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61. 发明专利

JP2010118432A Electronic apparatus and method for manufacturing the same 有权
标题翻译：电子装置及其制造方法
公开(公告)号：JP2010118432A
公开(公告)日：2010-05-27
申请号：JP2008289627
申请日：2008-11-12
申请人： Denso Corp , 株式会社デンソー
发明人： SANADA SUKENORI , IMAIZUMI NORIHISA , KAYUKAWA KIMIJI
IPC分类号： H01L23/48
CPC分类号： H01L24/32 , H01L2224/32245
摘要： PROBLEM TO BE SOLVED: To prevent Cu in a base metal of a lead frame from diffusing to a solder side and to minimize the occurrence of voids at a bonding interface between the lead frame and the solder even when a thickness of Ni plating on a surface of the base metal is insufficient or zero, in an electronic apparatus where the lead frame, the base metal of which includes a Cu alloy, and an electronic component are bonded together via the solder. SOLUTION: Solder 30 contains an Sn-Cu alloy, and a base metal 11 of a lead frame 10 contains 0.3 wt.% or more of Sn. An alloy layer 40 including an alloy of Cu and a component of the solder 30 is interposed between the base metal 11 and the solder 30. The base metal 11 and the solder 30 are in direct contact with the alloy layer 40, respectively. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了防止引线框架的母材中的Cu扩散到焊料侧，并且尽可能减少引线框架和焊料之间的接合界面处的空隙的发生，即使当Ni镀层的厚度在其中包含Cu合金的基底金属的引线框架和电子部件通过焊料接合在一起的电子设备中，在母材的表面上不足或为零。解决方案：焊料30含有Sn-Cu合金，引线框10的贱金属11含有0.3重量％以上的Sn。包含Cu的合金和焊料30的成分的合金层40插入在基底金属11和焊料30之间。母材11和焊料30分别与合金层40直接接触。版权所有（C）2010，JPO＆INPIT

62. 发明专利

JP2009170947A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2009170947A
公开(公告)日：2009-07-30
申请号：JP2009113480
申请日：2009-05-08
申请人： Denso Corp , 株式会社デンソー
发明人： NAGATANI TOSHIHIRO , SAITO MITSUHIRO , FUKUDA YUTAKA , KIUCHI HIROSHI , AKAMA SADAHIRO , NUMAZAKI KOJI , IMAIZUMI NORIHISA
IPC分类号： H01L23/34 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/01019 , H01L2924/09701 , H01L2924/13055 , H01L2924/181 , H01L2924/19041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To attain proper heat dissipation characteristics, in a semiconductor device which contains a control element, and a power element controlled by the control element. SOLUTION: This semiconductor device has a heat sink 30, made of Fe which is inferior to Cu in thermal conductivity but is superior to Cu in heat storage properties, and a first wiring board 41 and a second wiring board 42 which have been mounted and separated on one side of this heatsink 30. A control element 10 is mounted on the first wiring board 41, and the power element 20 is mounted on the second wiring board 42. These elements 10 and 20, wiring boards 41 and 42, and the heatsink 30 are all molded with resin 70, and the other surface of the heatsink 30 is exposed from the resin 70. In addition, a projection 31 is formed at the side of the heatsink and this project 31 bites into the resin 70. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了获得适当的散热特性，在包含控制元件的半导体器件和由控制元件控制的功率元件中。解决方案：该半导体器件具有散热器30，其由热导率低于Cu的Fe制成，而且在蓄热性方面优于Cu;以及第一配线板41和第二布线板42 在该散热器30的一侧安装和分离。控制元件10安装在第一布线板41上，并且功率元件20安装在第二布线板42上。这些元件10和20，布线板41和42，并且散热器30都用树脂70模制，并且散热器30的另一个表面从树脂70露出。此外，在散热器侧形成突起31，并且该突起31咬入树脂70中。版权所有（C）2009，JPO＆INPIT

