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61. 发明授权

US06870267B2 Off-center solder ball attach assembly 有权
标题翻译：偏心焊球附件
公开(公告)号：US06870267B2
公开(公告)日：2005-03-22
申请号：US10077145
申请日：2002-02-15
申请人： Wael Zohni
发明人： Wael Zohni
IPC分类号： H01L21/48 , H05K3/34 , H01L23/48
CPC分类号： H05K3/3478 , H01L21/4853 , H05K2201/09509 , H05K2201/0959 , H05K2203/041 , H05K2203/043 , H05K2203/0557 , H05K2203/1178
摘要： A connection component includes a dielectric element having a first surface and a second surface, and conductive pads on the first surface of the dielectric element, each conductive pad having a center. The connection component also includes conductive vias electrically connected to the conductive pads and extending toward the second surface of the dielectric element, each of the vias having an opening at one of the conductive pads. At least one of the via openings is offset from the center of at least one of the conductive pads.
摘要翻译：连接部件包括具有第一表面和第二表面的电介质元件，以及介电元件的第一表面上的导电焊盘，每个导电焊盘都具有中心。连接部件还包括电连接到导电焊盘并朝着介电元件的第二表面延伸的导电通孔，每个通孔在导电焊盘之一处具有开口。至少一个通孔开口偏离至少一个导电焊盘的中心。

62. 发明授权

US06380060B1 Off-center solder ball attach and methods therefor 有权
标题翻译：偏心焊球附件及其方法
公开(公告)号：US06380060B1
公开(公告)日：2002-04-30
申请号：US09652537
申请日：2000-08-31
申请人： Wael Zohni
发明人： Wael Zohni
IPC分类号： H01L2144
CPC分类号： H05K3/3478 , H01L21/4853 , H05K2201/09509 , H05K2201/0959 , H05K2203/041 , H05K2203/043 , H05K2203/0557 , H05K2203/1178
摘要： A method of placing solder balls on a connection component includes providing a dielectric element having first conductive elements on a first surface, second conductive elements on a second surface, and conductive vias electrically interconnecting one or more of the first conductive elements and one or more of the second conductive elements. The first conductive elements may include conductive pads overlying the first surface of the dielectric element and the second conductive elements may include conductive leads or traces overlying the second surface of the dielectric element. Each via may have an opening at the first surface of the dielectric element. One or more of the vias may also have a closed end adjacent the second surface of the dielectric element. The via openings preferably extend through the first conductive elements. The method also includes positioning solder balls atop one or more of the first conductive elements, and then reflowing the solder balls for permanently attaching the solder balls to the conductive pads, wherein at least a portion of the via openings are exposed at the commencement of the reflowing step. Before reflowing the solder balls, the solder balls may be secured over the first conductive elements using a flux material. Maintaining at least a portion of each via opening exposed at the commencement of the reflowing step allows any air and/or flux solvent present in the via(s) to escape before the via opening(s) are completely closed by the reflowed solder material.
摘要翻译：将焊球放置在连接部件上的方法包括提供在第一表面上具有第一导电元件的介电元件，在第二表面上的第二导电元件和将一个或多个第一导电元件与一个或多个第一导电元件电连接的导电通孔，第二导电元件。第一导电元件可以包括覆盖在介电元件的第一表面上的导电焊盘，并且第二导电元件可以包括覆盖在电介质元件的第二表面上的导电引线或迹线。每个通孔可以在介电元件的第一表面处具有开口。一个或多个通孔也可以具有邻近电介质元件的第二表面的封闭端。通孔开口优选地延伸穿过第一导电元件。该方法还包括将焊球定位在一个或多个第一导电元件的顶部，然后回流焊球以将焊球永久地附接到导电焊盘，其中至少一部分通孔开口在开始时暴露回流步骤在回流焊球之前，可以使用焊剂材料将焊球固定在第一导电元件上。保持在回流步骤开始时暴露的每个通孔的至少一部分允许存在于通孔中的任何空气和/或助焊剂溶剂在通孔开口被回流的焊料材料完全闭合之前逸出。

