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61. 发明申请

US20080207045A1 Connector, metal housing and manufacturing method thereof 审中-公开
标题翻译：连接器，金属外壳及其制造方法
公开(公告)号：US20080207045A1
公开(公告)日：2008-08-28
申请号：US11987231
申请日：2007-11-28
申请人： Yu-Yuan Tai , Zhao-Wei Guan
发明人： Yu-Yuan Tai , Zhao-Wei Guan
IPC分类号： H01R13/73 , H05K7/10 , H01R43/00
CPC分类号： H01R13/6594 , H01R24/64 , Y10T29/5193
摘要： A connector, a metal housing and a manufacturing method thereof are disclosed. The connector includes a base and a metal housing. The metal housing covers the base and includes a body and at least one ground pin. The ground pin is integrally formed with the body as a single piece and is stamped without a waste material produced. The method for manufacturing the metal housing includes steps of: providing a body; processing the body at a predetermined distance from a fringe of the body to cut out at least one strip; and bending the strip to form a ground pin protruding out of the fringe of the body.
摘要翻译：公开了连接器，金属外壳及其制造方法。连接器包括基座和金属外壳。金属壳体覆盖基座并且包括主体和至少一个接地引脚。接地销与主体整体形成为一体，并且没有产生废料的冲压。制造金属外壳的方法包括以下步骤：提供主体; 在身体的边缘预定距离处处理身体以切割出至少一个条带; 并弯曲条带以形成突出到身体边缘的接地销。

62. 发明申请

US20080139048A1 Connector and housing thereof 审中-公开
标题翻译：连接器及其外壳
公开(公告)号：US20080139048A1
公开(公告)日：2008-06-12
申请号：US11905286
申请日：2007-09-28
申请人： Yu-Yuan Tai , Zhao-Wei Guan , Yun Zuo
发明人： Yu-Yuan Tai , Zhao-Wei Guan , Yun Zuo
IPC分类号： H01R13/648
CPC分类号： H01R13/6658 , H01R13/6582 , H01R24/62 , H01R27/02
摘要： A connector includes a circuit board and a housing. The housing has a body and a ground element, wherein the ground element is connected with the body and is disposed with respect to the circuit board. The ground element is in electrical contact with a ground end of the circuit board by clipping or hooking. The ground element and the body are integrally formed as a single piece, and the ground element is elastically deformable.
摘要翻译：连接器包括电路板和外壳。壳体具有主体和接地元件，其中接地元件与主体连接并且相对于电路板设置。接地元件通过夹紧或钩接与电路板的接地端电接触。接地元件和主体一体地形成为单件，并且接地元件可弹性变形。

63. 发明申请

US20050219973A1 METHOD FOR CHOOSING THE DEFECT DETECTION MODE OF AN OPTICAL STORAGE DEVICE 有权
标题翻译：用于选择光存储器件的缺陷检测模式的方法
公开(公告)号：US20050219973A1
公开(公告)日：2005-10-06
申请号：US10904886
申请日：2004-12-02
申请人： Kuo-Wen Jin , Shou-Ren Tsai , Wei-Guan Yau
发明人： Kuo-Wen Jin , Shou-Ren Tsai , Wei-Guan Yau
IPC分类号： G11B5/09 , G11B7/0045 , G11B20/18
CPC分类号： G11B7/00458 , G11B20/18
摘要： At least one detection area on an optical storage medium is allocated for data storage first, and then the detection area is set to a defect detection mode of either write detection or write verification, depending on the number of defects stated in a previous defect record. If the detection area is the write detection mode and the number of accumulated defects exceeds a default threshold value, the detection area would be configured anew and thereby set to a defect detection mode of write verification.
摘要翻译：首先分配光存储介质上的至少一个检测区域用于数据存储，然后根据先前缺陷记录中所述的缺陷数量，将检测区域设置为写入检测或写入验证的缺陷检测模式。如果检测区域是写入检测模式，并且累积缺陷的数量超过默认阈值，则将重新配置检测区域，从而设置为写入验证的缺陷检测模式。

64. 发明授权

US09805956B2 Lead frame and a method of fabrication thereof 有权
公开(公告)号：US09805956B2
公开(公告)日：2017-10-31
申请号：US13747774
申请日：2013-01-23
申请人： Dawei Xing , Jie Liu , Hong Wei Guan , Yue Gen Yu , Seow Kiang Khoo
发明人： Dawei Xing , Jie Liu , Hong Wei Guan , Yue Gen Yu , Seow Kiang Khoo
IPC分类号： H01L21/48 , H01L21/56 , H01L23/31 , H01L23/495 , H01L23/498 , H05K1/02
CPC分类号： H01L21/4828 , H01L21/561 , H01L23/3121 , H01L23/49558 , H01L23/49582 , H01L23/49861 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H05K1/02 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a method of manufacturing a lead frame, which comprises the steps of: providing an electrically-conductive base material having first and second planar sides; forming a plurality of conductive contact points on the first planar side of the base material; providing a non-conductive filling material over the first planar side of the base material so that the filling material fills spaces in-between the plurality of contact points to a form a layer comprising the filling material and the plurality of contact points; and etching the second planar side of the base material to expose a pattern of the filling material from the second planar side of the base material and to thereby form a plurality of isolated conductive regions on the second planar side of the base material, each isolated conductive region being connected with at least a respective one of the plurality of contact points on the first planar side of the base material. A lead frame structure is also disclosed.