63. 发明专利

JP2009026791A Mold package, and manufacturing method thereof 有权
标题翻译：模具包装及其制造方法
公开(公告)号：JP2009026791A
公开(公告)日：2009-02-05
申请号：JP2007185392
申请日：2007-07-17
申请人： Denso Corp , 株式会社デンソー
发明人： HARADA YOSHIHARU , IMAIZUMI NORIHISA , SANADA SUKENORI
IPC分类号： H01L23/28
CPC分类号： H01L24/97 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To make heat during welding hard to be conducted to mold resin when a lead portion and a member to be bonded are welded in an outer leadless type mold package. SOLUTION: The outer leadless type mold package 100 such that the lower surface 32 of a lead portion 30 exposed on the lower surface 42 of the mold resin 40 is welded to the member 200 to be joined is provided with a gap portion 60 as a low-heat-conduction portion which is lower in heat conductivity than the mold resin 40 between the top surface 31 of the lead portion 30 on the opposite side from the lower surface 32, and mold resin 40. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：当在外部无引线型模具包装中焊接引线部分和待接合部件时，使焊接期间的热量难以导入模制树脂。解决方案：外部无引线型模具包装100使得露出在模制树脂40的下表面42上的引线部分30的下表面32焊接到待接合的构件200上，设置有间隙部分60 作为导热率低于与下表面32相反的一侧的引线部分30的顶表面31之间的模制树脂40的低导热部分和模制树脂40。（版权所有： C）2009年，JPO＆INPIT

64. 发明专利

JP2008171976A Method of manufacturing bonding structure 审中-公开
标题翻译：制造粘结结构的方法
公开(公告)号：JP2008171976A
公开(公告)日：2008-07-24
申请号：JP2007003177
申请日：2007-01-11
申请人： Denso Corp , 株式会社デンソー
发明人： HARADA YOSHIHARU , IMAIZUMI NORIHISA , SANADA SUKENORI
IPC分类号： H01L23/40
CPC分类号： H01L2224/48091 , H01L2224/73265 , H01L2924/19105 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To prevent sticking of splashing objects from a resin member to a heat sink, in a method of manufacturing a semiconductor device in which the heat sink and a ceramic substrate are assembled together through a thermo-setting type resin member that elastically relaxes a stress acting between the heat sink and the ceramic substrate. SOLUTION: A resin member 70 is applied on a heat sink 10, among the heat sink 10 and a ceramic substrate 20, while the resin member 70 is heated and solidified. Then, the ceramic substrate 20 is assembled to the heat sink 10 through the solidified resin member 70. Since the resin member 70 is solidified in advance not to generate splashing objects before both members 10 and 20 are assembled, sticking of the splashing objects to the heat sink 10 is prevented. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题为了防止溅射物体从树脂部件粘附到散热器，在制造半导体器件的方法中，其中散热器和陶瓷基板通过热固性树脂组装在一起弹性地松弛在散热器和陶瓷基板之间作用的应力的构件。解决方案：在树脂构件70被加热和固化的同时，在散热器10和陶瓷基板20之间的散热片10上施加树脂构件70。然后，通过凝固树脂部件70将陶瓷基板20组装到散热片10.由于树脂部件70在组装两个部件10和20之前被预先固化，不会产生飞溅物体，所以将飞溅物体粘附到防止散热片10。版权所有（C）2008，JPO＆INPIT

