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61. 发明申请

US20160049318A1 FLOATING MOLD TOOL FOR SEMICONDCUTOR PACKAGING 有权
标题翻译：用于半导体包装的浮动模具
公开(公告)号：US20160049318A1
公开(公告)日：2016-02-18
申请号：US14562770
申请日：2014-12-07
申请人： Zhigang Bai , Xingshou Pang , Jinzhong Yao
发明人： Zhigang Bai , Xingshou Pang , Jinzhong Yao
IPC分类号： H01L21/67 , H01L21/48 , H01L23/495 , H01L21/56 , H01L23/31
CPC分类号： H01L21/67126 , H01L21/4842 , H01L21/565 , H01L23/3107 , H01L23/49551 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Tooling for molding a packaged semiconductor device includes a clamping plate, a cavity bar, and an attachment mechanism. The cavity bar has a mold half that has a mold cavity for molding the packaged semiconductor device. The mold half has teeth and a space between pairs of adjacent teeth. The teeth and the spaces support bending of leads of a lead frame of the packaged semiconductor device. The attachment mechanism affixes the cavity bar to the clamping plate and permits the cavity bar to slide relative to the clamping plate. This sliding of the cavity bar enables proper alignment with a mating cavity bar to reduce the likelihood of resin bleed.
摘要翻译：用于模制封装的半导体器件的模具包括夹板，空腔棒和附接机构。空腔棒具有模具半部，其具有用于模制封装半导体器件的模腔。模具半部具有齿和相邻齿对之间的空间。所述齿和所述间隙支撑所述封装半导体器件的引线框架的引线的弯曲。连接机构将空腔棒固定到夹紧板上，并允许空腔棒相对于夹紧板滑动。空腔棒的这种滑动使得能够与配合的腔棒正确对准以减少树脂流出的可能性。

62. 发明授权

US09214413B2 Semiconductor die package with pre-molded die 有权
标题翻译：具有预成型模具的半导体模具封装
公开(公告)号：US09214413B2
公开(公告)日：2015-12-15
申请号：US14551069
申请日：2014-11-23
申请人： Zhijie Wang , Zhigang Bai , Aipeng Shu , Yanbo Xu , Huchang Zhang , Fei Zong
发明人： Zhijie Wang , Zhigang Bai , Aipeng Shu , Yanbo Xu , Huchang Zhang , Fei Zong
IPC分类号： H01L21/50 , H01L23/495 , H01L21/56 , H01L23/373 , H01L23/42
CPC分类号： H01L23/49503 , H01L21/56 , H01L21/561 , H01L23/16 , H01L23/3107 , H01L23/3737 , H01L23/42 , H01L23/4334 , H01L23/49541 , H01L23/49551 , H01L23/49568 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014
摘要： A semiconductor die is packaged by providing a die assembly that includes a semiconductor die with an active surface and an opposite mounting surface with an attached thermally conductive substrate. The die assembly is mounted on a first surface of a lead frame die flag so that the thermally conductive substrate is sandwiched between the die flag and the semiconductor die. Bonding pads of the die are electrically connected with bond wires to lead frame lead fingers. A mold compound then encapsulates the semiconductor die, bond wires, and thermally conductive substrate. A second surface of the die flag is exposed through the mold compound.
摘要翻译：通过提供包括具有活性表面的半导体管芯和具有附接的导热衬底的相对安装表面的管芯组件来封装半导体管芯。模具组件安装在引线框架模具标记的第一表面上，使得导热基板夹在模具标记和半导体管芯之间。管芯的接合焊盘与接合线电连接以引导框架引线指。然后，模制化合物封装半导体管芯，接合线和导热衬底。模具标记的第二表面通过模具化合物暴露。

