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61. 发明专利

JPH11186771A CIRCUIT MODULE AND INFORMATION PROCESSING DEVICE 失效
公开(公告)号：JPH11186771A
公开(公告)日：1999-07-09
申请号：JP34753197
申请日：1997-12-17
申请人： HITACHI LTD
发明人： TANAKA MIKIHIRO , YAMAGIWA AKIRA , MARUYAMA TAKASHI , KAMIMURA YASUHIRO
IPC分类号： H05K7/20 , H01L23/427
摘要： PROBLEM TO BE SOLVED: To improve heat dissipation efficiency by mounting a processor in the state of a bare chip, in a cavity part of a printed board, bonding one surface of the bare chip to one surface of a heat pipe, and installing a heat dissipation part on the end portion of the heat pipe. SOLUTION: A cavity part is formed in a circuit module 2 and a circuit module substrate 101. A processor in a state of a bare chip 20 is mounted in the cavity part. The bare chip 20 is electrically connected with the circuit module substrate 101 through bonding wires 104. Further, main components such as a cache submodule 40, a system controller 30 and a connector 90 for interface are mounted on the circuit module substrate 101. One surface of the bare chip 20 mounted on the circuit module substrate 101 is bonded to one surface of a heat pipe 103, and a heat dissipation part is installed on the end portion of the heat pipe 103. Thereby heat dissipation efficiency can be improved.

62. 发明专利

JPH10209368A CPU MODULE AND INFORMATION PROCESSOR 失效
公开(公告)号：JPH10209368A
公开(公告)日：1998-08-07
申请号：JP1095497
申请日：1997-01-24
申请人： HITACHI LTD
发明人： MARUYAMA TAKASHI , YAMAGIWA AKIRA , KURIHARA RYOICHI , SAKAGAMI MASAKAZU , KAMIMURA YASUHIRO
IPC分类号： H01L25/18 , H01L25/04 , H05K1/02 , H05K1/18
摘要： PROBLEM TO BE SOLVED: To meet requirements for imputing the radiation efficiency and realizing a small size, by mounting a processor as a bare chip in a cavity and bonding one surface of the chip to a metal plate. SOLUTION: The central processing unit CPU module 2 comprises a metal plate 102 for diffusing the heat produced in a processor as a base, a high-heating rate CPU bare chip 20 consuming almost the power of the module 2, and CPU module board 101 connected to the chip 20. The processor contacts the metal plate 2 to form a cavity in the module board 101 where main components are mounted such as cache submodule 40, system controller 30 and interface connector 90. The cache submodule 40 is mounted above the processor mounted part, thereby greatly reducing the size.

63. 发明专利

JPH0893533A THROTTLE VALVE CONTROLLER FOR INTERNAL COMBUSTION ENGINE 失效
公开(公告)号：JPH0893533A
公开(公告)日：1996-04-09
申请号：JP23476094
申请日：1994-09-29
申请人： HITACHI LTD , HITACHI CAR ENGINEERING KK
发明人： NAGAYAMA KAZUO , AOKI SADAYUKI , KAMIMURA YASUHIRO , SASAKI YASUSHI
IPC分类号： F02D9/10 , F02D11/10 , F02D41/14
摘要： PURPOSE: To achieve linearity of an output signal of a detector, so as to control the opening of a throttle valve at high accuracy by using a ball bearing on a detector side, and a plane bearing on a driving force transmitting side in a bearing for holding a throttle shaft to which the detector for the throttle valve opening is to be provided. CONSTITUTION: A throttle valve 1 is fixed to a throttle shaft 3 rotatably supported to a supporting body 2, and a two-body structure in which the throttle shaft 3 and a throttle position sensor 13 are integrally rotated by a brush 15 is made. In this case, a ball bearing 9 to be rotatably fitted to the throttle shaft 3 is used as a bearing on the throttle position sensor 13 side as a detector. A plane bearing 11 having an insertion structure to the throttle shaft 3 is used as a bearing on a driving force transmitting part 10 side for controlling the turning movement of the throttle valve 1, and the surface to be brought in internal contact with throttle shaft 3 is coated with resin 12 as a low-side resistance member.

64. 发明专利

JPH05248273A 失效
公开(公告)号：JPH05248273A
公开(公告)日：1993-09-24
申请号：JP5167892
申请日：1992-03-10
申请人： HITACHI LTD
发明人： KAMIMURA YASUHIRO , SASAKI YASUSHI
IPC分类号： F02D9/02 , F02D11/04 , F02D11/10 , F02D41/22
摘要： PURPOSE:To provide a throttle valve control device of electronic throttle system whereby a sufficient function of 'abnormality time assist running' is attained, even in the case of trouble in a drive system of motor or the like serving as a throttle valve actuator, to surely provide a fail safe mechanism. CONSTITUTION:A control lever 11a mounted on a shaft of a throttle valve 1 is engaged with a throttle lever 11b, connected to an accelerator pedal 14 through an accelerator wire 15, by springs 11c, 11d for lost motion. Thus in the condition that an electromagnetic clutch 8 is connected, the throttle valve 1 can be controlled to be opened and closed by a motor 6 in no relation to a step-in position of the accelerator pedal 14, and when the electromagnetic clutch 8 is opened, a throttle valve opening is obtained corresponding to a step-in amount of the accelerator pedal 14. Here, a position of a fully closing stopper 17 is left as decreased from a throttle valve fully closed position by a predetermined amount alpha. In this way, the throttle valve 1 is surely held to the fully closed opening by elastic force of the springs 11c, 11d corresponding to the predetermined amount alpha.

65. 发明专利

JPH04118951A STRUCTURE OF SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH04118951A
公开(公告)日：1992-04-20
申请号：JP23694390
申请日：1990-09-10
申请人： HITACHI LTD , HITACHI COMPUTER ELECTRONIC
发明人： KAMIMURA YASUHIRO , TANAKA SHINJI , SHIGEMURA SEIJI
IPC分类号： H05K1/18 , H01L23/28 , H05K3/28 , H05K3/30 , H05K3/34
摘要： PURPOSE:To prevent a resin from flowing into the bottom section of a semiconductor package by providing a projecting section around the outer peripheral section of the package on the rear surface and making the clearance between a printed wiring board and the package smaller when the package is mounted on the board. CONSTITUTION:A projecting section 4 is provided to the lower outer periphery of the packaging resin 2 of a semiconductor package in which a semiconductor element is sealed with a ceramic or plastic material and flat-pack type leads are led out from side faces of a mold. As a result, the clearance 5 between a printed wiring board 1 and the package 2 is reduced when the package 2 is mounted on the board 1 and, when a moisture resistive resin is applied, the projecting section 4 prevents the resin from flowing into the bottom section of the package. The height of the section 4 is set equivalent to that of the soldered surfaces of the leads and the section 4 is not brought into close contact with the board 1. In order to prevent the section 4 from producing a stress due to the thermal expansion or contraction of the package resin 2, a clearance 6 must be provided between the projecting section 4 and wiring board 1. Therefore, the connection reliability of soldered sections can be improved, because influences of the stress produced in the bottom section of the package due to the thermal expansion or contraction can be eliminated.

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