专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明授权

US07082778B2 Self-contained spray cooling module 有权
标题翻译：独立喷雾冷却模块
公开(公告)号：US07082778B2
公开(公告)日：2006-08-01
申请号：US10656588
申请日：2003-09-04
申请人： Chandrakant D. Patel , Cullen E. Bash
发明人： Chandrakant D. Patel , Cullen E. Bash
IPC分类号： F25D23/12
CPC分类号： H01L23/4336 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor chip cooling system having a body that forms an enclosed spray chamber, and having a thermal-transmittance wall configured to conformingly adjoin to a chip, a substrate or printed circuit board carrying one or more chips, or another such heated device. Inkjet-type sprayers are configured to spray cooling fluid on the thermal-transmittance wall to cool the chip. A controller transmits a control signal to the sprayer to cause the sprayer to spray at a rate leading to the cooling fluid being vaporized by the semiconductor device without the device either drying or becoming covered by a pool. The cooling system uses cooling fluid surface tension forces to draw liquid cooling fluid up a porous member from the spray chamber back to the sprayers, to be sprayed again. The cooling system uses gravity and/or pressure within the spray chamber to direct vaporized cooling fluid upward from the spray chamber to a condenser. The condenser is configured to cool and condense the vapor. A reservoir is positioned below the condenser and above the sprayers so as to receive condensed vapor from the condenser and feed it to the sprayers.
摘要翻译：一种半导体芯片冷却系统，其具有形成封闭的喷射室的主体，并且具有配置成与芯片相配合的热透射率壁，承载一个或多个芯片的基板或印刷电路板，或另一个这样的加热装置。喷墨式喷雾器被配置成在热透射率壁上喷射冷却流体以冷却芯片。控制器将控制信号发送到喷雾器，以使喷雾器以导致冷却流体被半导体器件蒸发的速率喷射，而不会使设备干燥或变得被池覆盖。冷却系统使用冷却流体表面张力将液体冷却流体从喷雾室向上抽吸到喷雾器上，以再次喷洒。冷却系统使用喷雾室内的重力和/或压力将蒸发的冷却流体从喷雾室向上引导到冷凝器。冷凝器被配置为冷却并冷凝蒸气。储存器位于冷凝器下方和喷雾器上方，以便从冷凝器接收冷凝的蒸汽并将其送入喷雾器。

62. 发明授权

US07057506B2 Cooling fluid provisioning with location aware sensors 有权
标题翻译：冷却液配置与位置感知传感器
公开(公告)号：US07057506B2
公开(公告)日：2006-06-06
申请号：US10758229
申请日：2004-01-16
申请人： Cullen E. Bash , Salil Pradhan , Chandrakant D. Patel
发明人： Cullen E. Bash , Salil Pradhan , Chandrakant D. Patel
IPC分类号： G08B25/00
CPC分类号： H05K7/20836 , F24F11/30 , F24F2120/10 , F24F2120/12 , H05K7/20745 , Y10T137/1939
摘要： A method of controlling cooling fluid provisioning in a room housing a plurality of components. The room includes at least one plenum having one or more cooling system components configured to vary a characteristic of at least one of cooling fluid supply to and removal from the room. In the method, location aware sensors are positioned at various locations in the room and their locations are determined. One or more conditions are detected with the location aware sensors and it is determined whether to manipulate at least one of the one or more cooling system components to modify a characteristic of cooling fluid contained in the plenum based upon the detected one or more conditions. In addition, at least one of the one or more cooling system components is manipulated in response to a determination to that the at least of the one or more cooling system components is to be modified.
摘要翻译：一种在容纳多个部件的房间内控制冷却液供应的方法。该房间包括具有一个或多个冷却系统组件的至少一个增压室，该冷却系统组件被配置成改变至室内的冷却流体供应和从房间移除中的至少一个的特性。在该方法中，位置感知传感器位于房间中的各个位置，并确定其位置。利用位置感知传感器检测一个或多个条件，并且基于检测到的一个或多个条件确定是否操纵一个或多个冷却系统部件中的至少一个以修改容纳在集气室中的冷却流体的特性。另外，响应于要修改至少一个或多个冷却系统组件的确定来操纵一个或多个冷却系统组件中的至少一个。

63. 发明授权

US07024573B2 Method and apparatus for cooling heat generating components 有权
公开(公告)号：US07024573B2
公开(公告)日：2006-04-04
申请号：US10062443
申请日：2002-02-05
申请人： Chandrakant D. Patel , Cullen E. Bash
发明人： Chandrakant D. Patel , Cullen E. Bash
IPC分类号： G06F1/26 , H05K7/20 , F28F9/26
CPC分类号： H05K7/20781 , F25B25/005 , G06F1/20 , G06F1/206 , G06F2200/201 , Y02D10/16
摘要： A device and a system for cooling heat generating electronics is disclosed. In one embodiment, the invention is a system for cooling at least one computer component. The system has a plurality of cold plates which are adapted to transfer heat from a plurality of computer components to a cooling fluid. A supply line supplies the cooling fluid to and from these cold plates. The system also has a housing with one or more racks to support the computer component(s). The racks may also support the cold plates so that the cold plates are in thermal communication with at least one computer component.

