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61. 发明专利

JP2004112160A High frequency circuit 审中-公开
标题翻译：高频电路
公开(公告)号：JP2004112160A
公开(公告)日：2004-04-08
申请号：JP2002269856
申请日：2002-09-17
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： HAYASHI KENJI
IPC分类号： H01P5/02 , H04B1/04 , H04B1/3822 , H04B1/40
摘要： PROBLEM TO BE SOLVED: To provide a high frequency circuit in which a harmonic wave attenuation value in an unnecessary frequency band is maximized by suppressing an insertion loss in a necessary fundamental frequency band to a minimum. SOLUTION: The high frequency circuit includes a high frequency amplifier circuit, and a high frequency circuit of a rear stage for next processing a high frequency signal amplified by the amplifier circuit connected via a phase regulating circuit thereto. The high frequency circuit has the relationship between an impedance Z1 when the high frequency amplifier circuit is seen from a reference surface of the phase regulating circuit from the high frequency amplifier circuit side, and an impedance Z2 when the high frequency circuit of the rear stage is seen from the reference surface in a frequency of n times (n: 2 or more natural number) as large as the fundamental frequency of the high frequency amplified by the high frequency amplifier circuit, having a relation of 180°±120° of a phase θ2 of the Z2 to θ1 when the phase of the relation of a conjugate matching of the phase θ of the Z1 is θ1. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：通过将必要的基本频带的插入损耗抑制到最小来提供其中不必要频带中的谐波衰减值最大化的高频电路。解决方案：高频电路包括高频放大器电路和后级的高频电路，用于下一次处理由经由相位调节电路连接的放大器电路放大的高频信号。高频电路具有从高频放大器电路侧的相位调整电路的基准面观察高频放大器电路时的阻抗Z1与后级的高频电路之间的阻抗Z2 从参考表面以与由高频放大器电路放大的高频的基频一样大的n倍（n：2或更多自然数）的频率看，具有180°±120°相位的关系当Z1的相位θ的共轭匹配的关系的相位为θ1时，Z2的θ2为θ1。版权所有（C）2004，JPO

62. 发明专利

JP2010186880A Multilayer ceramic substrate, electronic component using the same and method for manufacturing the multilayer ceramic substrate 有权
标题翻译：多层陶瓷基板，使用其的电子部件和制造多层陶瓷基板的方法
公开(公告)号：JP2010186880A
公开(公告)日：2010-08-26
申请号：JP2009030288
申请日：2009-02-12
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： HAYASHI KENJI , IKEDA HATSUO , JINNAI KAORU , UCHIDA MASAYUKI
IPC分类号： H05K3/46 , H01L23/12 , H01L23/13
CPC分类号： H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate, excellent in mass-productivity with respect to the deformation of the cavity in the multilayer ceramic substrate having a cavity: an electronic component using the same: and a method for manufacturing the multilayer ceramic substrate.
SOLUTION: In the multilayer ceramic substrate having a cavity in which a plurality of ceramic layers are laminated, the cavity has a conductor layer on its bottom and a recess region having a step difference of the ceramic layer which is formed so as to overlap the outer edge of the conductor layer or inside the outer edge below the surface of the conductor layer, and the recess region is shallower in the center than in the outer edge.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决问题的方案：提供一种多层陶瓷基板，其具有相对于具有空腔的多层陶瓷基板中的空腔变形的批量生产率：使用其的电子部件及其制造方法多层陶瓷基板。解决方案：在具有层叠有多个陶瓷层的空腔的多层陶瓷基板中，空腔的底部具有导体层，并且具有陶瓷层的台阶差的凹部区域形成为与导体层的外边缘或导体层表面下方的外边缘重叠，并且凹部区域在中心比在外边缘浅。版权所有（C）2010，JPO＆INPIT

