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    • 61. 发明专利
    • Single type substrate treating apparatus and cleaning method thereof
    • 单类基板处理装置及其清洗方法
    • JP2009060112A
    • 2009-03-19
    • JP2008222199
    • 2008-08-29
    • Semes Co Ltdセメス株式会社Semes Co., Ltd.
    • CHOI CHUNG-SICJANG YONG-JU
    • H01L21/304H01L21/683
    • H01L21/67051
    • PROBLEM TO BE SOLVED: To provide a single type substrate treating apparatus that can remove pollution materials on a substrate support member supporting a substrate and minimize thermal deformation of the substrate support member due to a high-temperature chemical solution, and to provide the cleaning method thereof. SOLUTION: A chemical solution is sprayed onto the bottom surface of a substrate W supported by a substrate support member 200 in a state spaced upwardly from the substrate support member 200 to treat the substrate W, and a cleaning solution is sprayed onto the top surface of the substrate support member 200 to remove the chemical solution remaining on the substrate support member 200. The thermal deformation of the substrate support member 200 can be minimized by cleaning the substrate support member 200 using the cleaning solution in a room-temperature state after a series of repeated substrate treating processes. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种可以消除支撑基板的基板支撑部件上的污染物质并使由于高温化学溶液引起的基板支撑部件的热变形最小化的单一基板处理装置,并提供 其清洗方法。 解决方案:以与衬底支撑构件200向上间隔开的状态将化学溶液喷涂到由衬底支撑构件200支撑的衬底W的底表面上,以处理衬底W,并将清洁溶液喷涂到 基板支撑构件200的上表面,以去除残留在基板支撑构件200上的化学溶液。通过使用室温状态下的清洁溶液清洁基板支撑构件200,可以最小化基板支撑构件200的热变形 经过一系列重复的底物处理工艺。 版权所有(C)2009,JPO&INPIT
    • 65. 发明专利
    • Substrate cleaning device and substrate cleaning method
    • 基板清洁装置和基板清洁方法
    • JP2013232650A
    • 2013-11-14
    • JP2013095894
    • 2013-04-30
    • Semes Co Ltdセメス株式会社SEMES CO., Ltd
    • KIM YOO HWANKANG BYUNG MANOH SE HOONKIM YEON JOON
    • H01L21/304
    • B08B3/10H01L21/67028H01L21/67051
    • PROBLEM TO BE SOLVED: To provide a substrate cleaning device capable of improving drying efficiency.SOLUTION: A substrate cleaning device comprises: a first step chamber 260 for supplying processing liquid to a substrate and treating it with the liquid; a second step chamber 280 for drying the substrate; and a conveying unit 500 for conveying the substrate between the first step chamber 260 and the second step chamber 280. The first step chamber 260 comprises: a liquid treatment housing for supplying a space in which the substrate is treated with the liquid; a spin chuck 340 supporting the substrate in the liquid treatment housing; and a liquid supply member 380 for supplying the treatment liquid to the substrate supported by the spin chuck 340. The second step chamber 280 comprises: a drying housing 410 for providing a space in which the substrate is dried; a substrate support member 430 supporting the substrate in the drying chamber 410; and a heater 440 for heating the substrate.
    • 要解决的问题:提供能够提高干燥效率的基板清洗装置。解决方案:基板清洗装置包括:第一阶段室260,用于将处理液体提供给基板并用液体处理; 用于干燥基板的第二台阶室280; 以及用于在第一台阶室260和第二台阶室280之间输送基板的输送单元500.第一阶段室260包括:用于供应其中用基板处理液体的空间的液体处理壳体; 支撑液体处理壳体中的基板的旋转卡盘340; 以及用于将处理液供给到由旋转卡盘340支撑的基板的液体供给构件380.第二台阶室280包括:干燥壳体410,用于提供干燥基板的空间; 将基板支撑在干燥室410中的基板支撑部件430; 以及用于加热衬底的加热器440。
    • 67. 发明专利
    • Substrate processing apparatus and method
    • 基板加工装置和方法
    • JP2013031840A
    • 2013-02-14
    • JP2012166684
    • 2012-07-27
    • Semes Co Ltdセメス株式会社SEMES CO., Ltd
    • KIM CHULWOOLEE SUNGHEE
    • B05C9/06B05C5/00B05D1/26B05D1/36G02F1/13H01L21/683
    • PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and method capable of shortening an entire process time.SOLUTION: The substrate processing apparatus includes: a substrate supporting unit for supporting a substrate; an inkjet nozzle for ejecting a first processing liquid to the substrate; a coating nozzle for ejecting a second processing liquid different from the first processing liquid to the substrate; and a gentry unit for linearly moving the inkjet nozzle and the coating nozzle in the first direction so that the position of the inkjet nozzle and the coating nozzle can be changed relative to the substrate supporting unit.