64. 发明授权

US06853554B2 Thermal connection layer 有权
标题翻译：热连接层
公开(公告)号：US06853554B2
公开(公告)日：2005-02-08
申请号：US10022112
申请日：2001-12-14
申请人： Cullen E. Bash , Chandrakant D. Patel , Glenn C. Simon
发明人： Cullen E. Bash , Chandrakant D. Patel , Glenn C. Simon
IPC分类号： H05K7/20
CPC分类号： H05K7/20772
摘要： A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.
摘要翻译：一种模块化半导体芯片冷却系统，其具有容易打开的外壳，其限定了配置成容纳承载待冷却部件的印刷电路板的室。外壳可以包括储存器，冷凝器和泵。室内的喷雾器可调节地安装在一个或多个支架上，以允许每个喷雾器为其各自部件的单独高度设定。外壳可以通过快速释放连接容易地从计算机系统中移除。计算机系统可以包括冷凝器和泵来操作其所有的模块化冷却系统，从各个模块中去除冷凝功能。

65. 发明授权

US06817199B2 Cooling system 失效
标题翻译：冷却系统
公开(公告)号：US06817199B2
公开(公告)日：2004-11-16
申请号：US10697691
申请日：2003-10-31
申请人： Chandrakant D. Patel , Cullen E. Bash
发明人： Chandrakant D. Patel , Cullen E. Bash
IPC分类号： F25B100
CPC分类号： H05K7/20745 , F25B5/02 , F25B49/02 , F25B2600/0253 , F25B2600/112 , F25B2600/2515 , F25B2700/2104 , F25B2700/2117 , Y02B30/741 , Y02B30/743
摘要： A system and method for cooling a room configured to house a plurality of computer systems. A heat exchanger unit is configured to receive air from the room and to deliver air to the room. The heat exchanger unit is supplied with cooling fluid operable to cool the received air in the heat exchanger unit. At least one of the temperature of the cooling fluid supplied to the heat exchanger unit and the air delivery to the room may be controlled in response to temperatures sensed at one or more locations in the room.
摘要翻译：一种用于冷却被配置为容纳多个计算机系统的房间的系统和方法。热交换器单元被配置为从房间接收空气并将空气输送到房间。热交换器单元被供应有冷却流体，其可操作以冷却热交换器单元中的接收空气。可以响应于在房间中的一个或多个位置处感测到的温度来控制供应到热交换器单元的冷却流体的温度和送到房间的空气中的至少一个。

66. 发明授权

US06644058B2 Modular sprayjet cooling system 有权
公开(公告)号：US06644058B2
公开(公告)日：2003-11-11
申请号：US09945044
申请日：2001-08-31
申请人： Cullen E. Bash , Abdlmonem H. Beitelmal , Chandrakant D. Patel
发明人： Cullen E. Bash , Abdlmonem H. Beitelmal , Chandrakant D. Patel
IPC分类号： F25D1702
CPC分类号： G06F1/20 , F25D19/00 , G06F2200/201 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.

67. 发明授权

US06813897B1 Supplying power to at least one cooling system component 失效
标题翻译：向至少一个冷却系统部件供电
公开(公告)号：US06813897B1
公开(公告)日：2004-11-09
申请号：US10628284
申请日：2003-07-29
申请人： Cullen E. Bash , Chandrakant D. Patel , Gopalakrishnan Janakiraman , Keith Istvan Farkas
发明人： Cullen E. Bash , Chandrakant D. Patel , Gopalakrishnan Janakiraman , Keith Istvan Farkas
IPC分类号： F25B700
CPC分类号： G06F1/20 , F25B7/00 , F25B27/00 , G06F1/206 , Y10T307/615 , Y10T307/696
摘要： A primary power system and a secondary power system are operable to supply power to at least one cooling system component in a cooling system. The amount of power supplied by the primary power system and the secondary power system to the at least one cooling system component is controlled based on an operating level threshold for the at least one cooling system component.
摘要翻译：主电力系统和次电力系统可操作以向冷却系统中的至少一个冷却系统部件供电。基于用于所述至少一个冷却系统部件的操作级别阈值来控制由所述主电力系统和所述次级电力系统提供给所述至少一个冷却系统组件的功率量。