63. 发明授权

US09123713B2 Lead structures with vertical offsets 有权
标题翻译：带垂直偏移的铅结构
公开(公告)号：US09123713B2
公开(公告)日：2015-09-01
申请号：US13989314
申请日：2011-11-21
申请人： Richard Dewitt Crisp , Belgacem Haba , Wael Zohni
发明人： Richard Dewitt Crisp , Belgacem Haba , Wael Zohni
IPC分类号： H01L23/495 , H01L23/13 , H01L23/00
CPC分类号： H01L23/49575 , H01L23/13 , H01L24/06 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/06136 , H01L2224/45015 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/4824 , H01L2224/48465 , H01L2224/49052 , H01L2224/49111 , H01L2224/49175 , H01L2224/49176 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/1432 , H01L2924/1433 , H01L2924/1434 , H01L2924/20751 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2224/48227 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A microelectronic structure includes a first row of contacts (14) and a second row of contacts (24) offset from the first row, so that the first and second rows cooperatively define pairs of contacts. These pairs of contacts include first pairs (30a) and second pairs (30b) arranged in alternating sequence in the row direction. The first pairs are provided with low connectors (32a), whereas the second pairs are provided with high connectors (32b). The high connectors and low connectors have sections vertically offset from one another to reduce mutual impedance between adjacent connectors.
摘要翻译：微电子结构包括第一排触点（14）和从第一行偏移的第二行触点（24），使得第一和第二行协作地限定成对的触点。这些触点对包括沿行方向交替排列的第一对（30a）和第二对（30b）。第一对设置有低连接器（32a），而第二对具有高连接器（32b）。高连接器和低连接器具有彼此垂直偏移的部分，以减少相邻连接器之间的相互阻抗。

64. 发明授权

US08928153B2 Flip-chip, face-up and face-down centerbond memory wirebond assemblies 有权
标题翻译：倒装芯片，面朝上和面朝下的中心键盘内存引线键盘组件
公开(公告)号：US08928153B2
公开(公告)日：2015-01-06
申请号：US13306099
申请日：2011-11-29
申请人： Belgacem Haba , Richard Dewitt Crisp , Wael Zohni
发明人： Belgacem Haba , Richard Dewitt Crisp , Wael Zohni
IPC分类号： H01L23/48 , H01L25/16 , H01L25/065 , H01L23/31 , H01L25/10 , H01L23/00 , H01L25/18
CPC分类号： H01L23/50 , H01L23/13 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/18 , H01L2224/0401 , H01L2224/04042 , H01L2224/05599 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06135 , H01L2224/06136 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/29101 , H01L2224/29191 , H01L2224/32145 , H01L2224/32225 , H01L2224/32227 , H01L2224/32245 , H01L2224/45099 , H01L2224/48095 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/4826 , H01L2224/48472 , H01L2224/4911 , H01L2224/49112 , H01L2224/49175 , H01L2224/73203 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06562 , H01L2225/06575 , H01L2225/06589 , H01L2225/1023 , H01L2225/1029 , H01L2225/1047 , H01L2225/1052 , H01L2225/1058 , H01L2225/107 , H01L2924/0001 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/1431 , H01L2924/1433 , H01L2924/1435 , H01L2924/1436 , H01L2924/1437 , H01L2924/1438 , H01L2924/1443 , H01L2924/14511 , H01L2924/15151 , H01L2924/15165 , H01L2924/1517 , H01L2924/15172 , H01L2924/15182 , H01L2924/15311 , H01L2924/15331 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/181 , H01L2924/19107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012
摘要： A microelectronic assembly can include a substrate having first and second surfaces and an aperture extending therebetween, the substrate having terminals. The assembly can also include a first microelectronic element having a front surface facing the first surface of the substrate, a second microelectronic element having a front surface facing the first microelectronic element and projecting beyond an edge of the first microelectronic element, first and second leads electrically connecting contacts of the respective first and second microelectronic elements to the terminals, and third leads electrically interconnecting the contacts of the first and second microelectronic elements. The contacts of the first microelectronic element can be exposed at the front surface thereof adjacent the edge thereof. The contacts of the second microelectronic element can be disposed in a central region of the front surface thereof. The first, second, and third leads can have portions aligned with the aperture.
摘要翻译：微电子组件可以包括具有第一和第二表面的基板和在其间延伸的孔，该基板具有端子。组件还可以包括具有面向衬底的第一表面的前表面的第一微电子元件，具有面向第一微电子元件并且突出超过第一微电子元件的边缘的前表面的第二微电子元件，第一和第二引线电将相应的第一和第二微电子元件的触点连接到端子，以及第三引线将第一和第二微电子元件的触点电互连。第一微电子元件的触点可以在靠近其边缘的前表面暴露。第二微电子元件的触点可以设置在其前表面的中心区域中。第一，第二和第三引线可以具有与孔对准的部分。