65. 发明申请

US20170280890A1 HOOK-ON CHAIR 有权
公开(公告)号：US20170280890A1
公开(公告)日：2017-10-05
申请号：US15470354
申请日：2017-03-27
申请人： WEI GUAN HARDWARE (SHENZHEN) CO., LTD.
发明人： Chuan Kai HSU
IPC分类号： A47D1/10
CPC分类号： A47D1/106
摘要： A children's dining chair, such as for example a hook-on children's dining chair for hooking onto or otherwise attaching to a table or other support, with an improved structure and better performance. In example embodiments, the present invention further provides a hook-on chair with an enhanced clamping force.

66. 发明授权

US09202712B2 Lead frame and a method of manufacturing thereof 有权
标题翻译：引线框及其制造方法
公开(公告)号：US09202712B2
公开(公告)日：2015-12-01
申请号：US14158321
申请日：2014-01-17
申请人： Dawei Xing , Jie Liu , Hong Wei Guan , Yue Gen Yu , Seow Kiang Khoo
发明人： Dawei Xing , Jie Liu , Hong Wei Guan , Yue Gen Yu , Seow Kiang Khoo
IPC分类号： H01L21/00 , H01L21/48 , H01L23/495 , H01L23/498 , H01L23/00 , H01L23/31 , H01L21/56
CPC分类号： H01L21/4828 , H01L21/561 , H01L23/3121 , H01L23/49548 , H01L23/49582 , H01L23/49861 , H01L24/97 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2224/85 , H01L2224/83 , H01L2924/00012
摘要： A method of manufacturing a lead frame, comprising the steps of: providing an electrically-conductive base material having first and second planar sides; forming a patterned conductive layer on the first planar side of the base material; etching the second planar side of the base material at portions with respect to exposed portions on the first planar side of the base material comprising the patterned conductive layer, to form partially-etched portions on the second planar side of the base material; providing a non-conductive filling material over the second planar side of the base material, wherein the filling material fills spaces inside the partially-etched portions on the second planar side of the base material to form adjacent portions of the filling material and a plurality of conductive portions on the second planar side of the base material; and etching the exposed portions of the first planar side of the base material comprising the patterned conductive layer to form partially-etched portions on the first planar side of the base material that combine with the partially-etched portions on the second planar side of the base material to thereby form a plurality of separate conductive regions on the first planar side of the base material, each conductive region being electrically conductive with at least a respective one of the plurality of conductive portions on the second planar side of the base material.
摘要翻译：一种制造引线框架的方法，包括以下步骤：提供具有第一和第二平面侧面的导电基材; 在基材的第一平面侧上形成图案化的导电层; 在相对于包括图案化导电层的基材的第一平面侧上的暴露部分的部分处蚀刻基材的第二平面侧，以在基材的第二平面侧上形成部分蚀刻部分; 在所述基材的所述第二平面侧上设置不导电的填充材料，其中所述填充材料填充所述基材的所述第二平面侧上的部分蚀刻部分内的空间，以形成所述填充材料的相邻部分，在基材的第二平面侧的导电部分; 并且蚀刻包括图案化导电层的基材的第一平面侧的暴露部分，以在基材的第一平面侧上形成部分蚀刻部分，其与基底的第二平面侧上的部分蚀刻部分组合从而在基材的第一平面侧上形成多个单独的导电区域，每个导电区域与基材的第二平面侧上的多个导电部分中的至少一个导电部分导电。