63. 发明专利

JP2010045271A Multilayer circuit board 有权
标题翻译：多层电路板
公开(公告)号：JP2010045271A
公开(公告)日：2010-02-25
申请号：JP2008209530
申请日：2008-08-18
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： HAYASHI KENJI , ABE MAMORU , IKEDA HATSUO
IPC分类号： H01L23/12 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable multilayer circuit board, in the multilayer circuit board for forming the same electric potential such as a grounding conductor inside and outside a cavity bottom part.
SOLUTION: The multilayer circuit board includes: a line conductor 6 formed on a surface of the multilayer circuit board; a first plane conductor 4 oppositely formed in the line conductor 6 inside the multilayer circuit board; and a cavity 3 for mounting a chip element. A bottom part of the cavity 3 and the first plane conductor 4 are positioned on a main surface of a common dielectric layer 2, and a second plane conductor 5 of the same electric potential as the first plane conductor is formed in the bottom part of the cavity, and an area 7 unformed with the first plane conductor is arranged in at least a part of a peripheral edge part of the bottom part positioned inside the multilayer circuit board on the main surface of the common dielectric layer.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了在用于形成相同电位的多层电路板中提供高度可靠的多层电路板，例如空腔底部内部和外部的接地导体。解决方案：多层电路板包括：形成在多层电路板的表面上的线路导体6; 第一平面导体4，其相对地形成在多层电路板内的线路导体6中; 以及用于安装芯片元件的空腔3。空腔3的底部和第一平面导体4位于公共电介质层2的主表面上，并且在第一平面导体的底部形成有与第一平面导体相同的电位的第二平面导体5 并且在位于公共介电层的主表面上的位于多层电路板内部的底部的周边部分的至少一部分中布置有与第一平面导体未成形的区域7。版权所有（C）2010，JPO＆INPIT

64. 发明专利

JP2004166185A High frequency component, high frequency module and communication device using the same 有权
公开(公告)号：JP2004166185A
公开(公告)日：2004-06-10
申请号：JP2003059413
申请日：2003-03-06
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： HAYASHI KENJI
IPC分类号： H01P1/15 , H03H7/075 , H03H7/18 , H03H7/38 , H03H7/46 , H04B1/44 , H04B1/50
摘要： PROBLEM TO BE SOLVED: To provide high frequency components, etc. of which the insertion loss in a necessary fundamental frequency band is minimized and harmonic attenuation quantity in an unnecessary frequency band is maximized. SOLUTION: In the high frequency component, it has a branching circuit which branches a signal to a plurality of transmission/reception systems with different pass bands, a switch circuit which switches a transmission system and a reception system to each of the transmission/reception systems, a switch circuit having a low-pass filter and a high frequency amplifier circuit having a semiconductor element, a power supply circuit and a matching circuit in the respective transmission systems of the switch circuit, a phase adjustment circuit is provided between an output matching circuit of the high frequency amplifier circuit and a transmission terminal of the switching circuit, matching between the switch circuit and the high frequency amplifier circuit is in relation of phases equivalent to conjugative matching in the necessary fundamental frequency band, however, the phase is adjusted as relation equivalent to non-conjugative matching in unnecessary two or three times of frequency bands. COPYRIGHT: (C)2004,JPO

65. 发明专利

JP2004135316A High frequency component, high frequency module and communication equipment using the same 审中-公开
公开(公告)号：JP2004135316A
公开(公告)日：2004-04-30
申请号：JP2003322457
申请日：2003-09-16
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： HAYASHI KENJI
IPC分类号： H03H7/38 , H03H7/46 , H04B1/44
摘要： PROBLEM TO BE SOLVED: To provide a high frequency component or the like in which an insertion loss in a required fundamental frequency band is suppressed to a minimum, a higher harmonic wave attenuation quantity in an unwanted frequency band is maximized, and an electrostatic surge is performed.
SOLUTION: The high frequency component has: a branch circuit for branching a signal to a plurality of transmitting-receiving systems with different passbands; a switch circuit for switching a transmitting system and a receiving system to each transmitting-receiving system; a switch circuit having a low-pass filter in each transmitting system of the said switch circuit; and a high frequency amplifier circuit having a semiconductor device, a power supply circuit and a matching circuit. A phase matching circuit composed of a high-pass filter is provided between an output matching circuit of the high frequency amplifier circuit and a transmitting terminal of the switch circuit. Matching of the switch circuit and the high frequency amplifier circuit is in a relation of phases corresponding to conjugate matching in the necessary fundamental frequency band but phases are matched into a relation corresponding nonconjugate matching in unwanted double or triple frequency bands. At the same time, the high-pass filter may take measures to cope with the electrostatic surge.
COPYRIGHT: (C)2004,JPO

