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61. 发明授权

US10468181B1 Self-aligned planar magnetic structure and method 有权
公开(公告)号：US10468181B1
公开(公告)日：2019-11-05
申请号：US14822561
申请日：2015-08-10
申请人： VLT, INC.
发明人： Patrizio Vinciarelli
IPC分类号： H01F41/02 , H05K3/46 , H05K3/44
摘要： Electrical/magnetic components and methods of making such components are provided. One method includes providing a multilayer printed circuit board (PCB) including conductive features arranged on conductive layers of the PCB to form one or more windings around one or more predetermined axes. The method further includes forming a hole in the PCB at each of the one or more predetermined axes to accommodate one or more core legs. For each hole, an inner edge of one of the windings overlaps an edge of the hole in a lateral direction after the hole is formed. The method further includes assembling a magnetically permeable core including the one or more core legs, each core leg extending into one of the holes at the one or more predetermined axes.

62. 发明授权

US10398040B1 Power adapter packaging 有权
公开(公告)号：US10398040B1
公开(公告)日：2019-08-27
申请号：US15972092
申请日：2018-05-04
申请人： VLT, Inc.
发明人： Patrizio Vinciarelli
IPC分类号： H05K5/00 , H05K7/14 , H05K5/04 , H05K1/14
摘要： A power adapter package comprises a power conversion module, an input board assembly comprising terminals for receiving power from an input source and delivering power to the input of the power conversion module, an output board assembly for receiving power from the output of the power conversion module and delivering power to a load via output terminations, a signal isolator comprising a bridge board spanning a distance between the input board and the output board, a case comprising top and bottom covers, and end cap assemblies for supporting and insulating input and output terminations. The bridge board may comprise a multilayer substrate comprising galvanically isolated and magnetically coupled transformer windings. The input and output boards may be soldered to contacts formed along a peripheral edge of the power conversion module.

63. 发明授权

US10284106B1 Power adapter 有权
公开(公告)号：US10284106B1
公开(公告)日：2019-05-07
申请号：US15174083
申请日：2016-06-06
申请人： VLT, Inc.
发明人： Patrizio Vinciarelli , Andrew T. D'Amico
IPC分类号： H05K5/00 , H02M7/04 , H02M7/00 , H05K5/02 , H05K7/20 , H01R31/06
摘要： An efficient, high density, inline converter module includes a power conversion circuit and an input wiring harness for connecting the input of the power circuit to a unipolar source. A second wiring harness or electrical connectors may be provided for connecting the output of the power conversion circuit to a load. Connections between a wiring harness and the power conversion circuit may comprise conductive contacts, configured to distribute heat. The power circuit may be over molded to provide electrical insulation and efficient heat transfer to external ambient air. A DC transformer based inline converter module may be used in AC adapter, vehicular, and power system architectures. An input connector for connecting the input wiring harness to the input source may be provided. In some embodiments the input source may be an AC source and the input connector may comprise a rectifier for delivering a rectified, unipolar, voltage to the input of the power conversion assembly via an input wiring harness. By separating the rectifier from the power conversion assembly, the power conversion assembly may be packaged into a smaller volume than would be required if the rectifier, and its associated heat loss, were included in the power conversion assembly.

64. 外观设计

USD813159S1 Power converter 有权
公开(公告)号：USD813159S1
公开(公告)日：2018-03-20
申请号：US29543442
申请日：2015-10-23
申请人： VLT, INC.
设计人： Patrizio Vinciarelli , Michael B. LaFleur

65. 外观设计

USD798249S1 Electric terminal 有权
公开(公告)号：USD798249S1
公开(公告)日：2017-09-26
申请号：US29556621
申请日：2016-03-02
申请人： VLT, Inc.
设计人： Patrizio Vinciarelli , Michael B. LaFleur