63. 发明授权

US09105287B2 Method of forming a PMR writer device with multi-level tapered write pole 有权
标题翻译：用多级锥形写柱形成PMR写入器的方法
公开(公告)号：US09105287B2
公开(公告)日：2015-08-11
申请号：US13608308
申请日：2012-09-10
申请人： Zhigang Bai , Kowang Liu , Yan Wu , Moris Dovek
发明人： Zhigang Bai , Kowang Liu , Yan Wu , Moris Dovek
IPC分类号： G11B5/127 , G11B5/31 , G11B5/39
CPC分类号： G11B5/398 , G11B5/1278 , G11B5/3116 , G11B5/315 , G11B5/3163 , G11B5/3183 , G11B5/3186 , Y10T29/49032 , Y10T29/49041 , Y10T29/49044 , Y10T29/49048
摘要： A method of fabricating a perpendicular magnetic recording (PMR) head with a multi-level tapered write pole which creates an efficient channeling of magnetic flux to the pole tip. A tapered bottom yoke is first formed in an etched substrate and a write pole is formed on the tapered bottom yoke. The write pole comprises a main pole with a tapered tip. A tapered top yoke is then formed on the write pole and symmetrically positioned relative to the bottom yoke. The edge of each yoke is recessed from the ABS of the tapered tip, giving the write pole a stepped profile. The tapered tip can be two sloped surfaces that are symmetric about a mid-plane of the main pole or a single sloped edge on the leading side or the trailing side of the pole.
摘要翻译：一种制造具有多级锥形写磁极的垂直磁记录（PMR）磁头的方法，其产生磁极到极尖的有效沟道。首先在蚀刻的衬底中形成锥形底部磁轭，并且在锥形底部磁轭上形成写入磁极。写入极包括具有锥形尖端的主极。然后，锥形顶部磁轭形成在写入磁极上并相对于底部磁轭对称地定位。每个轭的边缘从锥形尖端的ABS凹入，给写极一个阶梯轮廓。锥形尖端可以是关于主极的中间平面对称的两个倾斜表面或在极的前侧或后侧的单个倾斜边缘。

64. 发明申请

US20150028468A1 NON-LEADED TYPE SEMICONDUCTOR PACKAGE AND METHOD OF ASSEMBLING SAME 有权
标题翻译：非引线型半导体封装及其组装方法
公开(公告)号：US20150028468A1
公开(公告)日：2015-01-29
申请号：US14277061
申请日：2014-05-14
申请人： Zhigang Bai , Zhijie Wang , Jinzhong Yao
发明人： Zhigang Bai , Zhijie Wang , Jinzhong Yao
IPC分类号： H01L23/08 , H01L23/00 , H01L21/56
CPC分类号： H01L24/85 , H01L21/4842 , H01L23/3107 , H01L23/49541 , H01L24/32 , H01L24/48 , H01L24/83 , H01L2224/32245 , H01L2224/48245 , H01L2224/85 , H01L2224/92247 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90° angles. The mold columns prevent the corner pads from peeling.
摘要翻译：无引线型半导体封装具有形成模体的模盖。模具体的角部用模具柱加强，使得拐角具有圆形的突起并且不形成90°的角度。模具柱防止角垫脱落。

65. 发明申请

US20140361421A1 LEAD FRAME BASED SEMICONDUCTOR DIE PACKAGE 有权
标题翻译：基于框架的半导体封装
公开(公告)号：US20140361421A1
公开(公告)日：2014-12-11
申请号：US13972885
申请日：2013-08-21
申请人： Zhigang Bai , Jinzhong Yao , Yuan Zang
发明人： Zhigang Bai , Jinzhong Yao , Yuan Zang
IPC分类号： H01L23/495 , H01L23/00
CPC分类号： H01L23/49517 , H01L23/3107 , H01L23/49555 , H01L23/49575 , H01L24/06 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/85 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/06135 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2224/85 , H01L2224/92247 , H01L2924/00014 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A lead frame based semiconductor die package includes a lead frame having a die pad that supports a semiconductor die and lead fingers that surround the die and die pad. The die is electrically connected to the lead fingers with bond wires. The die and bond wires are covered with an encapsulant with ends of the lead fingers projecting out from the encapsulant. One set of the lead fingers are bent and project down and another set of the lead fingers are bent and project inwardly, and under a bottom surface of the encapsulant. The encapsulant includes a slot or groove for receiving the lead fingers of the second set.
摘要翻译：基于引线框架的半导体管芯封装包括引线框架，其具有支撑半导体管芯的管芯焊盘和围绕管芯和管芯焊盘的引线指。模具通过接合线电连接到引线指。管芯和接合线用密封剂覆盖，引线的端部从密封剂突出。一组引导指弯曲并向下突出，另一组引导指弯曲并向内突出，并在密封剂的底表面下方。密封剂包括用于接收第二组的引导指的槽或槽。

