01M8/04H01M8/10H01M8/24
    • PROBLEM TO BE SOLVED: To provide a fuel cell which can easily secure electric contact of an electrode terminal for connection outside with a diffusion electrode layer, and can be further miniaturized without deteriorating the rate of diffusion of fuel and oxidant. SOLUTION: With the fuel battery composed of more than one cells each provided with an electrolyte layer, a pair of diffusion electrode layers pinching the electrolyte layer, and a pair of distribution boards for dividing into passages of fuel and oxidant in contact with each diffusion electrode layer, contact resistance of the distribution boards and the diffusion electrode layers can be lowered to improve power generation efficiency by the fact that the former each has a center concave part with a number of juts inside on each having an electrode terminal film formed on it and the latter has a porous film made on each distribution board so as to cover the concave part of each distribution board to divide each passage as well as to cover the electrode terminal film of each jut. Further, since the porous films are made directly on the distribution board by a film-forming method, film thickness of the diffusion electrode layer can be freely controlled, fuel battery cells can be made thin, and therefore, a whole device can be made compact.
    • 67. 发明专利
    • FLUID ROTATION TYPE ANGULAR VELOCITY SENSOR
    • JPH116733A
    • 1999-01-12
    • JP19631297
    • 1997-06-17
    • HONDA MOTOR CO LTD
    • HOSOI TAKASHIKURIYAMA NARIAKI
    • G01C19/14G01C19/42
    • PROBLEM TO BE SOLVED: To obtain a microminiaturized and highly accurate angular velocity sensor by circulating a fluid to a hollow part of a ring tiltably supported to detect a displacement as caused by the tilting of the ring when an angular velocity works about a passage. SOLUTION: When an angular velocity motion is applied to make an angular velocity work about a passage of a ring 3, a Coriolis force F vertically works to tilt the ring 3. The angular velocity applied to the ring 3 can be detected by measuring the direction of the tilting of the ring 3 and the displacement thereof. The detection accuracy of the angular velocity can be easily enhanced by increasing the velocity of a fluid circulating through the passage of the ring 3. The fluid rotation type angular velocity sensor thus arranged has no rotation mechanism and hence, improves endurance and reliability with neither degrading in performance nor breakage, thereby achieving effective microminiaturization by a micromachining. This also enables effectively inhibiting of erroneous detection with respect to acceleration posing a problem in the conventional gyrotop.
    • 68. 发明专利
    • MANUFACTURE OF SEMICONDUCTOR GAS RATE SENSOR
    • JPH07218527A
    • 1995-08-18
    • JP1292494
    • 1994-02-04
    • HONDA MOTOR CO LTD
    • FUEKI NOBUHIROINABA ATSUSHIKURIYAMA NARIAKI
    • G01C19/00G01F1/684G01P9/00
    • PURPOSE:To establish a method of manufacturing a semiconductor gas rate sensor which can prevent an adhesive from flowing out to a nozzle hole and produce a good flow of the gas. CONSTITUTION:A semiconductor gas rate sensor is formed by adhering together the first semiconductor base board 1 and the second semiconductor base board 3 which is provided with a thermo-setting adhesive layer 2 on its joint surface and is equipped internally with a substrate 6 having a gas flow path 4 and a nozzle hole 5 for spouting of a gas into the gas flow path. In this substrate 6, sensing parts 7, 8 to sense the gas stream deflecting condition when an angular velocity is applied to the substrate 6 are furnished in such a way as striding the gas flow path 4. The nozzle hole 5 is formed by joining a groove 12 formed at the joint surface of the first board 1 with the joining surface of the second board 3. In manufacture of such a semiconductor gas rate sensor, the first and second boards 1, 3 are joined together and heated in the condition that the second is situated under so that the two members are adhered fast to each other.