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61. 发明专利

JPH0258362A LEAD FRAME FOR SEMICONDUCTOR AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0258362A
公开(公告)日：1990-02-27
申请号：JP20839288
申请日：1988-08-24
申请人： HITACHI LTD
发明人： KAWAI SUEO , NISHIMURA ASAO , KITANO MAKOTO , MIURA HIDEO , YAGUCHI AKIHIRO
IPC分类号： H01L21/56 , H01L23/28 , H01L23/50
摘要： PURPOSE:To make the bore diameter on the semiconductor element mounting side larger than the bore diameter on the side opposite to the semiconductor element mounting side so as to prevent resin charged into the hole from getting out by the steam pressure at the interface between the tab and the resin at the time of solder reflow to prevent reflow cracks by providing roundnesses at the corner on the semiconductor element mounting side of a hole and at the corner on the side opposite to the semiconductor mounting side of a tab peripheral end part. CONSTITUTION:The hole provided in a tab 1 is punched from the side to mount a semiconductor element 2 to the side opposite to the semiconductor mounting side so as to form a round part 5 on the semiconductor mounting side of a hole. Hereby, the resin 3 charged into the hole never gets out of the hole, accordingly reflow crack resistance can be elevated. The number of holes may be provided in optional numbers at need. For this reason, the processes of press processings increases by one, but thinking over that the press processings at lead frame manufacturing are ten-odd processes, the price increase is slight, and as compared with the conventional art of etching, etc., a lead frame which is cheap and stable in shape can be formed.

62. 发明专利

JPH0249447A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0249447A
公开(公告)日：1990-02-19
申请号：JP12434189
申请日：1989-05-19
申请人： HITACHI LTD
发明人： KITANO MAKOTO , KITABAYASHI CHIKAKO , NISHIMURA ASAO , MIURA HIDEO , YAGUCHI AKIHIRO , KAWAI SUEO
IPC分类号： H01L21/60 , H01L21/603 , H01L23/495
摘要： PURPOSE:To keep wires from destruction due to thermal fatigue by a method wherein a stretch of rough surface is provided on a wire along its length in the vicinity of a section to be bonded and the wire and resin are allowed to firmly engage each other for the prevention of slip between the two. CONSTITUTION:Wires 1 are connected by leads 4 to the electrodes of an element 2 installed on a tab 3, and then they are sealed in a resin 5. Just over the bonding ball 1a of each wire 1, there is a roughened surface 1b, which engages firmly with the resin 5. In such a design, even if the wire 1 is peeled from the resin 5, no slip occurs between the two. No stress concentration takes place because the distortion in the wire 1 ensuing from the heat-caused deformation of the resin 5 is homogeneously distributed, which keep the wire 1 from destruction attributable to thermal fatigue.

63. 发明专利

JPH01283948A RESIN SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH01283948A
公开(公告)日：1989-11-15
申请号：JP11245588
申请日：1988-05-11
申请人： HITACHI LTD
发明人： YAGUCHI AKIHIRO , NISHIMURA ASAO , KITANO MAKOTO , MIURA HIDEO , KAWAI SUEO
IPC分类号： H01L23/28 , H01L23/50
摘要： PURPOSE:To implement a compact configuration, by fixing a plurality of input/ output pins to a substrate so that the pins are vertically arranged in the same pattern as electrodes on the surface of a semiconductor element, and connecting the pins to the electrodes. CONSTITUTION:A plurality of input/output pins 2 are vertically fixed to a substrate 4 with respect to a surface 1a on which electrodes are provided within the projected area of the surface 1a. The surface 1a is the surface of a semiconductor element 1 where the electrodes are provided. The pins are arranged in the same pattern as the electrodes on the surface of the semiconductor element 1. The electrodes on the surface of the semiconductor element 1 are connected to a plurality of the input/output pins 2 through bumps 3 which are formed on the electrodes. Thereafter, the device is sealed with a resin 5. As a result, the outer dimensions become larger than the outer dimensions of the semiconductor element 1 only by the thickness of the thin resin 5 which is formed on a side surface 1b of the semiconductor element. Therefore, the device can be made compact.