66. 发明授权

US08670212B2 PMR writer device with multi-level tapered write pole 有权
标题翻译： PMR写入器，具有多级锥形写入极
公开(公告)号：US08670212B2
公开(公告)日：2014-03-11
申请号：US13608321
申请日：2012-09-10
申请人： Zhigang Bai , Kowang Liu , Yan Wu , Moris Dovek
发明人： Zhigang Bai , Kowang Liu , Yan Wu , Moris Dovek
IPC分类号： G11B5/31
CPC分类号： G11B5/398 , G11B5/1278 , G11B5/3116 , G11B5/315 , G11B5/3163 , G11B5/3183 , G11B5/3186 , Y10T29/49032 , Y10T29/49041 , Y10T29/49044 , Y10T29/49048
摘要： A perpendicular magnetic recording (PMR) head is fabricated with a multi-level tapered write pole. The write pole comprises a main pole with a tapered tip on a leading edge or a trailing edge, on which is formed at least one yoke that has a tapered edge. The edge of the yoke is recessed from the ABS of the main pole, giving the head a stepped profile. The yoke can be a single yoke formed on one side of the main pole or it can be two yokes formed on both the leading and trailing sides of the main pole. The write pole structure creates an efficient channeling of magnetic flux to the ABS surface of the pole tip which produces magnetic recording field at high area densities.
摘要翻译：垂直磁记录（PMR）头用多级锥形写柱制造。写极包括在前缘或后缘具有锥形尖端的主极，在其上形成有至少一个具有锥形边缘的轭。轭的边缘从主极的ABS凹入，使头部呈阶梯状。轭可以是形成在主极的一侧上的单个磁轭，或者它可以是形成在主极的前侧和后侧的两个轭。写磁极结构产生磁通量到磁极尖端的ABS表面的有效的通道，其产生高区域密度的磁记录场。

67. 发明授权

US08643156B2 Lead frame for assembling semiconductor device 有权
标题翻译：用于组装半导体器件的引线框架
公开(公告)号：US08643156B2
公开(公告)日：2014-02-04
申请号：US13605990
申请日：2012-09-06
申请人： Shunan Qiu , Zhigang Bai , Haiyan Liu
发明人： Shunan Qiu , Zhigang Bai , Haiyan Liu
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49558 , H01L23/3107 , H01L23/49541 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2924/00014 , H01L2924/00
摘要： A lead frame has a flag, a peripheral frame, and main tie bars coupling the flag to the peripheral frame. At least one cross tie bar extends between two of the main tie bars and an inner row of external connector pads extending from an inner side of the cross tie bar and an outer row of external connector pads extending from an outer side of the cross tie bar. Both an inner non-electrically conductive support bar and an outer non-electrically conductive support bar are attached across the two of the main tie bars. The inner non-electrically conductive support bar is attached to upper surfaces of the two of the main tie bars and to upper surfaces of the inner row of the external connector pads.
摘要翻译：引线框架具有标志，外围框架和将标志耦合到外围框架的主连接条。至少一个交叉连接杆在两个主连接杆之间延伸，以及从交叉连接杆的内侧延伸的内排的外部连接器焊盘以及从交叉连接杆的外侧延伸的外部排的外部连接器焊盘。内部非导电支撑杆和外部非导电支撑杆都穿过两个主连接杆。内部非导电支撑杆附接到两个主连杆的上表面和外部连接器垫的内排的上表面。