65. 发明专利

JP2008112924A Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：JP2008112924A
公开(公告)日：2008-05-15
申请号：JP2006296198
申请日：2006-10-31
申请人： Denso Corp , 株式会社デンソー
发明人： YAMAGISHI TETSUTO , HARADA YOSHIHARU , HIROSE SHINICHI , IMAIZUMI NORIHISA
IPC分类号： H01L21/56
CPC分类号： H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2224/85 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To maximally prevent the occurrence of voids between semiconductor elements or the flow of a wire located between the semiconductor elements owing to a resin flow-velocity difference between each path on an element and each path outside an element in a manufacturing method for a semiconductor device composed by sealing a plurality of semiconductor elements arrayed on a lead frame with a resin. SOLUTION: Each projection 700, projecting from each portion corresponding to each path 602 outside an element on the inner face of a cavity 503, is provided to a die 500 so that a flow velocity of the resin 50 flowing in each path 601 on an element has magnitude being the same or more than that of a flow velocity of the resin 50 flowing in each path 602 outside an element. Sealing by the resin 50 is executed while using the die 500 provided with each projection 700. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了最大程度地防止半导体元件之间的空隙的发生或位于半导体元件之间的导线的流动，这是由于元件上的每个路径和元件外部的每个路径之间的树脂流速差异一种半导体器件的制造方法，其通过用树脂密封排列在引线框架上的多个半导体元件。解决方案：从腔503的内表面上的元件外部的每个路径602的每个部分突出的每个突起700被提供给模具500，使得在每个路径601中流动的树脂50的流速在元件上的量值与在元件外部的每个路径602中流动的树脂50的流速相同或更大。在使用设置有每个突起700的模具500的同时，通过树脂50进行密封。版权所有（C）2008，JPO＆INPIT

66. 发明专利

JP2007201036A Electronic device and its manufacturing process 有权
标题翻译：电子器件及其制造工艺
公开(公告)号：JP2007201036A
公开(公告)日：2007-08-09
申请号：JP2006015925
申请日：2006-01-25
申请人： Denso Corp , 株式会社デンソー
发明人： SANADA SUKENORI , ISHIKAWA TAKESHI , IMAIZUMI NORIHISA
IPC分类号： H01L23/12 , H01L21/56 , H01L23/29 , H01L23/50
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2224/4903 , H01L2224/73265 , H01L2224/92247 , H01L2924/19105 , H01L2924/19107 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To suppress stripping of a heat sink and a mold resin in a resin sealed electronic device where the heat sink is sealed with mold resin. SOLUTION: In the electronic device where a wiring board 20 mounting electronic components 40 and 41 is mounted on one surface 11 of a heat sink 10 and the heat sink 10, the electronic components 40 and 41 and the wiring board 20 are sealed of mold resin 80, an electroless Ni plating film 10a is formed at least at a part on the surface of the heat sink 10 touching the mold resin 80 by performing electroless plating of Ni, and the surface of the electroless Ni plating film 10a is roughened to have an irregular form. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：在模具树脂密封散热器的树脂密封电子设备中抑制散热器和模具树脂的剥离。解决方案：在将电子部件40和41的布线板20安装在散热片10的一个表面11和散热片10上的电子装置中，将电子部件40,41与布线基板20密封的模塑树脂80中，通过进行Ni的无电镀，至少在散热片10的与模具树脂80接触的表面的至少一部分上形成化学镀镍膜10a，并且化学镀镍膜10a的表面被粗糙化有不规则的形式。版权所有（C）2007，JPO＆INPIT

