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61. 外观设计

USD714256S1 Liftable acoustic cradle for tablet 有权
标题翻译：可升降式摇篮
公开(公告)号：USD714256S1
公开(公告)日：2014-09-30
申请号：US29423742
申请日：2012-06-05
申请人： Hui-Jou Tsai , Yung-Hsiang Chen , Wen-Yi Chiu , Kuan-Yu Chou , Hsing-Yi Kao , Hsiang-Ling Liu
设计人： Hui-Jou Tsai , Yung-Hsiang Chen , Wen-Yi Chiu , Kuan-Yu Chou , Hsing-Yi Kao , Hsiang-Ling Liu

62. 发明申请

US20130314859A1 ELECTRONIC DEVICE 有权
标题翻译：电子设备
公开(公告)号：US20130314859A1
公开(公告)日：2013-11-28
申请号：US13888393
申请日：2013-05-07
申请人： Pei-Pin Huang , Li-Fang Chen , Yung-Hsiang Chen
发明人： Pei-Pin Huang , Li-Fang Chen , Yung-Hsiang Chen
IPC分类号： H05K7/02
CPC分类号： G06F1/1662 , G06F1/1616 , G06F1/1618 , G06F1/162 , G06F1/1624 , G06F1/1637 , G06F1/1664 , G06F1/1667 , G06F1/1669 , G06F1/1681 , H05K7/02 , Y10T16/540255
摘要： An electronic device includes first and second bodies. The second body includes a display module and a supporting assembly. The supporting assembly includes a sliding component slidably disposed on the display module and a pivot component pivoted to the first body and the sliding component. When the second body expands from the first body through the rotation of the pivot component relative to the first body, the sliding component and the pivot component are adapted to rotate relative to each other so that a bottom side of the display module moves to a predetermined position on the first body. When the bottom side is located at the predetermined position, the sliding component and the display module are adapted to slide relative to each other so that the display module rotate around the bottom side, so as to change an included angle between the display module and the first body.
摘要翻译：电子设备包括第一和第二主体。第二主体包括显示模块和支撑组件。支撑组件包括可滑动地布置在显示器模块上的滑动部件和枢转于第一主体和滑动部件的枢转部件。当第二主体通过枢转部件相对于第一主体的旋转而从第一主体膨胀时，滑动部件和枢轴部件适于相对于彼此旋转，使得显示模块的底侧移动到预定的在第一个身体的位置。当底侧位于预定位置时，滑动部件和显示模块适于相对于彼此滑动，使得显示模块围绕底侧旋转，以便改变显示模块和显示模块之间的夹角第一体。

63. 发明申请

US20130201617A1 ELECTRONIC DEVICE 有权
标题翻译：电子设备
公开(公告)号：US20130201617A1
公开(公告)日：2013-08-08
申请号：US13723124
申请日：2012-12-20
申请人： Hui-Jou Tsai , Yung-Hsiang Chen , Wen-Yi Chiu , Kuan-Yu Chou , Chuan-Hao Wen , Chun-Huang Yu , Chao-Tung Hsu , Chih-Yin Lai , Chia-Sheng Liu , Hsiang-Ling Liu
发明人： Hui-Jou Tsai , Yung-Hsiang Chen , Wen-Yi Chiu , Kuan-Yu Chou , Chuan-Hao Wen , Chun-Huang Yu , Chao-Tung Hsu , Chih-Yin Lai , Chia-Sheng Liu , Hsiang-Ling Liu
IPC分类号： G06F1/16
CPC分类号： G06F1/1633 , G06F1/1616 , G06F1/1675 , H05K5/0217
摘要： An electronic device including a first body, an input module and a functional element is provided. The input module is movably disposed on the first body and adapted to be moved between a first position and a second position. The functional element is disposed on the input module. When the input module is located at the first position, the functional element is concealed in the first body. When the input module is located at the second position, the functional element is exposed outside the first body.
摘要翻译：提供了包括第一主体，输入模块和功能元件的电子设备。输入模块可移动地设置在第一主体上并适于在第一位置和第二位置之间移动。功能元件设置在输入模块上。当输入模块位于第一位置时，功能元件被隐藏在第一体中。当输入模块位于第二位置时，功能元件暴露在第一主体外部。