    • 解决的问题:提供能够缩短整个处理时间的基板处理装置和方法。 解决方案:基板处理装置包括:用于支撑基板的基板支撑单元; 用于将第一处理液喷射到基板的喷墨喷嘴; 用于将不同于所述第一处理液体的第二处理液喷射到所述基板的涂布喷嘴; 以及用于沿着第一方向线性地移动喷墨喷嘴和涂布喷嘴的绅士单元,使得可以相对于基板支撑单元改变喷墨喷嘴和涂布喷嘴的位置。 版权所有(C)2013,JPO&INPIT
    • 69. 发明专利
    • Photoresist supply device and method
    • 光电设备和方法
    • JP2010067978A
    • 2010-03-25
    • JP2009207317
    • 2009-09-08
    • Semes Co Ltdセメス株式会社Semes Co., Ltd.
    • HWANG SOO MINKIM DONG-HO
    • H01L21/027B05C11/10
    • G03F7/16B05C11/1013
    • PROBLEM TO BE SOLVED: To provide a photoresist supply device that is capable of supplying a constant amount of a photoresist and of previously detecting the presence of an abnormality in the constant discharge of a photoresist and the presence of air bubbles, and is employed in a semiconductor photolithography process.
      SOLUTION: The photoresist supply device includes: a discharge nozzle for discharging the photoresist to a wafer; a metering pump for supplying a constant amount of the photoresist to the discharge nozzle; a trap tank for temporarily storing the photoresist that is supplied from the metering pump to the discharge nozzle; a bottle filled with the photoresist that is stored in the trap tank; an air bubble detection member for detecting whether air bubbles are included in the photoresist that is on standby to be supplied from the metering pump to the discharge nozzle; and a first drain line for coupling the metering pump to a waste fluid tank in order to drain the photoresist on standby in the metering pump to the waste fluid tank when the air bubble detection member detects the presence of the air bubbles.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:为了提供能够提供恒定量的光致抗蚀剂并且预先检测光致抗蚀剂的恒定放电中的异常的存在和气泡的存在的光致抗蚀剂供应装置,并且是 用于半导体光刻工艺。 解决方案:光致抗蚀剂供应装置包括:用于将光致抗蚀剂排放到晶片的放电喷嘴; 用于将一定量的光致抗蚀剂供应到排出喷嘴的计量泵; 用于临时存储从计量泵供给到排出喷嘴的光致抗蚀剂的捕集槽; 填充有存储在捕集罐中的光致抗蚀剂的瓶子; 气泡检测部件,用于检测处于备用状态的光致抗蚀剂中是否包含气泡以从计量泵供给至排出喷嘴; 以及用于将计量泵连接到废液箱的第一排水管线,以便当气泡检测构件检测到气泡的存在时,将计量泵中待机的光致抗蚀剂排出到废液箱。 版权所有(C)2010,JPO&INPIT
    • 70. 发明专利
    • Substrate conveyance equipment and method for conveying substrate
    • 基板输送装置及输送基板的方法
    • JP2010016387A
    • 2010-01-21
    • JP2009160424
    • 2009-07-07
    • Semes Co Ltdセメス株式会社Semes Co., Ltd.
    • YEO YOUNG KOOKIM TAE HOCHOI JIN-YOUNG
    • H01L21/677
    • H01L21/67775H01L21/67769
    • PROBLEM TO BE SOLVED: To provide substrate conveyance equipment for conveying a semiconductor substrate, and a method of conveying the substrate.
      SOLUTION: The substrate conveyance equipment includes a main mounting unit, a buffer mounting unit, and a distribution unit. The main mounting unit is disposed at the front of a process module for mounting a plurality of containers. Each of containers can contain a plurality of substrates. The main mounting unit is configured to convey substrates between the mounted containers and the process module. The buffer mounting unit can mount a plurality of containers. The distribution unit disposed above the main mounting unit conveys the container between the main mounting unit and the buffer mounting unit. Thus, the substrate conveyance equipment provided with a buffer mounting unit for mounting containers conveys containers between the main mounting unit and the buffer mounting unit through the distribution unit so that a time required for conveying the substrates is shortened and productivity is increased.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供用于输送半导体衬底的衬底输送设备以及输送衬底的方法。 解决方案:基板输送设备包括主安装单元,缓冲器安装单元和分配单元。 主安装单元设置在用于安装多个容器的处理模块的前部。 每个容器可以包含多个基底。 主安装单元构造成在安装的容器和处理模块之间输送基板。 缓冲器安装单元可以安装多个容器。 设置在主安装单元上方的分配单元在主安装单元和缓冲器安装单元之间传送容器。 因此,设置有用于安装容器的缓冲器安装单元的基板输送设备通过分配单元在主安装单元和缓冲器安装单元之间输送容器,从而缩短输送基板所需的时间并提高生产率。 版权所有(C)2010,JPO&INPIT