67. 发明专利

JP2007073674A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2007073674A
公开(公告)日：2007-03-22
申请号：JP2005257822
申请日：2005-09-06
申请人： Denso Corp , 株式会社デンソー
发明人： FUKUDA YUTAKA , SAITO MITSUHIRO , NAGATANI TOSHIHIRO , MAEDA YUKIHIRO , IMAIZUMI NORIHISA , ASAI YASUTOMI
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2924/13055 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a structure for reducing thermal resistance to improve the heat dissipating property of the power element, in a semiconductor device equipped with a power element. SOLUTION: The semiconductor device is equipped with vertical type semiconductor elements 11-14 constituted so as to make current flow between a source pad formed on the front surface side of the semiconductor substrate and a drain pad formed on the rear surface of the substrate, lead wires 31-34, 41-44 and ribbon lead wires 21-24 as wirings and heat sinks, and resin 90 which seals one end side of the semiconductor elements 11-14 and lead wires 31-34, 41-44. In this case, lead wires 41-44 are connected directly to respective drain pads of respective semiconductor elements 11-14 while one of the ribbon lead wires 21-24 are connected directly to respective source pads of respective semiconductor elements 11-14, and the other parts are connected to the lead wires 31-34. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种在配备有功率元件的半导体器件中提供用于降低热阻的结构，以提高功率元件的散热性能。解决方案：半导体器件配备有垂直型半导体元件11-14，其构成为在半导体衬底的前表面侧上形成的源焊盘和形成在半导体衬底的背面上的漏极焊盘之间形成电流基板，引线31-34,41-44和带状导线21-24作为布线和散热器，以及密封半导体元件11-14的一端侧和引线31-34,44-44的树脂90。在这种情况下，引线41-44直接连接到各个半导体元件11-14的各个漏极焊盘，而其中一个带状引线21-24直接连接到各个半导体元件11-14的各个源极焊盘，并且其他部分连接到引线31-34。版权所有（C）2007，JPO＆INPIT

68. 发明专利

JP2005328015A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2005328015A
公开(公告)日：2005-11-24
申请号：JP2004200448
申请日：2004-07-07
申请人： Denso Corp , 株式会社デンソー
发明人： SAITO MITSUHIRO , NAGATANI TOSHIHIRO , FUKUDA YUTAKA , KIUCHI HIROSHI , AKAMA SADAHIRO , NUMAZAKI KOUJI , IMAIZUMI NORIHISA
IPC分类号： H01L23/36 , H01L23/29 , H01L25/00
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/01019 , H01L2924/09701 , H01L2924/13055 , H01L2924/19041 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which contains a control element and a power element controlled by the control element and has a good heat dissipation characteristic. SOLUTION: This semiconductor device has a heat sink 30 made of Fe inferior to Cu in heat conductivity but superior to Cu in heat storage property; a first wiring board 41; and a second wiring board 42 which have been mounted and separated on one side of this heatsink 30. A control element 10 is mounted on the first wiring board 41 and a power element 20 on the second wiring board 42. These elements 10 and 20, wiring boards 41 and 42 and heatsink 30 are all molded with resin 70, and the other surface of the heatsink 30 are exposed from the resin 70. In addition, a projection 31 is formed at the side of the heatsink and this project 31 encroaches into the resin 70. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种包含控制元件和由控制元件控制的功率元件并具有良好散热特性的半导体器件。解决方案：该半导体器件具有散热体30，该散热体30具有导热性低于Cu的Fe，而且在储热性方面优于Cu; 第一布线板41; 以及在该散热器30的一侧安装分离的第二配线基板42.控制元件10安装在第一配线基板41和第二配线基板42上的功率元件20上。这些元件10,20，接线板41和42以及散热片30都用树脂70模制，并且散热片30的另一个表面从树脂70露出。此外，在散热片侧形成突起31，并且该工程31侵入树脂70.版权所有（C）2006，JPO＆NCIPI