66. 发明授权

US09660537B1 Fault tolerant power converter 有权
公开(公告)号：US09660537B1
公开(公告)日：2017-05-23
申请号：US14682187
申请日：2015-04-09
申请人： VLT, Inc.
发明人： Patrizio Vinciarelli
IPC分类号： H02M7/219 , H02M3/335 , H02M7/00
CPC分类号： H02M7/219 , G06F1/263 , G06F1/3287 , H01L2924/181 , H02M1/32 , H02M1/38 , H02M3/33507 , H02M3/33576 , H02M7/003 , H02M2001/0032 , H02M2001/325 , H03K17/063 , H03K17/302 , H03K17/6871 , Y02B70/1433 , Y02B70/16
摘要： A power converter provides a low-voltage output using a full-bridge fault-tolerant rectification circuit. The output circuit uses controlled switches as rectifiers. A fault detection circuit monitors circuit conditions. Upon detection of a fault, the switches are disabled decoupling the power converter from the system.A common-source dual MOSFET device includes a plurality of elements arranged in alternating patterns on a semiconductor die. A common-source dual synchronous rectifier includes control circuitry powered from the drain to source voltage of the complementary switch.A DC-to-DC transformer converts power from an input source to a load using a fixed voltage transformation ratio. A clamp phase may be used to reduce power losses in the converter at light loads, control the effective output resistance of the converter, effectively regulate the voltage transformation ratio, provide narrow band output regulation, and control the rate of change of output voltage for example during start up. One or more of the transformer windings may be clamped. The converter may use the sine amplitude converter topology. The converter may use common-source dual MOSFET devices and fault detection.The density of point of load power conversion may be increased and the associated power dissipation reduced by removing the input driver circuitry from the point of load where it is not necessary. An output circuit may be located at the point of load providing fault tolerant rectification of the AC power from the secondary winding of a power transformer which may be located nearby the output circuit. The resonant voltage and current waveforms on the primary side of the transformer are readily communicated via an AC bus between the driver circuit and the primary winding of the power transformer. The driver circuit may drive a plurality of transformer-output circuit pairs. The transformer and output circuit may be combined in a single module at the point of load. Alternatively, the output circuit may be integrated into point of load circuitry such as a processor core. The transformer may be deployed near the output circuit.

67. 外观设计

USD775092S1 Electric terminal 有权
公开(公告)号：USD775092S1
公开(公告)日：2016-12-27
申请号：US29556618
申请日：2016-03-02
申请人： VLT, Inc.
设计人： Patrizio Vinciarelli , Michael B. LaFleur

68. 发明授权

US09516761B2 Encapsulated modular power converter with symmetric heat distribution 有权
标题翻译：具有对称热分布的封装模块化功率转换器
公开(公告)号：US09516761B2
公开(公告)日：2016-12-06
申请号：US14635467
申请日：2015-03-02
申请人： VLT, Inc.
发明人： Patrizio Vinciarelli , Michael B. LaFleur , Sean Timothy Fleming , Rudolph F. Mutter , Andrew T. D'Amico
IPC分类号： H05K3/34 , H05K3/28 , H01R43/24 , H05K5/06 , B29C45/14 , B29C45/00 , H05K7/20 , B23P15/00 , B29C45/16 , H01F27/24 , H01F27/28 , H05K1/02 , H05K1/11 , H05K1/18 , H05K5/00 , H05K5/02 , H05K5/04 , H05K7/14
CPC分类号： H05K3/284 , B23P15/007 , B29C45/0055 , B29C45/14639 , B29C45/1679 , B29C2045/0058 , B29C2045/169 , B29C2793/0009 , B29C2793/0027 , B29C2793/009 , H01F27/24 , H01F27/2804 , H01F2027/2809 , H01R43/24 , H05K1/0209 , H05K1/0298 , H05K1/115 , H05K1/181 , H05K5/0004 , H05K5/0065 , H05K5/0217 , H05K5/0247 , H05K5/04 , H05K5/064 , H05K7/1427 , H05K7/209 , H05K2201/066 , H05K2201/10545 , H05K2203/1316 , H05K2203/1327 , H05K2203/167 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49155
摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.
摘要翻译：封装诸如功率转换器之类的电子部件的面板的方法减少了浪费的印刷电路板面积。可以包括多个部件的面板可以在形成成品的一部分的模具包封之后被切割成一个或多个单独的部件。提供散热鳍片或表面安装可焊接表面。在分离过程中，单独电路边界处提供的互连特征暴露于提供与组件的电连接，而不浪费有价值的PCB表面积。模具可以包括各种内部特征，例如将电路板精确地定位在模腔内的配准特征，用于单个模块的结构完整性的互锁轮廓，用于匹配部件形状的轮廓和增加从内部部件散热的尺寸，以及减小所需体积密封剂，间隙通道为互连提供安全机构间距和挫折。封装之后可以在模具中形成宽切削，从而降低热应力并减小在随后的切割过程中要切割的材料的厚度。外部模具特征可以包括用于散热器的各种翅片配置，用于表面安装或焊接的平坦表面等。可以加工空白模具面板以在按需制造系统中提供部分或全部上述特征。可以提供连接适配器，以在连接器，通孔，表面贴装焊料变化中的垂直或水平安装位置使用模块。互连可以被电镀以提供可插入到配合连接器中的连接器化模块。