64. 外观设计

USD683343S1 Dual hinge for notebook computer 有权
标题翻译：笔记本电脑双铰链
公开(公告)号：USD683343S1
公开(公告)日：2013-05-28
申请号：US29410592
申请日：2012-01-10
申请人： Chuan-Hao Wen , Yung-Hsiang Chen , Tzu-Chien Lai , Chien-Hung Lee , Ting-Wei Wu
设计人： Chuan-Hao Wen , Yung-Hsiang Chen , Tzu-Chien Lai , Chien-Hung Lee , Ting-Wei Wu

65. 外观设计

USD681629S1 Computer with slide in-and-out module 有权
标题翻译：具有滑动进出模块的计算机
公开(公告)号：USD681629S1
公开(公告)日：2013-05-07
申请号：US29420313
申请日：2012-05-08
申请人： Chien-I Lin , Tzu-Chien Lai , Cheng-Jui Lin , Yung-Hsiang Chen
设计人： Chien-I Lin , Tzu-Chien Lai , Cheng-Jui Lin , Yung-Hsiang Chen

66. 发明授权

US08361841B2 Mold array process method to encapsulate substrate cut edges 有权
标题翻译：模具阵列法封装衬底切割边缘
公开(公告)号：US08361841B2
公开(公告)日：2013-01-29
申请号：US13093476
申请日：2011-04-25
申请人： Kuo-Yuan Lee , Yung-Hsiang Chen , Wen-Chun Chiu
发明人： Kuo-Yuan Lee , Yung-Hsiang Chen , Wen-Chun Chiu
IPC分类号： H01L21/00
CPC分类号： H01L24/97 , H01L24/73 , H01L2224/32013 , H01L2224/32225 , H01L2224/48227 , H01L2224/4824 , H01L2224/50 , H01L2224/73215 , H01L2224/73265 , H01L2224/97 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/00012 , H01L2224/85 , H01L2924/00
摘要： Disclosed is a mold array process (MAP) method to encapsulate cut edges of substrate units. A substrate strip includes a plurality of substrate units arranged in a matrix. Scribe lines are defined between adjacent substrate units and at the peripheries of the matrix where pre-cut grooves are formed along the scribe lines with a width greater than the width of the scribe lines. An encapsulant is formed on the matrix of the substrate strip to continuously encapsulate the substrate units and the scribe lines to enable the encapsulant to fill into the pre-cut grooves to further encapsulate the cut edges of the substrate units. The cut edges of the substrate units are still encapsulated by the encapsulant even after singulation processes where substrate units are singulated into individual semiconductor packages to prevent the exposure of the plated traces of the substrate units to enhance the moisture resistance capability of the semiconductor packages.
摘要翻译：公开了一种用于封装基板单元的切割边缘的模具阵列工艺（MAP）方法。衬底条包括布置成矩阵的多个衬底单元。划线在相邻的基板单元之间以及在矩形的周边处被限定，其中沿着划线形成预切割槽，其宽度大于划线的宽度。在衬底条的矩阵上形成密封剂以连续地包封衬底单元和划痕线，以使密封剂能够填充到预切割凹槽中以进一步封装衬底单元的切割边缘。衬底单元的切割边缘即使在将衬底单元划分成单个半导体封装的单独处理之后仍然被密封剂封装，以防止衬底单元的电镀迹线的暴露，以增强半导体封装的耐湿性能。

67. 外观设计

USD665800S1 Notebook computer 有权
公开(公告)号：USD665800S1
公开(公告)日：2012-08-21
申请号：US29393158
申请日：2011-05-31
申请人： Wei-Chih Hsu , Yung-Hsiang Chen , Cheng-Jui Lin
设计人： Wei-Chih Hsu , Yung-Hsiang Chen , Cheng-Jui Lin

