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61. 发明授权

US07068508B2 Docking station cooling system including liquid-filled hollow structure 有权
标题翻译：对接站冷却系统，包括充满液体的中空结构
公开(公告)号：US07068508B2
公开(公告)日：2006-06-27
申请号：US10728889
申请日：2003-12-08
申请人： Chandrakant Patel , Cullen E. Bash
发明人： Chandrakant Patel , Cullen E. Bash
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , G06F2200/201
摘要： A docking station includes a housing receiving a portable computer. A liquid-filled hollow structure is provided on a portion of the housing. The liquid-filled hollow structure is in thermally conductive relation to the portable computer when the portable computer is docked in the docking station such that heat is transferred from the portable computer to the liquid-filled hollow structure.
摘要翻译：坞站包括容纳便携式计算机的壳体。在壳体的一部分上设置充满液体的中空结构。当便携式计算机对接在对接站中时，液体填充的中空结构与便携式计算机处于导热关系，使得热量从便携式计算机传送到充满液体的中空结构。

62. 发明授权

US08626355B2 Cooling provisioning management in a three dimensional package 有权
标题翻译：冷却配置管理三维包
公开(公告)号：US08626355B2
公开(公告)日：2014-01-07
申请号：US12935985
申请日：2008-04-01
申请人： Amip Shah , Chandrakant Patel
发明人： Amip Shah , Chandrakant Patel
IPC分类号： G05D23/00
CPC分类号： G06F1/206 , G06F1/3203 , G06F1/3287 , G06F1/329 , Y02D10/16 , Y02D10/171 , Y02D10/24
摘要： In a method for managing cooling provisioning in a three-dimensional package containing a plurality of stacked die with a cooling system having at least one active cooling mechanism, at least one of workload on and an environmental condition at or around one of the plurality of stacked die is identified. In addition, at least one of the active cooling mechanism and the one of the plurality of stacked die is controlled based upon at least one of the identified workload and environmental condition.
摘要翻译：一种用于管理三维包装中的冷却供应的方法，所述三维包装包含具有至少一个主动冷却机构的冷却系统的多个堆叠管芯，所述多个堆叠管芯中的至少一个堆叠死亡被识别。此外，基于所识别的工作量和环境条件中的至少一个来控制主动冷却机构和多个堆叠管芯中的至少一个。

63. 发明授权

US08053748B2 Integrated circuits with phase change devices 有权
标题翻译：具有相变装置的集成电路
公开(公告)号：US08053748B2
公开(公告)日：2011-11-08
申请号：US12254607
申请日：2008-10-20
申请人： Amip Shah , Chandrakant Patel , Ratnesh Sharma , Cullen Bash
发明人： Amip Shah , Chandrakant Patel , Ratnesh Sharma , Cullen Bash
IPC分类号： H01L29/02 , H01L21/00
CPC分类号： H01L23/34 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments include methods, apparatus, and systems with integrated circuits having phase change devices. One embodiment includes an integrated circuit die and a phase change die having a phase change material that changes phases when a temperature at the integrated circuit die exceeds a threshold for a predetermined amount of time.
摘要翻译：实施例包括具有具有相变装置的集成电路的方法，装置和系统。一个实施例包括集成电路管芯和具有相变材料的相变管芯，该相变材料在集成电路管芯的温度超过阈值达预定时间量时改变相位。

64. 发明申请

US20060214014A1 Temperature control using a sensor network 有权
标题翻译：使用传感器网络进行温度控制
公开(公告)号：US20060214014A1
公开(公告)日：2006-09-28
申请号：US11089608
申请日：2005-03-25
申请人： Cullen Bash , Chandrakant Patel , Ratnesh Sharma
发明人： Cullen Bash , Chandrakant Patel , Ratnesh Sharma
IPC分类号： F25B9/00 , F24F7/00 , G05D23/00
CPC分类号： H05K7/20745 , F24F11/30 , F24F11/63 , F24F2110/10 , G05D23/1931 , H05K7/20836
摘要： In a method for controlling temperature using a sensor network, the sensors of the sensor network are commissioned and one of a plurality of control schemes for operating a primary actuator configured to vary temperatures of the sensors based upon energy utilization requirements of the plurality of control schemes is selected. In addition, the selected one of the plurality of control schemes is implemented to vary the temperatures detected by the sensors.
摘要翻译：在使用传感器网络控制温度的方法中，传感器网络的传感器被调试，并且用于操作主致动器的多个控制方案中的一个被配置为基于多个控制方案的能量利用要求来改变传感器的温度被选中。此外，实现多个控制方案中的所选择的一个以改变由传感器检测到的温度。