69. 发明专利

JP2015026820A 電子装置审中-公开
标题翻译：电子设备
公开(公告)号：JP2015026820A
公开(公告)日：2015-02-05
申请号：JP2014106198
申请日：2014-05-22
申请人：株式会社デンソー , Denso Corp
发明人： TAKENAKA MASAYUKI , IMAIZUMI NORIHISA , NAKAMURA TOSHIHIRO
IPC分类号： H05K7/14 , H05K1/02
CPC分类号： H05K5/0004 , H01L2224/48091 , H01L2924/181 , H05K1/0204 , H05K1/0209 , H05K1/0271 , H05K1/115 , H05K1/116 , H05K3/284 , H05K3/3447 , H05K5/0056 , H05K5/0247 , H05K7/20409 , H05K2201/066 , H01L2924/00012 , H01L2924/00014
摘要：【課題】小型化を図ることが可能な構造の電子装置を提供する。【解決手段】電子部品20、30を実装してモールド樹脂40で封止した基板10を、一面11側が底面61側を向くようにして収容凹部63内に収容する。つまり、電子部品20、30の実装面側であって、モールド樹脂40が配置された面側から接続端子65の先端部が挿入され、モールド樹脂40が接続端子65の先端位置より根元位置までの間に位置するようにして基板10を収容凹部63内に収容する。これにより、モールド樹脂40の高さ分のデッドスペースが形成されないようにできると共に、接続端子65の長さを稼ぐことができる。したがって、小型化が図れると共に接続信頼性を確保することが可能な構造の電子装置とすることが可能となる。【選択図】図1
摘要翻译：要解决的问题：提供具有能够实现尺寸减小的结构的电子设备。解决方案：将电子部件20,30安装成用模制树脂40密封的基板10容纳在壳体凹部63内一个表面11侧面向底面61侧。也就是说，基板10容纳在壳体凹部63内，使得连接端子65的前端从设置有模制树脂40的表面的一侧插入，电子部件的安装表面侧 20,30，并且模制树脂40位于连接端子65的尖端位置和其根部位置之间。因此，不能形成几乎等于模制树脂40的高度的死角，并且可以获得连接端子65的长度。因此，可以提供具有可以实现小尺寸并且确保连接可靠性的结构的电子设备。

70. 发明专利

JP2015026811A 電子装置およびその製造方法有权
标题翻译：电子设备及其制造方法
公开(公告)号：JP2015026811A
公开(公告)日：2015-02-05
申请号：JP2014065942
申请日：2014-03-27
申请人：株式会社デンソー , Denso Corp
发明人： IMAIZUMI NORIHISA , SANADA YUKI , TAKENAKA MASAYUKI , UCHIBORI SHINYA , OKA KENGO , FUKUDA TASUKE , NAKAMA KEITARO
IPC分类号： H01L23/29 , H01L21/301 , H01L21/56 , H01L23/28 , H01L23/31
CPC分类号： H01L23/3121 , H01L21/561 , H01L23/49838 , H01L24/97 , H01L25/00 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19105 , H01L2924/00
摘要：【課題】ダイシングブレードでモールド樹脂を切断する際、ダイシングブレードが蛇行することを抑制する。【解決手段】基板10は、一面11と他面12との間の側面の少なくとも1つの側面10aがモールド樹脂40と共に切断された切断面であるものとする。そして、モールド樹脂40は、基板10と共に切断され、切断面と同一平面となる面40cを有し、当該面40cを構成する部分は同一平面となる面40cと連結され、かつ基板10の一面11と平行な面40bを有すると共に電子部品20、30を封止する部分の厚さよりも薄いものとする。これによれば、モールド樹脂40は基板10の一面11と平行な面にダイシングブレード210が当接されて切断される。このため、切断方向とダイシングブレード210が当接する面とが垂直となり、ダイシングブレードが蛇行することを抑制できる。【選択図】図1
摘要翻译：要解决的问题：为了抑制切割刀片在切割切割刀片时切割模制树脂时的蜿蜒曲折。解决方案：在基板10中，一个表面11和其它表面12之间的侧表面的至少一个侧表面10a是切口通过用模制树脂40切割而形成的表面。模制树脂40具有用基板10切割并与切割表面在同一平面上的表面40c。构成表面40c的部分具有表面40b，该表面40c连接到与切割表面在同一平面上且与基底10的一个表面11平行的表面40c，该部分的厚度小于基底10的一个表面11。一部分密封电子部件20,30。因此，通过使切割刀片210与平行于基板10的一个表面11的表面接触来切割模制树脂40.因此，切割方向垂直于表面切割刀片210与其接触，从而可以防止切割刀片的蜿蜒曲折。

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