65. 发明授权

US08872318B2 Through interposer wire bond using low CTE interposer with coarse slot apertures 有权
标题翻译：通过使用具有粗缝隙的低CTE插入器的插入器引线接合
公开(公告)号：US08872318B2
公开(公告)日：2014-10-28
申请号：US13216465
申请日：2011-08-24
申请人： Simon McElrea , Wael Zohni , Belgacem Haba
发明人： Simon McElrea , Wael Zohni , Belgacem Haba
IPC分类号： H01L23/48 , H01L29/40 , H01L23/498 , H01L21/48 , H01L25/065 , H01L23/13 , H01L23/00
CPC分类号： H01L24/73 , H01L21/486 , H01L23/13 , H01L23/49811 , H01L23/49827 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06558 , H01L2225/06562 , H01L2225/06565 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/81 , H01L2224/83 , H01L2224/85 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a subassembly, a second substrate, and a monolithic encapsulant. The subassembly includes a first substrate that has at least one aperture, a coefficient of thermal expansion (CTE) of eight parts per million per degree Celsius or less, and first and second contacts arranged so as to have a pitch of 200 microns or less. First and second microelectronic elements are respectively electrically connected to the first and second contacts. Wire bonds may be used to connect the second element contacts with the second contacts. A second substrate may underlie either the first or the second microelectronic elements and be electrically interconnected with the first substrate. The second substrate may have terminals configured for electrical connection to a component external to the microelectronic package. A monolithic encapsulant may contact the first and second microelectronic elements and the first and second substrates.
摘要翻译：微电子封装包括子组件，第二衬底和整体式密封剂。子组件包括具有至少一个孔的第一衬底，每摄氏度或更低的百万分之八的热膨胀系数（CTE）以及布置成具有200微米或更小的间距的第一和第二接触。第一和第二微电子元件分别电连接到第一和第二触点。引线键可用于将第二元件触点与第二触点连接。第二衬底可以位于第一或第二微电子元件之下，并且与第一衬底电互连。第二基板可以具有被配置为电连接到微电子封装外部的部件的端子。单片密封剂可以接触第一和第二微电子元件以及第一和第二基板。

66. 发明授权

US08786083B2 Impedance controlled packages with metal sheet or 2-layer RDL 失效
标题翻译：具有金属片或2层RDL的阻抗控制封装
公开(公告)号：US08786083B2
公开(公告)日：2014-07-22
申请号：US12883821
申请日：2010-09-16
申请人： Belgacem Haba , Ellis Chau , Wael Zohni , Philip Damberg , Richard Dewitt Crisp
发明人： Belgacem Haba , Ellis Chau , Wael Zohni , Philip Damberg , Richard Dewitt Crisp
IPC分类号： H01L23/52
CPC分类号： H01L23/64 , H01L23/3128 , H01L23/49816 , H01L23/552 , H01L24/06 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2224/02311 , H01L2224/02313 , H01L2224/02375 , H01L2224/02379 , H01L2224/04042 , H01L2224/05554 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2225/0651 , H01L2225/06537 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/10161 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/43
摘要： A microelectronic assembly is disclosed that is capable of achieving a desired impedance for raised conductive elements. The microelectronic assembly may include an interconnection element, a surface conductive element, a microelectronic device, a plurality of raised conductive elements, and a bond element. The microelectronic device may overlie the dielectric element and at least one surface conductive element attached to the front surface. The plurality of raised conductive elements may connect the device contacts with the element contacts. The raised conductive elements may have substantial portions spaced a first height above and extending at least generally parallel to at least one surface conductive element, such that a desired impedance may be achieved for the raised conductive elements. A bond element may electrically connect at least one surface conductive element with at least one reference contact that may be connectable to a source of reference potential.
摘要翻译：公开了能够实现用于凸起的导电元件的期望阻抗的微电子组件。微电子组件可以包括互连元件，表面导电元件，微电子器件，多个凸起的导电元件和接合元件。微电子器件可以覆盖在电介质元件和附接到前表面的至少一个表面导电元件。多个凸起的导电元件可以将元件触点与元件触点连接。升高的导电元件可以具有在第一高度之上并且至少大致平行于至少一个表面导电元件延伸的基本部分，使得可以为凸起的导电元件实现期望的阻抗。键合元件可以将至少一个表面导电元件与可连接到参考电位源的至少一个参考触点电连接。