65. 发明申请

US20060162363A1 Two-fluid spray cooling system 有权
标题翻译：双流体喷雾冷却系统
公开(公告)号：US20060162363A1
公开(公告)日：2006-07-27
申请号：US11040403
申请日：2005-01-21
申请人： Ratnesh Sharma , Cullen Bash , Chandrakant Patel
发明人： Ratnesh Sharma , Cullen Bash , Chandrakant Patel
IPC分类号： F28D3/00 , F25D23/12 , F28D5/00
CPC分类号： H01L23/4735 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： A cooling system including a housing forming a cooling chamber containing the component submerged in a pool of alcohol, oil or glycerine, a sprayer configured to spray water at the component through the oil or glycerine, and a heat exchanger configured to cool the oil or glycerine. A control system receives heat-generation information from temperature sensors on water-impingement regions of the component, and controls the spraying in response to this information. A pump pumps the oil or glycerine from a lower portion of the cooling chamber to the heat exchanger. A sprayer inlet draws water from an upper portion of the cooling chamber, or from a lower portion of a reservoir connected to the heat exchanger. Oil or glycerine is passed from a portion of the heat exchanger reservoir back to the cooling chamber, and water passes from an upper portion of the reservoir to the sprayer. Alternatively, the oil or glycerine could be replaced with helium.
摘要翻译：一种冷却系统，包括形成包含浸没在醇，油或甘油池中的组分的冷却室的壳体，被配置为通过油或甘油喷射组分的水的喷雾器和被配置为冷却油或甘油的热交换器。控制系统从部件的水冲击区域的温度传感器接收发热信息，并根据该信息控制喷射。泵将油或甘油从冷却室的下部泵送到热交换器。喷雾器入口从冷却室的上部或从连接到热交换器的储存器的下部抽出水。油或甘油从热交换器储存器的一部分返回到冷却室，并且水从贮存器的上部通过喷雾器。或者，油或甘油可以用氦代替。

66. 发明申请

US20060100744A1 Air conditioning unit control to reduce moisture varying operations 有权
公开(公告)号：US20060100744A1
公开(公告)日：2006-05-11
申请号：US10981487
申请日：2004-11-05
申请人： Ratnesh Sharma , Cullen Bash , Chandrakant Patel
发明人： Ratnesh Sharma , Cullen Bash , Chandrakant Patel
IPC分类号： G05B13/00
CPC分类号： H05K5/0213 , F24F11/0008 , H05K7/20745 , H05K7/20836 , Y10S165/90
摘要： In a method of operating an air conditioning unit to reduce moisture varying operations, psychrometric chart data is accessed. In addition, a constraint is set on the relationship between the temperature of air supplied by the air conditioning unit and the relative humidity of the air supplied based upon information contained in the psychrometric chart data. The air conditioning unit is controlled based upon the constraint to thereby reduce moisture varying operations of the air conditioning unit.

67. 发明申请

US20050259393A1 Air distribution system 失效
标题翻译：空气分配系统
公开(公告)号：US20050259393A1
公开(公告)日：2005-11-24
申请号：US11131710
申请日：2005-05-18
申请人： Wade Vinson , Jeffery Giardina , Joseph Allen , Christopher Malone , Chandrakant Patel , David Paquin , Rich Bargerhuff
发明人： Wade Vinson , Jeffery Giardina , Joseph Allen , Christopher Malone , Chandrakant Patel , David Paquin , Rich Bargerhuff
IPC分类号： H05K5/00 , H05K7/20
CPC分类号： H05K7/20727 , G06F1/20
摘要： A computer system comprising a plurality of electronic components disposed within a chassis. The electronic components generate a cooling load of at least 50 CFM at 2 inches of water or greater. An air mover is disposed within said chassis and is operable to generate airflow of at least 50 CFM at 2 inches of water or greater. An air distribution system is coupled to the air mover and is operable to distribute the airflow to the plurality of electronic components.
摘要翻译：一种包括设置在底盘内的多个电子部件的计算机系统。电子部件在2英寸水或更大的温度下产生至少50CFM的冷却负荷。空气移动器设置在所述底盘内，并且可操作以产生至少50CFM的气流，2英寸水或更大。空气分配系统联接到空气推进器并且可操作以将气流分配到多个电子部件。