66. 发明专利

JP2004128799A Composite laminated module and communication machine using the same 有权
标题翻译：复合层压模块和使用该模块的通信机
公开(公告)号：JP2004128799A
公开(公告)日：2004-04-22
申请号：JP2002288702
申请日：2002-10-01
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： HAYASHI KENJI
IPC分类号： H01P1/15 , H04B1/50
摘要： PROBLEM TO BE SOLVED: To provide a composite laminated module that is composed in one laminate, reduces size and weight, and suppresses deterioration in characteristics caused by the mutual interference between circuits.
SOLUTION: There are a branching circuit, a switch circuit, and a low-pass filter. An LC circuit for composing the circuits and one portion of a transmission line are composed of an electrode pattern in a dielectric layer. A diode has an antenna switch laminated module arranged on the laminate, a transistor, a power supply circuit, and a matching circuit. A transmission line and one portion of an LC circuit for composing the circuits are composed of the electrode pattern in the dielectric layer. In the transistor, a high-frequency amplifier laminated module arranged on the laminate and a phase adjustment circuit for connecting an amplifier to an antenna switch module are composed by the transmission line or the LC circuit, one portion is composed of the electrode pattern in the dielectric layer, and both of them are divided into two regions by a shield electrode provided in the dielectric layer or a columnarly aligned through hole electrode for forming.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供一种叠层体组成的复合层叠模块，可以减小尺寸和重量，并且抑制由电路之间的相互干扰引起的特性劣化。
解决方案：有分支电路，开关电路和低通滤波器。用于组成电路的LC电路和传输线的一部分由电介质层中的电极图案组成。二极管具有布置在层压板上的天线开关叠层模块，晶体管，电源电路和匹配电路。用于构成电路的传输线和LC电路的一部分由电介质层中的电极图案组成。在晶体管中，布置在层压板上的高频放大器层压模块和用于将放大器连接到天线开关模块的相位调整电路由传输线或LC电路组成，一部分由电路图案组成电介质层，并且它们都通过设置在电介质层中的屏蔽电极或用于形成的柱状排列的通孔电极分成两个区域。版权所有（C）2004，JPO

67. 发明专利

JP2013085290A High frequency component 审中-公开
标题翻译：高频分量
公开(公告)号：JP2013085290A
公开(公告)日：2013-05-09
申请号：JP2012283423
申请日：2012-12-26
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： HAYASHI KENJI , UCHIDA MASAYUKI
IPC分类号： H04B1/44 , H01P11/00
CPC分类号： H04B1/0458 , H01P1/2135
摘要： PROBLEM TO BE SOLVED: To provide a small, high-performance high frequency component.SOLUTION: A high frequency component has a high frequency circuit configured on a multilayer substrate formed by laminating a plurality of dielectric layers one upon another. A plurality of rectangular terminal electrodes of the high frequency circuit are disposed along four sides of a rectangular rear surface of the multilayer substrate. The high frequency component includes an overcoat layer to cover a part of the terminal electrodes on the rear surface. The overcoat layer covers two edges not facing the sides of the multilayer substrate in the terminal electrodes disposed at corners of the rear surface among the plurality of terminal electrodes.
摘要翻译：要解决的问题：提供一种小型，高性能的高频部件。解决方案：高频分量具有高频电路，其配置在通过层叠多个电介质层而形成的多层基板上。高频电路的多个矩形端子电极沿多层基板的矩形后表面的四边设置。高频分量包括覆盖在后表面上的一部分端子电极的外涂层。覆盖层覆盖在多个端子电极中位于后表面的角部的端子电极中不面向多层基板的侧面的两个边缘。版权所有（C）2013，JPO＆INPIT

68. 发明专利

JP2013017112A Antenna and radio communication device using the same 审中-公开
标题翻译：使用相同的天线和无线电通信设备
公开(公告)号：JP2013017112A
公开(公告)日：2013-01-24
申请号：JP2011149877
申请日：2011-07-06
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： HAYASHI KENJI , OKAMOTO HIROSHI
IPC分类号： H01Q9/42 , H01Q1/24 , H01Q21/30
摘要： PROBLEM TO BE SOLVED: To provide an antenna and a radio communication device, applicable for a low frequency band and a high frequency band, and capable of switching a communication bandwidth in the low frequency band, while suppressing an influence on antenna characteristics in the high frequency band.SOLUTION: An antenna, capable of communication in a plurality of communication bands, includes: a first line of which one end is connected to a power feed point and the other end is an open end; a ground line for grounding the one end side of the first line; and a second line, shorter than the first line, of which one end is connected to the power feed point and the other end is an open end. The antenna further includes: a switch circuit connected to the middle of the first line; and an inductance element of which one end is connected to the switch circuit and the other end is grounded. By means of the switch circuit, the connection state between the inductance element and the first line is switched.
摘要翻译：解决的问题：提供适用于低频带和高频带的天线和无线电通信装置，并且能够在抑制对天线特性的影响的同时切换低频带中的通信带宽在高频段。解决方案：能够在多个通信带中通信的天线包括：第一线，其一端连接到馈电点，另一端是开放端; 接地线，用于接地第一线的一端; 以及比第一线短的第二线，其一端连接到馈电点，另一端是开口端。天线还包括：连接到第一线路中间的开关电路; 以及其一端连接到开关电路并且另一端接地的电感元件。通过开关电路，切换电感元件与第一线之间的连接状态。版权所有（C）2013，JPO＆INPIT