69. 发明授权

US09508485B1 Isolator with integral transformer 有权
标题翻译：带积分变压器的隔离器
公开(公告)号：US09508485B1
公开(公告)日：2016-11-29
申请号：US14596836
申请日：2015-01-14
申请人： VLT, Inc.
发明人： Patrizio Vinciarelli
IPC分类号： H04L25/02 , H05K1/14 , H01F27/28 , H01F27/36 , H01F7/20 , H05K1/11 , H05K1/02 , H02J5/00 , H01F7/06 , H05K1/16
CPC分类号： H01F27/2804 , H01F27/288 , H01F2019/085 , H01F2027/2809 , H04L25/0266 , H05K1/0239 , H05K1/0254 , H05K1/0298 , H05K1/145 , H05K1/165 , H05K3/366 , H05K2201/09063 , H05K2201/10189
摘要： A signal isolator apparatus includes a first substrate for supporting input circuitry including a high frequency oscillator circuit for receiving an input signal, a second substrate for supporting output circuitry including a detector circuit for providing an output signal; and a third substrate having parallel conductive layers separated by insulation. The third substrate has an upper conductive shield formed in a second conductive layer and a lower conductive shield formed in a fifth conductive layer. A transformer is formed between the upper and lower conductive shields and includes a primary winding formed in a third conductive layer and a secondary winding formed in a fourth conductive layer. The oscillator circuit is connected to the primary winding and adapted to excite the primary winding at a first frequency in response to the input signal, and the detector circuit is connected to the secondary winding and adapted to selectively sense the first frequency and provide the output signal. The third substrate is arranged to form a bridge connection between the first and second substrates.
摘要翻译：信号隔离器装置包括：第一基板，用于支撑包括用于接收输入信号的高频振荡器电路的输入电路;第二基板，用于支持包括用于提供输出信号的检测器电路的输出电路; 以及具有由绝缘体隔开的平行导电层的第三衬底。第三基板具有形成在第二导电层中的上导电屏蔽和形成在第五导电层中的下导电屏蔽。变压器形成在上下导电屏蔽之间，并且包括形成在第三导电层中的初级绕组和形成在第四导电层中的次级绕组。振荡器电路连接到初级绕组并且适于响应于输入信号以第一频率激励初级绕组，并且检测器电路连接到次级绕组并且适于选择性地感测第一频率并提供输出信号。第三基板被布置成在第一和第二基板之间形成桥连接。

70. 发明授权

US09439297B2 Method of making a plurality of electronic assemblies 有权
标题翻译：制造多个电子组件的方法
公开(公告)号：US09439297B2
公开(公告)日：2016-09-06
申请号：US14635420
申请日：2015-03-02
申请人： VLT, Inc.
发明人： Patrizio Vinciarelli , Michael B. LaFleur , Sean Timothy Fleming , Rudolph F. Mutter , Andrew T. D'Amico
IPC分类号： H05K3/00 , H05K3/28 , H01R43/24 , H05K5/06 , B29C45/14 , B29C45/00 , H05K7/20 , B23P15/00 , B29C45/16 , H01F27/24 , H01F27/28 , H05K1/02 , H05K1/11 , H05K1/18 , H05K5/00 , H05K5/02 , H05K5/04 , H05K7/14
CPC分类号： H05K3/284 , B23P15/007 , B29C45/0055 , B29C45/14639 , B29C45/1679 , B29C2045/0058 , B29C2045/169 , B29C2793/0009 , B29C2793/0027 , B29C2793/009 , H01F27/24 , H01F27/2804 , H01F2027/2809 , H01R43/24 , H05K1/0209 , H05K1/0298 , H05K1/115 , H05K1/181 , H05K5/0004 , H05K5/0065 , H05K5/0217 , H05K5/0247 , H05K5/04 , H05K5/064 , H05K7/1427 , H05K7/209 , H05K2201/066 , H05K2201/10545 , H05K2203/1316 , H05K2203/1327 , H05K2203/167 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49155
摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.
摘要翻译：封装诸如功率转换器之类的电子部件的面板的方法减少了浪费的印刷电路板面积。可以包括多个部件的面板可以在形成成品的一部分的模具包封之后被切割成一个或多个单独的部件。提供散热鳍片或表面安装可焊接表面。在分离过程中，单独电路边界处提供的互连特征暴露于提供与组件的电连接，而不浪费有价值的PCB表面积。模具可以包括各种内部特征，例如将电路板精确地定位在模腔内的配准特征，用于单个模块的结构完整性的互锁轮廓，用于匹配部件形状的轮廓和增加从内部部件散热的尺寸，以及减小所需体积密封剂，间隙通道为互连提供安全机构间距和挫折。封装之后可以在模具中形成宽切削，从而降低热应力并减小在随后的切割过程中要切割的材料的厚度。外部模具特征可以包括用于散热器的各种翅片配置，用于表面安装或焊接的平坦表面等。可以加工空白模具面板以在按需制造系统中提供部分或全部上述特征。可以提供连接适配器，以在连接器，通孔，表面贴装焊料变化中的垂直或水平安装位置使用模块。互连可以被电镀以提供可插入到配合连接器中的连接器化模块。

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