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61. 发明专利

JP2002121692A ELECTROPLATING COMPOSITION 审中-公开
公开(公告)号：JP2002121692A
公开(公告)日：2002-04-26
申请号：JP2001201342
申请日：2001-07-02
申请人： SHIPLEY CO LLC
发明人： EGLI ANDRE , VINCKIER ANJA , HEBER JOCHEN , ZHANG WAN
IPC分类号： C25D3/30 , C25D3/32 , C25D3/60 , C25D7/00 , C25D7/12 , H05K3/24
摘要： PROBLEM TO BE SOLVED: To provide, in particular, an electroplating composition, a method for using the composition and a product formed by the composition. SOLUTION: This electroplating composition is characterized mainly by a grain refiner/stabilizer additive containing a nonaromatic compound having delocalized π electrons, e.g. of α, βunsaturated systems or containing one or more other conjugated systems each having a proximate electron-withdrawing group. The composition provides enhanced grain refinement and enhanced stability of plating solution and enhanced stability of tin and tin alloy plating blends in particular.

62. 发明专利

JP2002083777A BUBBLER 失效
公开(公告)号：JP2002083777A
公开(公告)日：2002-03-22
申请号：JP2001162191
申请日：2001-05-30
申请人： SHIPLEY CO LLC
发明人： TIMMONS MICHAEL L , COLBY RICHARD J , STENNICK ROBERT
IPC分类号： B01J4/00 , B01J7/02 , C23C16/448 , H01L21/205
摘要： PROBLEM TO BE SOLVED: To disclose a bubbler design, having two chambers to use the solid organometallic supply source materials of chemical vapor deposition system and a method for transporting a carrier gas saturated by source materials for transmission into such a system. SOLUTION: The device for providing vaporized organometallic compound to the chemical vapor deposition system is provided with a vessel, having an elongated cylindrically shaped portion, top closure portion 15, bottom closure portion 16, inlet chamber 25 and outlet chamber 30, the top closure portion has a fill plug and a gas inlet opening 19, the fill plug and the gas inlet opening 19 are communicated with the inlet chamber 25, an outlet opening 20 is communicated with the outlet chamber 30, the inlet chamber has a conical shaped lower portion 21, provided with a porous element 14, and the porous element is spaced from the bottom closure portion.

63. 发明专利

JP2002038197A POLYMER REMOVER 失效
公开(公告)号：JP2002038197A
公开(公告)日：2002-02-06
申请号：JP2001087852
申请日：2001-03-26
申请人： SHIPLEY CO LLC
发明人： SAHBARI JAVAD J
IPC分类号： C09D9/00 , C11D7/10 , C11D7/26 , C11D7/28 , C11D7/32 , C11D7/34 , C11D7/50 , C11D7/60 , C11D17/08 , G03F7/42 , H01L21/02 , H01L21/302 , H01L21/304 , H01L21/311 , H01L21/3213 , H01L21/3065
摘要： PROBLEM TO BE SOLVED: To provide a stripper and a polymer remover to be used after etching capable of removing effectively polymeric materials, compatible with the environment, free from damaging structure and geometry, causing no erosion to a base body, especially to metallic thin film, and etching no dielectric layer on the base body. SOLUTION: The composition for removing polymeric materials from a base body contains >=1 polyol compounds, >=1 glycol ethers, water, a fluoride salt selected from ammonium fluoride, ammonium hydrogen fluoride, ammonium- tetramethylammonium hydrogen fluoride and their mixture, and optionally >=1 additives, and the content of water is at least 5 wt.% based on the whole weight of the composition.

64. 发明专利

JP2002037912A POROUS SUBSTANCE 失效
公开(公告)号：JP2002037912A
公开(公告)日：2002-02-06
申请号：JP2001082747
申请日：2001-03-22
申请人： SHIPLEY CO LLC
发明人： YOU YUJIAN , LAMOLA ANGELO A , GORE ROBERT H , GALLAGHER MICHAEL K , NIKOI ANAN
IPC分类号： C08J9/22 , C08J9/26 , H01B3/46 , H01L21/316
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a porous organo polysilica dielectric substance having a low dielectric constant useful for producing electronic parts and a porous organo dielectric substance and a method for forming an integrated circuit comprising the porous organo polysilica dielectric substance. SOLUTION: This method for producing a porous organo polysilica dielectric substance comprises dispersing a removable crosslinked polymer porogen into a B-stage organo polysilica dielectric substance, hardening the B-stage organo polysilica dielectric substance and removing at least partially the porogen. The porogen is substantially compatible with the B-stage organo polysilica dielectric substance and the porogen comprises at least one compound selected from a silyl-containing monomer and a poly(alkylene oxide) monomer as a polymerization unit and one or more crosslinking agents is polymerized.