67. 发明申请

US20140202736A1 LEAD FRAME AND A METHOD OF FABRICATION THEREOF 有权
标题翻译：引线框架及其制造方法
公开(公告)号：US20140202736A1
公开(公告)日：2014-07-24
申请号：US13747774
申请日：2013-01-23
申请人： Dawei XING , Jie LIU , Hong Wei GUAN , Yue Gen YU , Seow Kiang KHOO
发明人： Dawei XING , Jie LIU , Hong Wei GUAN , Yue Gen YU , Seow Kiang KHOO
IPC分类号： H01L21/48 , H01L23/495 , H05K1/02
CPC分类号： H01L21/4828 , H01L21/561 , H01L23/3121 , H01L23/49558 , H01L23/49582 , H01L23/49861 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H05K1/02 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a method of manufacturing a lead frame, which comprises the steps of: providing an electrically-conductive base material having first and second planar sides; forming a plurality of conductive contact points on the first planar side of the base material; providing a non-conductive filling material over the first planar side of the base material so that the filling material fills spaces in-between the plurality of contact points to a form a layer comprising the filling material and the plurality of contact points; and etching the second planar side of the base material to expose a pattern of the filling material from the second planar side of the base material and to thereby form a plurality of isolated conductive regions on the second planar side of the base material, each isolated conductive region being connected with at least a respective one of the plurality of contact points on the first planar side of the base material. A lead frame structure is also disclosed.
摘要翻译：公开了一种制造引线框架的方法，其包括以下步骤：提供具有第一和第二平面侧面的导电基材; 在所述基材的所述第一平面侧上形成多个导电接触点; 在所述基材的所述第一平面侧上提供非导电填充材料，使得所述填充材料填充所述多个接触点之间的空间，以形成包括所述填充材料和所述多个接触点的层; 并且蚀刻基材的第二平面侧以从基材的第二平面侧露出填充材料的图案，从而在基材的第二平面侧上形成多个隔离导电区域，每个隔离导电区域与所述基材的所述第一平面侧上的所述多个接触点中的至少相应的一个连接。还公开了一种引线框架结构。

68. 发明授权

US08510358B2 Partially random permutation sequence generator 有权
标题翻译：部分随机置换序列发生器
公开(公告)号：US08510358B2
公开(公告)日：2013-08-13
申请号：US12345529
申请日：2008-12-29
申请人： Rongzhen Yang , Huaning Niu , Wei Guan , Hujun Yin
发明人： Rongzhen Yang , Huaning Niu , Wei Guan , Hujun Yin
IPC分类号： G06F7/58
CPC分类号： G06F7/76
摘要： Embodiments of the present disclosure provide methods, systems, and apparatuses related to a partially random permutation sequence generator. In embodiments, a partially random permutation may provide a large distance between neighboring elements while keeping a degree of randomness in the distribution. In some embodiments, it may be applied to distribute resource units across subchannels to provide frequency diversity and/or diversity gain in OFDMA-based wireless broadband technologies. Other embodiments may be described and claimed.
摘要翻译：本公开的实施例提供了与部分随机置换序列发生器有关的方法，系统和装置。在实施例中，部分随机排列可以在相邻元素之间提供大的距离，同时保持分布中的随机程度。在一些实施例中，其可以应用于在子信道上分配资源单元以在基于OFDMA的无线宽带技术中提供频率分集和/或分集增益。可以描述和要求保护其他实施例。

69. 发明授权

US08433359B2 Uplink power control scheme 有权
公开(公告)号：US08433359B2
公开(公告)日：2013-04-30
申请号：US12630673
申请日：2009-12-03
申请人： Rongzhen Yang , Wei Guan , Hujun Yin
发明人： Rongzhen Yang , Wei Guan , Hujun Yin
IPC分类号： H04B7/00
CPC分类号： H04W52/04 , H04W52/146 , H04W52/223 , H04W52/241 , H04W52/242 , H04W52/243 , H04W52/244 , H04W52/267
摘要： An uplink power control technique may include a simplified maximum sector throughput (SMST) and a generalized maximum sector throughput (GMST). The SMST and GMST techniques may be used to determine a maximum sector throughput and cell-edge throughput to enhance the overall efficiency of the communication system. The uplink power control technique may determine the optimal uplink power value without collecting interference over thermal noise and without computing the individual channel losses in each neighboring sector.

70. 发明授权

US08392895B2 Firmware extension method and firmware builder 有权
标题翻译：固件扩展方法和固件构建器
公开(公告)号：US08392895B2
公开(公告)日：2013-03-05
申请号：US12352692
申请日：2009-01-13
申请人： Chien-Liang Tsai , Wei-Guan Yau , Chung-Yen Tsai
发明人： Chien-Liang Tsai , Wei-Guan Yau , Chung-Yen Tsai
IPC分类号： G06F9/45 , G06F9/44
CPC分类号： G06F8/41 , G06F8/54 , G06F9/30138 , G06F9/4486
摘要： A firmware extension method is provided, particularly adaptable for an embedded system. Firstly, a baseline firmware image is provided with a header file. Secondly, an extension firmware image is generated based on the header file, comprising one or more extended functions. Thereafter, a callback table is generated, comprising pointers pointing to entries of the extended functions in the extension firmware image. The baseline firmware image, the extension firmware image and the callback table are then merged to generate a merged firmware image.
摘要翻译：提供固件扩展方法，特别适用于嵌入式系统。首先，提供一个头文件的基线固件映像。其次，基于包括一个或多个扩展功能的头文件来生成扩展固件图像。此后，生成回调表，其包括指向扩展固件图像中的扩展功能的条目的指针。然后合并基线固件映像，扩展固件映像和回调表以生成合并的固件映像。

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