68. 发明申请

US20120115277A1 MULTI-CHIP STACKING METHOD TO REDUCE VOIDS BETWEEN STACKED CHIPS 有权
标题翻译：多芯片堆叠方法可以减少堆叠卡片之间的声音
公开(公告)号：US20120115277A1
公开(公告)日：2012-05-10
申请号：US13311257
申请日：2011-12-05
申请人： Kuo-Yuan LEE , Yung-Hsiang Chen , Wen-Chun Chiu
发明人： Kuo-Yuan LEE , Yung-Hsiang Chen , Wen-Chun Chiu
IPC分类号： H01L21/56 , H01L21/78
CPC分类号： H01L21/565 , H01L21/561 , H01L23/3128 , H01L24/04 , H01L24/06 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/04042 , H01L2224/05554 , H01L2224/06135 , H01L2224/06136 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2224/83191 , H01L2224/838 , H01L2224/85013 , H01L2224/85186 , H01L2224/8592 , H01L2224/85951 , H01L2224/97 , H01L2225/0651 , H01L2225/06565 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01059 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/10161 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2224/92247 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要： A multi-chip stacking method to reduce voids between stacked chips is revealed. A first chip is disposed on a substrate, and a plurality of first bonding wires are formed by wire bonding to electrically connect the first chip and the substrate. A second chip is disposed on an active surface of the first chip where a FOW (film over wire) adhesive is formed on a back surface of the second chip. The FOW adhesive partially encapsulates the first bonding wires and adheres to the active surface of the first chip. Then, the substrate is placed in a pressure oven to provide a positive pressure greater than one atm during thermally curing the FOW adhesive with exerted pressures. Accordingly, voids can be reduced inside the FOW adhesive during the multi-chip stacked processes where issues of poor adhesion and popcorn between chips can be avoided.
摘要翻译：揭示了减少堆叠芯片之间的空隙的多芯片堆叠方法。第一芯片设置在基板上，并且通过引线接合形成多个第一接合线以电连接第一芯片和基板。第二芯片设置在第一芯片的有源表面上，其中在第二芯片的背面上形成有FOW（覆膜上）粘合剂。 FOW粘合剂部分地封装第一粘合线并粘附到第一芯片的有效表面。然后，在施加压力的FOW粘合剂热固化期间，将基底放置在压力烘箱中以提供大于1atm的正压。因此，在多芯片堆叠过程中，可以在FOW粘合剂内部减少空隙，其中可以避免芯片之间的粘附不良和爆米花的问题。

69. 外观设计

USD649543S1 Electronic computer 有权
标题翻译：电子电脑
公开(公告)号：USD649543S1
公开(公告)日：2011-11-29
申请号：US29381672
申请日：2010-12-22
申请人： Huai-Te Tseng , Hong-Tien Wang , Yung-Hsiang Chen , You-Chi Liu , Shi Kuan Chen
设计人： Huai-Te Tseng , Hong-Tien Wang , Yung-Hsiang Chen , You-Chi Liu , Shi Kuan Chen

70. 发明申请

US20110062788A1 Wirless power supply device 审中-公开
标题翻译：无线供电装置
公开(公告)号：US20110062788A1
公开(公告)日：2011-03-17
申请号：US12585527
申请日：2009-09-17
申请人： Yung-Hsiang Chen , Nan-Sheng Chang , Yung-Hsin Liang
发明人： Yung-Hsiang Chen , Nan-Sheng Chang , Yung-Hsin Liang
IPC分类号： H02J17/00
CPC分类号： H02J50/12 , H02J5/005
摘要： A wireless power supply device is adapted for providing electric power to an exterior electronic appliance. The wireless power supply includes a transmitting unit and a receiving unit. The transmitting unit includes a power unit for providing power to a voltage-controlled oscillator circuit and a signal amplification unit, the voltage-controlled oscillator circuit for receiving the power and then generating corresponding radio signals, the signal amplification unit for amplifying the radio signals generated by the voltage-controlled oscillator circuit and a transmitting antenna module for transmitting out the radio signals amplified by the signal amplification unit. The receiving unit includes a receiving antenna for wirelessly receiving the radio signals transmitted by the transmitting antenna module and then transforming the radio signals into electric power for being provided to the exterior electronic appliance.
摘要翻译：无线供电装置适于向外部电子设备提供电力。无线电源包括发送单元和接收单元。发射单元包括用于向压控振荡器电路和信号放大单元提供电力的功率单元，用于接收功率然后产生相应无线电信号的压控振荡器电路，用于放大产生的无线电信号的信号放大单元通过压控振荡器电路和用于发送由信号放大单元放大的无线电信号的发送天线模块。接收单元包括用于无线地接收由发送天线模块发送的无线电信号，然后将无线电信号转换成电力以供提供给外部电子设备的接收天线。

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