67. 发明授权

US08659143B2 Stub minimization for wirebond assemblies without windows 有权
标题翻译：没有窗口的接线组件的短截线最小化
公开(公告)号：US08659143B2
公开(公告)日：2014-02-25
申请号：US13440299
申请日：2012-04-05
申请人： Richard Dewitt Crisp , Wael Zohni , Belgacem Haba , Frank Lambrecht
发明人： Richard Dewitt Crisp , Wael Zohni , Belgacem Haba , Frank Lambrecht
IPC分类号： H01L23/52 , H01L23/02 , H01L23/48 , H01L29/40 , H01L23/04 , H05K7/00 , H05K1/18 , H01L21/82
CPC分类号： H01L25/0657 , G06F1/18 , H01L21/563 , H01L23/3128 , H01L23/36 , H01L23/3672 , H01L23/481 , H01L23/49816 , H01L23/49838 , H01L23/50 , H01L23/525 , H01L23/5385 , H01L24/24 , H01L24/73 , H01L25/0655 , H01L25/105 , H01L2224/16145 , H01L2224/16225 , H01L2224/24145 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06551 , H01L2225/06562 , H01L2225/06589 , H01L2924/00 , H01L2924/00012 , H01L2924/01322 , H01L2924/15311 , H01L2924/18161 , H01L2924/3011 , H05K1/0243 , H05K1/181 , H05K2201/10159 , H05K2201/10545 , H05K2201/10734 , Y02P70/611
摘要： A microelectronic package can include a substrate and a microelectronic element having a rear face facing a first surface of the substrate, a front face, and a column of element contacts extending in a first direction. The microelectronic element can include stacked electrically interconnected semiconductor chips. Edges of the microelectronic element can define an axial plane extending in the first direction and a third direction normal to the rear face. The package can include columns of terminals extending in the first direction at a second surface of the substrate. The terminals can include first terminals exposed in a central region of the second surface and configured to carry address information usable by circuitry within the package to determine an addressable memory location. The central region may have a width not more than 3.5 times a minimum pitch between adjacent terminal columns. The axial plane can intersect the central region.
摘要翻译：微电子封装可以包括衬底和微电子元件，微电子元件具有面向衬底的第一表面的后表面，正面和沿第一方向延伸的元件触点列。微电子元件可以包括堆叠的电互连半导体芯片。微电子元件的边缘可以限定在垂直于后表面的第一方向和第三方向上延伸的轴向平面。封装可以包括在基板的第二表面处沿第一方向延伸的端子列。终端可以包括暴露在第二表面的中心区域中的第一终端，并且被配置为携带可用于封装内的电路的地址信息，以确定可寻址的存储器位置。中心区域可以具有不超过相邻端柱之间最小间距的3.5倍的宽度。轴向平面可以与中心区域相交。

68. 发明授权

US08659141B2 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows 有权
标题翻译：使用不带窗口的接线组件的重复端子组的短截线最小化
公开(公告)号：US08659141B2
公开(公告)日：2014-02-25
申请号：US13440280
申请日：2012-04-05
申请人： Richard Dewitt Crisp , Wael Zohni , Belgacem Haba , Frank Lambrecht
发明人： Richard Dewitt Crisp , Wael Zohni , Belgacem Haba , Frank Lambrecht
IPC分类号： H01L23/52 , H01L23/02 , H01L23/48 , H01L29/40 , H01L23/04 , H05K7/00 , H05K1/18 , H01L21/82
CPC分类号： H01L25/0657 , G11C5/04 , G11C5/063 , G11C5/066 , G11C8/18 , H01L23/02 , H01L23/13 , H01L23/48 , H01L23/49838 , H01L23/50 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/0655 , H01L2224/16145 , H01L2224/16225 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/49113 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06548 , H01L2225/06562 , H01L2225/06572 , H01L2225/06589 , H01L2225/107 , H01L2924/00014 , H01L2924/01322 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/3011 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/85
摘要： A microelectronic assembly can include a microelectronic package connected with a circuit panel. The package has a microelectronic element having a front face facing away from a substrate of the package, and electrically connected with the substrate through conductive structure extending above the front face. First terminals provided in first and second parallel grids or in first and second individual columns can be configured to carry address information usable to determine an addressable memory location from among all the available addressable memory locations of the memory storage array. The first terminals in the first grid can have signal assignments which are a mirror image of the signal assignments of the first terminals in the second grid.
摘要翻译：微电子组件可以包括与电路板连接的微电子封装。封装具有微电子元件，其具有背向封装的衬底的前表面，并且通过在前表面上方延伸的导电结构与衬底电连接。提供在第一和第二并联栅格中或第一和第二单独列中的第一端子可被配置为承载可用于从存储器存储阵列的所有可寻址的存储器位置中确定可寻址存储器位置的地址信息。第一网格中的第一终端可以具有作为第二网格中的第一终端的信号分配的镜像的信号分配。