64. 发明专利

JPH01181450A RESIN SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH01181450A
公开(公告)日：1989-07-19
申请号：JP259888
申请日：1988-01-11
申请人： HITACHI LTD
发明人： KONO RYUJI , KITANO MAKOTO , NISHIMURA ASAO , MIURA HIDEO , YAGUCHI AKIHIRO , KAWAI SUEO
IPC分类号： H01L23/28 , H01L23/50
摘要： PURPOSE:To prevent the generation of resin cracks, by constituting the lower surface of a tab and the lower surface of a device close to an element at the central part of the tab, while constituting them as a curved surface distant from the element, or a synthesized shape of planes, or a synthesized shape of a curved surface and a plane, at the periphery. CONSTITUTION:An element 1 is mounted on a bent tab 3a via an adhesive agent 2. These are sealed with a resin 5, in the lower part of which a bent part 5a is formed. Resin cracks of lower corner part of the tab are generated by large tensile stress of the lower corner parts of the tab caused by the exfoliation of a boundary surface between the lower surface of the tab and the resin, and vapor pressure generating at this part. Since the resin 5 under the lower surface of the tab is bent, according to the same principle as the arch of a dam, the tensile stress generating in the resin 5 caused by a pressure from above is reduced. As a result, the dielectric strength is increased as compared with conventional plane type, and further the expansion of the boundary surface can be restrained, thereby preventing the resin cracks of the boundary surface.

65. 发明专利

JPH01129448A LEAD FRAME 失效
公开(公告)号：JPH01129448A
公开(公告)日：1989-05-22
申请号：JP28731387
申请日：1987-11-16
申请人： HITACHI LTD
发明人： KITANO MAKOTO , KAWAI SUEO , NISHIMURA ASAO , MIURA HIDEO , YAGUCHI AKIHIRO , KONO RYUJI , SHIMIZU KAZUO
IPC分类号： H01L23/50 , H01L23/28
摘要： PURPOSE:To prevent reflow cracks by making the area of a through-hole in an element loading surface larger than that of a through-hole in an anti-element loading surface and specifying an angle formed by the inner surface of the through-hole and the anti-element loading surface of a tab. CONSTITUTION:Reflow heating is conducted in order to mount a package, in which an element 4 is loaded onto a tab 1 and these tab and element and leads 7 are sealed with a resin 5, onto a substrate 9 with solder 8. Steam 6 is generated on the interface of the tab and the resin, but a through-hole 2a made wider in an element loading surface and narrower in an anti-element loading surface is bored to the tab 1. Accordingly, the resin 5 is constrained by the tab 1, and an angle 3a shaped by the inner surface of the through-hole 2a and the anti-element loading surface of the tab 1 extends over 60 deg. or more, thus reducing stress generated in the resin in a through-hole 2a section, then generating no reflow crack.

66. 发明专利

JPS6457651A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6457651A
公开(公告)日：1989-03-03
申请号：JP21276387
申请日：1987-08-28
申请人： HITACHI LTD
发明人： YAGUCHI AKIHIRO , NISHIMURA ASAO , KITANO MAKOTO , MIURA HIDEO , KAWAI SUEO
IPC分类号： H01L23/50 , H01L23/28
摘要： PURPOSE:To prevent resin crack generating at the time of temperature cycle testing and surface mounting, by bending downward the outer peripheral end- portion of a lead frame tab in the manner in which the tip of the bent part reaches the inner side of the end-portion of semiconductor element mounting part of the tab. CONSTITUTION:A lead frame for semiconductor device is provided with an integrated body of a tab 2 for mounting a semiconductor element 1, and leads 3. Outer peripheral end-portions of the tab 2 are bent downward in the manner in which the tip 9a of the bent part 9 reaches the inner side of the end-portion 2c of a semiconductor element mounting part 11 of the tab 2. The bent part 9 formed on the outer peripheral part of the tab 2 can be arranged on not only two sides parallel to the lead 3 but also four sides of the tab. As a result, the bent part 9 cuts into resin 5, and mechanical coupling force increases. The contact area with resin 5 also increases, so that boundary bonding force increases. Therefore strong coupling between the tab 2 and resin 5 can be obtained, and the generation of exfoliation on a bonding surface can be prevented.