68. 发明授权

US06672381B2 Multi-load thermal regulating system with multiple serial evaporators 失效
标题翻译：具有多个串联蒸发器的多负载热调节系统
公开(公告)号：US06672381B2
公开(公告)日：2004-01-06
申请号：US09843933
申请日：2001-04-30
申请人： Abdlmonem H. Beitelmal , Cullen E. Bash , Chandrakant D. Patel
发明人： Abdlmonem H. Beitelmal , Cullen E. Bash , Chandrakant D. Patel
IPC分类号： F24F300
CPC分类号： H05K7/20381 , F25B5/04 , F25B49/022 , F25B2400/01 , F25B2600/025 , F25B2600/21 , F25B2700/2117 , H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： A system and method for reducing temperature variation among components in a multi-component system. In this respect, component temperatures are controlled to remain relatively constant (approximately within 5° C.) with respect to other components, while allowing for multiple fluctuating heat loads between components. A refrigeration system possessing a variable capacity (speed) compressor and a thermostatic expansion valve is utilized to control the flow of refrigerant through the refrigeration system. The temperatures of the components are reduced by metering the mass flow rate of the refrigerant cooling the components to compensate for the heat load applied to the refrigeration system. The temperature variation among the components is reduced by supplemental heaters independently providing heat to each respective component. In this regard, any relatively inactive, and therefore relatively cooler, component with respect to other components, may be heated by that component's respective supplemental heater, such that the temperature of the relatively inactive component is not reduced below the specified temperature range.
摘要翻译：一种用于降低多组件系统中部件之间温度变化的系统和方法。在这方面，组件温度被控制为相对于其他部件保持相对恒定（大约在5℃内），同时允许部件之间的多个波动的热负荷。使用具有可变容量（速度）压缩机和恒温膨胀阀的制冷系统来控制通过制冷系统的制冷剂的流动。通过计量冷却部件的制冷剂的质量流量以补偿施加到制冷系统的热负荷来降低部件的温度。组件之间的温度变化由辅助加热器减少，独立地向各个组件提供热量。在这方面，相对于其他部件的任何相对不活泼且因此相对较冷的部件可被该部件相应的补充加热器加热，使得相对不活泼的部件的温度不降低到低于规定的温度范围。

69. 发明授权

US06662865B2 Multi-load thermal regulating system having electronic valve control 有权
标题翻译：具有电子阀门控制功能的多负载热调节系统
公开(公告)号：US06662865B2
公开(公告)日：2003-12-16
申请号：US09843761
申请日：2001-04-30
申请人： Abdlmonem H. Beitelmal , Cullen E. Bash , Chandrakant D. Patel
发明人： Abdlmonem H. Beitelmal , Cullen E. Bash , Chandrakant D. Patel
IPC分类号： F24F300
CPC分类号： H01L23/34 , F25B5/04 , F25B49/022 , F25B2600/025 , F25B2700/2117 , G06F1/206 , H01L2924/0002 , H01L2924/00
摘要： In a thermal regulating system, individual temperatures of a plurality of components are maintained within a predetermined temperature range. This thermal regulating system includes a refrigeration system having a refrigerant contained in a refrigerant line, a valve capable of being electronically controlled, a plurality of evaporators configured for thermal attachment to the components, and a supplemental heating system. The valve is configured to control superheat formation in the refrigeration system. Furthermore, the refrigeration system and the supplemental heating system are operable to maintain each of the plurality of components within the predetermined temperature range.
摘要翻译：在热调节系统中，多个部件的单独温度保持在预定的温度范围内。该热调节系统包括制冷剂系统，其具有包含在制冷剂管线中的制冷剂，能够被电子控制的阀，多个蒸发器构造成用于附着到部件上，以及补充加热系统。该阀构造成控制制冷系统中的过热形成。此外，制冷系统和辅助加热系统可操作以将多个部件中的每一个维持在预定温度范围内。

70. 发明授权

US07361081B2 Small form factor air jet cooling system 有权
标题翻译：小型空气喷射冷却系统
公开(公告)号：US07361081B2
公开(公告)日：2008-04-22
申请号：US10898736
申请日：2004-07-23
申请人： Abdlmonem H. Beitelmal , Chandrakant D. Patel , Cullen E. Bash
发明人： Abdlmonem H. Beitelmal , Chandrakant D. Patel , Cullen E. Bash
IPC分类号： H05K5/02
CPC分类号： H05K7/20727
摘要： An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. A cooling system is formed by a plenum pressurized by a blower. The plenum defines a plurality of configurable orifices in the chassis, each directing pressurized air toward a component. The plenum includes adjustable valves to controllably limit airflow through the orifices, and a controller to control the air pressure within the plenum and the orifice flow rates through the valves.
摘要翻译：外壳形成在纵向尺寸上垂直堆叠的多个层。每个层是1U模块化计算机系统，其具有配置成安装在多层支持中的计算机机箱以及需要在计算机机箱内进行冷却的计算机组件。冷却系统由通过鼓风机加压的增压室形成。气室在底盘中限定了多个可配置的孔，每个将加压空气朝向组件。气室包括可调节的阀门，以可控地限制通过孔口的气流，以及控制器来控制气室内的空气压力和通过阀门的孔口流量。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式