69. 发明授权

US08633576B2 Stacked chip-on-board module with edge connector 有权
标题翻译：带有边缘连接器的堆叠芯片 - 板载模块
公开(公告)号：US08633576B2
公开(公告)日：2014-01-21
申请号：US13306203
申请日：2011-11-29
申请人： Wael Zohni , Belgacem Haba
发明人： Wael Zohni , Belgacem Haba
IPC分类号： H01L23/02 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/49575 , G11C5/04 , G11C5/06 , H01L23/13 , H01L23/4951 , H01L23/49541 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/06135 , H01L2224/06136 , H01L2224/06156 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45099 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/4826 , H01L2224/73203 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06562 , H01L2225/06565 , H01L2225/1023 , H01L2924/00012 , H01L2924/00014 , H01L2924/01029 , H01L2924/01087 , H01L2924/01322 , H01L2924/07811 , H01L2924/1434 , H01L2924/181 , H01L2924/207 , H01L2924/3011 , H01L2924/00 , H01L2924/014
摘要： A module can include a module card and first and second microelectronic elements having front surfaces facing a first surface of the module card. The module card can also have a second surface and a plurality of parallel exposed edge contacts adjacent an edge of at least one of the first and second surfaces for mating with corresponding contacts of a socket when the module is inserted in the socket. Each microelectronic element can be electrically connected to the module card. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto.
摘要翻译：模块可以包括模块卡和具有面向模块卡的第一表面的前表面的第一和第二微电子元件。模块卡还可以具有邻近第一和第二表面中的至少一个表面的边缘的第二表面和多个平行的暴露的边缘接触件，用于当模块插入插座时与插座的相应接触件配合。每个微电子元件可以电连接到模块卡。第二微电子元件的前表面可以部分地覆盖在第一微电子元件的后表面上并且可以附接到第一微电子元件的后表面。

70. 发明授权

US08629545B2 Stub minimization for assemblies without wirebonds to package substrate 有权
标题翻译：用于没有引线封装衬底的组件的短截线最小化
公开(公告)号：US08629545B2
公开(公告)日：2014-01-14
申请号：US13439354
申请日：2012-04-04
申请人： Richard Dewitt Crisp , Wael Zohni , Belgacem Haba , Frank Lambrecht
发明人： Richard Dewitt Crisp , Wael Zohni , Belgacem Haba , Frank Lambrecht
IPC分类号： H01L23/02
CPC分类号： H01L23/49838 , G11C5/04 , G11C5/063 , H01L23/13 , H01L23/3114 , H01L23/3171 , H01L23/48 , H01L23/4824 , H01L23/498 , H01L23/49811 , H01L23/49827 , H01L23/50 , H01L23/52 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L27/108 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05554 , H01L2224/05569 , H01L2224/0557 , H01L2224/06156 , H01L2224/06164 , H01L2224/12105 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/24145 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2224/81191 , H01L2224/81193 , H01L2224/81447 , H01L2224/81805 , H01L2224/9202 , H01L2225/06506 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06551 , H01L2225/06562 , H01L2225/06565 , H01L2225/06589 , H01L2225/1023 , H01L2225/1064 , H01L2225/107 , H01L2924/00014 , H01L2924/01029 , H01L2924/01322 , H01L2924/1434 , H01L2924/1436 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/3011 , H01L2924/014 , H01L2924/00012 , H01L2924/00 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A system or microelectronic assembly can include one or more microelectronic packages each having a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and centered relative to the columns of element contacts. Columns of package terminals can extend in the first direction. First terminals in a central region of the second surface can be configured to carry address information usable to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between the columns of package terminals. The axial plane can intersect the central region.
摘要翻译：系统或微电子组件可以包括一个或多个微电子封装，每个微电子封装均具有衬底和微电子元件，微电子元件具有面和在其上的一个或多个触点列，其面对并连接到衬底的表面上的对应触点。轴向平面可以沿着第一方向的线与面相交，并且相对于元件触点的列居中。封装端子的列可以沿第一方向延伸。可以将第二表面的中心区域中的第一端子配置为携带可用于确定微电子元件内的可寻址存储器位置的地址信息。中心区域可以具有不大于封装端子列之间的最小间距的三倍和五倍的宽度。轴向平面可以与中心区域相交。

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