67. 发明专利

JPS63208261A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS63208261A
公开(公告)日：1988-08-29
申请号：JP4028787
申请日：1987-02-25
申请人： HITACHI LTD
发明人： KAWAI SUEO , NISHIMURA ASAO , KITANO MAKOTO , TATEMICHI AKIHIRO , MIURA HIDEO
IPC分类号： H01L21/52 , H01L23/50
摘要： PURPOSE:To prevent the breakdown of a semiconductor element in die bonding or due to temperature history thereafter, by dividing a tab into a peripheral loop part and a central island part, and indirectly mounting the semiconductor element on the island part through a bonding agent. CONSTITUTION:A tab 2 is divided into a peripheral loop part 2b and a central island part 2a. The island part 2a is connected to a part 2c of the loop part 2b so that the island part 2a is supported with the loop part 2b as a unitary body. A semiconductor element 1 is indirectly mounted on the island part 2a through a bonding agent 6. Meanwhile the element 1 is directly mounted on the element mounting surface of the loop part 2b or mounted through a gap part. Since the bonding of the element 1 and the tab 2 is carried out only at a part of the center of the element in this method, the stress yielded in the element is approximately equal to the value, which is yielded at the entire bonding part of the element 1 corresponding to the length of the bonded part. Therefore, cracks are not yielded in the element even if the element has a large size.

68. 发明专利

JPS63198339A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS63198339A
公开(公告)日：1988-08-17
申请号：JP2964087
申请日：1987-02-13
申请人： HITACHI LTD
发明人： KAWAI SUEO , NISHIMURA ASAO , KITANO MAKOTO , SHIMIZU KAZUO
IPC分类号： H01L23/28 , H01L21/60
摘要： PURPOSE:To prevent the contacts of wires, the flows of wires and the contact of the wire with a chip corner by bonding many arrayed wires longitudinally and perpendicularly to the longitudinal direction over two or more wires while partly insulating them with an insulating adhesive from each other. CONSTITUTION:Three positions of a plurality of wires 7 over between pads 4 and bonding points 6 are coated with an insulating adhesive 8, and the wires 7 are bonded while they are held insulating state therebetween with the adhesive 8. Thus, since the lengths of the wires 7 between a semiconductor chip 1 and leads 31 can be apparently shortened to upper half or less, an electric short- circuit due to the contact between the wires 7, the flow of the wires 7 at the time of resin-molding, and an electric leakage due to the contact of the wires 7 with the corner of the chip 1 or the corner of a tab 2 can be prevented, thereby improving the reliability of a semiconductor device.

69. 发明专利

JPS6374696A IC CARD 失效
公开(公告)号：JPS6374696A
公开(公告)日：1988-04-05
申请号：JP21952186
申请日：1986-09-19
申请人： HITACHI LTD
发明人： KITANO MAKOTO , MIURA HIDEO , NISHIMURA ASAO , TATEMICHI AKIHIRO , KAWAI SUEO
IPC分类号： G06K19/07 , B42D15/02 , B42D15/10 , G06K19/00

70. 发明专利

JPS62252156A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS62252156A
公开(公告)日：1987-11-02
申请号：JP9450586
申请日：1986-04-25
申请人： HITACHI LTD
发明人： KAWAI SUEO , NISHIMURA ASAO , KITANO MAKOTO , MIURA HIDEO , TATEMICHI AKIHIRO
IPC分类号： H01L23/28 , H01L29/06
摘要： PURPOSE:To prevent resin from being separated from a semiconductor element due to thermal load by forming a resin restricting region having a recess or a projection on the surface of the element and particularly part of a portion in contact with the resin. CONSTITUTION:A groove 11 is formed on the outer periphery of a bonding pad 10 on the surface of a semiconductor element 1 in contact with resin 5. When the groove 11 is, for example, formed by etching or pressing, the resin is filled in the groove 11 after resin-molding to increase the bonding strength in a boundary between the resin and the element 1, and the groove of the element 1 and the projection acts as a stopper for the separation due to thermal stress. Thus, it can prevent the separation, and even if the thermal stress is generated, the entire surface bonding state is held in the boundary.

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