68. 发明申请

US20130196473A1 MOLD CHASE 有权
标题翻译：模具刀
公开(公告)号：US20130196473A1
公开(公告)日：2013-08-01
申请号：US13794789
申请日：2013-03-12
申请人： Zhigang Bai , Jinzhong Yao
发明人： Zhigang Bai , Jinzhong Yao
IPC分类号： H01L21/56
CPC分类号： H01L21/565 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H03K19/018521 , H01L2924/00014
摘要： A mold chase for packaging a semiconductor die includes first and second toothed mold clamps, each having teeth, recesses located between the teeth, and an open cavity located in a center of the first mold clamp. The second mold clamp is in facing arrangement with the first mold clamp and the teeth in the first mold clamp mate with corresponding recesses in the second mold clamp and vice-versa. In an open position a lead frame can be inserted into one of the first or second mold clamps and in a closed position, the teeth and recesses of the first and second mold clamps bend leads of the lead frame into two spaced, planar rows.
摘要翻译：用于包装半导体模具的模具行包括第一和第二齿形模具夹具，每个具有齿，位于齿之间的凹部和位于第一模具夹具的中心的开口腔。第二模具夹具与第一模具夹具面对配置，并且第一模具夹具中的齿与第二模具夹具中的相应凹部配合，反之亦然。在打开位置，引线框架可以插入第一或第二模具夹具中的一个中，并且在关闭位置，第一和第二模具夹具的齿和凹部将引线框架的引线弯曲成两个间隔开的平面行。

69. 发明授权

US08373945B1 Magnetic writer having a split yoke 有权
标题翻译：磁性刻录机具有分叉
公开(公告)号：US08373945B1
公开(公告)日：2013-02-12
申请号：US11789190
申请日：2007-04-23
申请人： Peng Luo , Zhigang Bai , Yugang Wang , Kroum S. Stoev , Francis H. Liu
发明人： Peng Luo , Zhigang Bai , Yugang Wang , Kroum S. Stoev , Francis H. Liu
IPC分类号： G11B5/31 , G11B5/17
CPC分类号： G11B5/1278 , G11B5/3123
摘要： A method and system for providing a magnetic transducer are described. The magnetic transducer includes a first pole, a write gap, a second pole, a first coil, and a second coil. The first pole has a front portion on which at least a portion of the write gap resides. The second pole includes a split yoke that includes a first portion and a second portion. At least a portion of the first coil resides between the first portion of the split yoke and the first pole. At least a portion of the second coil resides between the second portion of the split yoke and the first pole.
摘要翻译：描述了一种用于提供磁换能器的方法和系统。磁换能器包括第一极，写间隙，第二极，第一线圈和第二线圈。第一极具有前部，至少部分写入间隙位于该前部。第二极包括分开轭，其包括第一部分和第二部分。第一线圈的至少一部分位于分叉轭的第一部分和第一极之间。第二线圈的至少一部分位于分叉轭的第二部分和第一极之间。

70. 发明授权

US08209848B2 Method of making a PMR writer with seamless shields 有权
标题翻译：制作具有无缝屏蔽的PMR写入器的方法
公开(公告)号：US08209848B2
公开(公告)日：2012-07-03
申请号：US12798560
申请日：2010-04-07
申请人： Zhigang Bai , Moris Dovek , Yan Wu , Cherng-Chyi Han , Jiun-Ting Lee
发明人： Zhigang Bai , Moris Dovek , Yan Wu , Cherng-Chyi Han , Jiun-Ting Lee
IPC分类号： G11B5/17 , G11B5/23
CPC分类号： G11B5/1278 , G11B5/3116 , G11B5/3163 , Y10T29/49039 , Y10T29/49043 , Y10T29/4906
摘要： A process (and the structure resulting therefrom) is described for manufacturing a magnetic write head in which there is no physical interface between the first and second trailing shields. This is achieved by laying down a sacrificial layer which is patterned to extend inwards towards the top yoke whereby the dimensions and shapes of the shields are defined.
摘要翻译：描述了一种用于制造其中在第一和第二后挡板之间没有物理接口的磁写头的过程（以及由此产生的结构）。这通过铺设牺牲层来实现，该牺牲层被图案化以朝向顶部轭部向内延伸，由此限定了屏蔽件的尺寸和形状。

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