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61. 发明专利

AU2002236576A1 Electromagnetically coupled interconnect system architecture 未知
公开(公告)号：AU2002236576A1
公开(公告)日：2002-11-18
申请号：AU2002236576
申请日：2001-11-13
申请人： FORMFACTOR INC
发明人： MILLER CHARLES A
IPC分类号： H04B5/02 , H04B5/00 , G06F13/40
摘要： The invention relates to an electronics system comprising a first integrated circuit (112(i), 600, 604) including a first electromagnetic coupler (118(i), 601, 602), and a second integrated circuit (112(i), 600, 604) including a second electromagnetic coupler (118(i), 601, 602). According to the invention said first integrated circuit and said second integrated circuit are disposed such that said first electromagnetic coupler and said second electromagnetic coupler are spaced from each other but within sufficient proximity to be electromagnetically coupled, whereby data provided to said first electromagnetic coupler is contactlessly communicated to said second electromagnetic coupler.

62. 发明专利

AU3986601A Integrated circuit interconnect system 未知
公开(公告)号：AU3986601A
公开(公告)日：2001-09-03
申请号：AU3986601
申请日：2001-02-21
申请人： FORMFACTOR INC
发明人： MILLER CHARLES A
IPC分类号： H01L23/522 , H01L23/60 , H01L23/62 , H01L27/02
摘要： In an interconnect system for providing access to a common I/O terminal for multiple circuit devices such as drivers, receivers and electrostatic discharge (ESD) protection devices implemented on an IC, each such device is provided with a separate contact pad within the IC. The contact pads (82A, 82B) are linked to one another and to the IC I/O terminal though inductive conductors such as bond wires (88A, 88B), metalization layer traces in the IC, or legs of a forked, lithographically-defined spring contact formed on the IC. The conductor inductance isolates the capacitance of the circuit devices from one another, thereby improving characteristics of the frequency response of the interconnect system. Also the ESD protection function is distributed among multiple ESD devices interconnected by series inductors to provide a multi-pole filter at each IC terminal. The inductances of the conductors and various capacitances of the interconnect system are also appropriately adjusted to optimize desired interconnect system frequency response characteristics.

63. 发明专利

AU3381900A Parallel testing of integrated circuit devices using cross-dut and within-dut comparisons 未知
公开(公告)号：AU3381900A
公开(公告)日：2000-09-21
申请号：AU3381900
申请日：2000-02-24
申请人： FORMFACTOR INC
发明人： ROY RICHARD S , MILLER CHARLES A
IPC分类号： G01R31/319 , G01R31/3193 , G11C29/56 , G11C29/00

64. 发明专利

AU3245900A Distributed interface for parallel testing of multiple devices using a single tester channel 未知
公开(公告)号：AU3245900A
公开(公告)日：2000-09-21
申请号：AU3245900
申请日：2000-02-24
申请人： FORMFACTOR INC
发明人： ROY RICHARD S , MILLER CHARLES A
IPC分类号： G01R31/28 , G01R31/319 , G01R31/3193 , G11C29/48 , G11C29/56 , H01L21/66 , G11C29/00
摘要： A system for testing a number of integrated circuit (IC) devices under test (DUTs) having interface circuitry coupled to a single or multi-channel tester for receiving data values from the tester and providing error information concerning the DUTs. The interface circuitry forwards data values (received from the tester over a single channel) to a number of DUTs in parallel. The circuitry performs comparisons using data values read from the DUTs, and in response generates error values indicative of the comparison. The error values may then be returned to the tester over the same or a different channel.

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