69. 发明专利

JP2012169805A Multiband antenna 审中-公开
标题翻译：多天线天线
公开(公告)号：JP2012169805A
公开(公告)日：2012-09-06
申请号：JP2011028227
申请日：2011-02-14
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： AYAKA TATSURO , HAYASHI KENJI , OKAMOTO HIROSHI
IPC分类号： H01Q5/10 , H01Q9/42
摘要： PROBLEM TO BE SOLVED: To provide a multiband antenna which can deal with a frequency band including LTE and is excellent in a VSWR band, and thus is capable of dealing with multiple transmission and reception systems.SOLUTION: A multiband antenna which can deal with a plurality of transmission and reception systems is configured such that: as a first resonance, a first radiation electrode comprising elements of a first component and a second component and having both terminals being open resonates in parallel at a first frequency f1; as a second resonance, the second component as a second radiation electrode resonates in series at a second frequency f2; as a third resonance, a third component as a third radiation electrode resonates in series at a third frequency f3; as a fourth resonance, the first radiation electrode resonates in parallel at a fourth frequency f4; and as a fifth resonance, the second radiation electrode resonates in series at a fifth frequency f5. The first frequency f1 to the fifth frequency f5 have the following relation: f1
摘要翻译：要解决的问题：提供一种可以处理包括LTE的频带的多频带天线，并且在VSWR频带中是优异的，因此能够处理多个发送和接收系统。解决方案：可以处理多个发送和接收系统的多频带天线被配置为使得：作为第一谐振，包括第一部件和第二部件的元件并且具有两个端子是开放谐振的第一辐射电极在第一频率f1处并联; 作为第二谐振，作为第二辐射电极的第二部件以第二频率f2串联谐振; 作为第三谐振，作为第三辐射电极的第三分量以第三频率f3串联谐振; 作为第四谐振，第一辐射电极以第四频率f4并联谐振; 并且作为第五谐振，第二辐射电极以第五频率f5串联谐振。第一频率f1至第五频率f5具有以下关系：f1

70. 发明专利

JP2007151123A Compound laminated module and communication device using it 有权
标题翻译：复合层压模块和使用它的通信设备
公开(公告)号：JP2007151123A
公开(公告)日：2007-06-14
申请号：JP2006318059
申请日：2006-11-27
申请人： Hitachi Metals Ltd , 日立金属株式会社
发明人： HAYASHI KENJI
IPC分类号： H04B1/44 , H04B1/50 , H05K1/16 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a compound laminated module which is reduced in size and weight by integrating in one lamination, and suppresses degradation of characteristics caused by interference between circuits. SOLUTION: The module has a branching circuit, a switch circuit, and a low pass filter. Part of an LC circuit and a transmission line composing these circuits are composed in a dielectric layer by an electrode pattern. A diode has an antenna switch laminated module positioned on a laminate, a transistor, a power supply circuit, and a matching circuit. Part of the transmission line and the LC circuit composing these circuits are composed in the dielectric layer by an electrode pattern. For the transistor, a high frequency amplifier laminated module positioned on the laminate and a phase adjusting circuit connecting the amplifier and the antenna switch module are composed by the transmission line or the LC circuit, and part of the transmission line or the LC circuit is composed in the dielectric layer by an electrode pattern. By dividing the diode and the transistor into two areas by a shield electrode provided in the laminate's dielectric layer or longitudinal through hole electrodes. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供通过集成在一个层压中而减小尺寸和重量的复合层压模块，并且抑制由电路之间的干扰引起的特性的劣化。
解决方案：该模块具有分支电路，开关电路和低通滤波器。组成这些电路的LC电路和传输线的一部分通过电极图案组成介电层。二极管具有位于层叠体上的天线开关层叠模块，晶体管，电源电路和匹配电路。构成这些电路的传输线和LC电路的一部分由电极图案组成在电介质层中。对于晶体管，位于层压板上的高频放大器层叠模块和连接放大器和天线开关模块的相位调整电路由传输线或LC电路组成，部分传输线或LC电路组成在电介质层中通过电极图案。通过将二极管和晶体管分成两层，通过设置在层叠体的电介质层或纵向通孔电极中的屏蔽电极。版权所有（C）2007，JPO＆INPIT

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