68. 发明申请

US20050113978A1 Data connectivity with a robotic device 有权
标题翻译：与机器人设备的数据连接
公开(公告)号：US20050113978A1
公开(公告)日：2005-05-26
申请号：US10721264
申请日：2003-11-26
申请人： Ratnesh Sharma , Cullen Bash , Chandrakant Patel , Gopalakrishnan Janakiraman
发明人： Ratnesh Sharma , Cullen Bash , Chandrakant Patel , Gopalakrishnan Janakiraman
IPC分类号： G05D1/02 , G05D23/19 , G06F19/00
CPC分类号： G05D1/0282 , G05D1/0225 , G05D1/0234 , G05D1/0246 , G05D1/0255 , G05D23/1932 , G05D2201/0207
摘要： A method for data connectivity in a room with a robotic device. In the method, at least one condition is detected with a plurality of sensors and the detected at least one condition is communicated from the sensors to associated access points. One or more of the access points are selected and the robotic device is maneuvered to a location in a vicinity of one or more of the selected access points. The detected at least one condition is communicated from one or more of the selected access points to the robotic device. In addition, the robotic device is maneuvered to a location in a vicinity of a base station and the detected at least one condition is communicated from the robotic device to the base station.
摘要翻译：一种具有机器人装置的房间中数据连接的方法。在该方法中，用多个传感器检测至少一个条件，并且将检测到的至少一个条件从传感器传送到相关联的接入点。选择一个或多个接入点，并且将机器人设备操纵到所选择的接入点中的一个或多个附近的位置。所检测到的至少一个条件从所选择的接入点中的一个或多个传送到机器人设备。此外，机器人设备被操纵到基站附近的位置，并且将检测到的至少一个条件从机器人设备传送到基站。

69. 发明授权

US5587882A Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate 失效
标题翻译：用于散热器的热接口和安装在基板上的多个集成电路
公开(公告)号：US5587882A
公开(公告)日：1996-12-24
申请号：US521480
申请日：1995-08-30
申请人： Chandrakant Patel
发明人： Chandrakant Patel
IPC分类号： H01L23/36 , H01L23/367 , H01L25/065 , H05K7/20
CPC分类号： H01L23/3675 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83101 , H01L2924/15312 , H01L2924/16152 , H01L2924/16315 , H01L2924/166
摘要： A referencing scheme provides a thermal interface between a heat sink and chips within a MultiChip Module (MCM). The referencing scheme comprises a heat sink with a support ring that penetrates a trough formed within a substrate of the MCM. A thermal transfer medium positioned between the heat sink and the chips forms a thermal interface having a low thermal resistance. This cools the chips and ensures reliable operation of the MCM. The trough is filled with a curable adhesive, securing the heat sink to the substrate of the MCM.
摘要翻译：参考方案提供散热器和多芯片模块（MCM）内的芯片之间的热接口。参考方案包括具有穿过形成在MCM的衬底内的槽的支撑环的散热器。位于散热器和芯片之间的热转印介质形成具有低热阻的热界面。这样可以冷却芯片，确保MCM的可靠运行。槽中填充有可固化的粘合剂，将散热片固定到MCM的基材上。

70. 发明授权

US5396403A Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate 失效
标题翻译：具有用于衬底上的多个集成电路的导热板的散热器组件
公开(公告)号：US5396403A
公开(公告)日：1995-03-07
申请号：US88288
申请日：1993-07-06
申请人： Chandrakant Patel
发明人： Chandrakant Patel
IPC分类号： H01L23/34 , H01L23/433 , H05K7/20
CPC分类号： H01L23/433 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01019 , H01L2924/01068 , H01L2924/16152 , H01L2924/3011
摘要： A heat sink assembly for a multichip module. A thermally conductive plate is bonded to integrated circuit chips on a multichip module by indium solder. The plate in turn is thermally coupled to a heat sink such as finned aluminum by thermal paste. The plate is made of a material such as silicon carbide or copper-tungsten alloy having a relatively low coefficient of expansion to minimize mechanical stress resulting from lateral motion of the chips due to thermal expansion. Relatively low-power chips may be thermally coupled to the plate by thermal paste instead of being bonded by solder.
摘要翻译：用于多芯片模块的散热器组件。导热板通过铟焊料与多芯片组件上的集成电路芯片接合。该板依次通过热粘贴热耦合到诸如翅片铝的散热器。该板由诸如碳化硅或铜 - 钨合金的材料制成，具有相对较低的膨胀系数，以最小化由于热膨胀而导致芯片的横向运动引起的机械应力。相对低功率的芯片可以通过热焊膏热耦合到板上，而不是通过焊料粘合。

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