65. 发明专利

JP2001356481A POSITIVE TYPE PHOTORESIST COMPOSITION 失效
公开(公告)号：JP2001356481A
公开(公告)日：2001-12-26
申请号：JP2001104371
申请日：2001-04-03
申请人： SHIPLEY CO LLC
发明人： TIMOTHY G ADAMS
IPC分类号： G03F7/028 , C08K5/00 , C08L101/00 , G03F7/004 , G03F7/039 , G03F7/40 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To attain a controlled thermal flow in a contact hole (via hole) in a resist. SOLUTION: The objective positive type resist composition contains one or more components which are preferably substantially stable 1) in soft baking which is a heat treatment before exposure for removing the solvent carrier of an applied resist and 2) in a heat treatment after exposure and before development for accelerating or increasing an acceleration reaction by an acid in an exposed region (typically a deblocked region). The resist is crosslinked in a more intense heat treatment (thermal flow hard baking) after development.

66. 发明专利

JP2001348410A POLYMER AND PHOTORESIST COMPOSITION 失效
公开(公告)号：JP2001348410A
公开(公告)日：2001-12-18
申请号：JP2001050251
申请日：2001-02-26
申请人： SHIPLEY CO LLC
发明人： BARCLAY GEORGE G , ZAMPINI ANTHONY
IPC分类号： G03F7/027 , C08F4/34 , C08F4/80 , C08F32/08 , C08F232/08 , G03F7/004 , G03F7/039 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a polymer which is used as a binder in a polymer composition useful for a photoresist composition. SOLUTION: This polymer contains as polymerized units one or more cyclic olefin monomers having fused cyclic electron-withdrawing groups represented by formula I or II [wherein A is O, S, CR7R8 or NR5; R5 is (substituted) phenyl, (substituted) benzyl or a (substituted) 1-8C alkyl; Z is O, S or NR6; R6 is a (substituted) 1-8C alkyl; R7 and R8 are each H or a (substituted) 1-8C alkyl; E and W are each a chemical bond, O, S or NR6;, R1, R2, R3, and R4 are each H, a 1-4C alkyl, a 1-4C alkoxy or a halogen; and T and L are taken together and selected from a double bond and 5 to 8-membered unsaturated rings].

67. 发明专利

JP2001323031A POLYMER AND PHOTORESIST COMPOSITION 失效
公开(公告)号：JP2001323031A
公开(公告)日：2001-11-20
申请号：JP2001050207
申请日：2001-02-26
申请人： SHIPLEY CO LLC
发明人： ZAMPINI ANTHONY , BARCLAY GEORGE G
IPC分类号： G03F7/027 , C08F4/26 , C08F4/28 , C08F32/08 , C08F232/04 , C08K5/00 , C08L45/00 , G03F7/004 , G03F7/039 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a photoresist composition capable of forming an image with light having short wavelength, containing a resin binder having decreased swelling tendency and exhibiting excellent adhesion to the substrate compared with conventional photoresist composition. SOLUTION: The present invention relates to a polymer containing polymerization unit comprising one or more cyclic olefin monomers having one or more pendant cyclic electron-attracting groups, a method for the production of the polymer, a photoresist composition containing the polymer as a resin binder and a method for forming a relief image by using the photoresist composition.

68. 发明专利

JP2001003191A ELECTROLYTIC COPPER PLATING SOLUTION 失效
公开(公告)号：JP2001003191A
公开(公告)日：2001-01-09
申请号：JP2000144780
申请日：2000-05-17
申请人： SHIPLEY CO LLC
发明人： BARSTAD LEON R , RYCHWALSKI JAMES E , LEFEBVRE MARK , MENARD STEPHANE , MARTIN JAMES L , SCHETTY ROBERT A III , TOBEN MICHAEL
IPC分类号： C25D3/38 , C25D5/48 , C25D7/00 , C25D7/12 , H01L21/288 , H05K3/42
摘要： PROBLEM TO BE SOLVED: To effectively plate openings of a high aspect ratio by incorporating at least one soluble copper salt, electrolyte and at least one or more brightening agent compounds of specific concentration into the subject solution. SOLUTION: This electroplating composition contains the brightening agent at a concentration of at least about 1.5 mg/l, more preferably about 2 to 25 mg/l. The brightening agent is a compound having at least one or more sulfur atoms and preferably having a sulfide and/or sulfonic acid group and the compound containing a group of R'-S-R-SO3X is more preferable. In the formula, R: an alkyl (inclusive of cycloalkyls), a heteroalkyl, an aryl group of a heteroalicyclic compound all of which may be arbitrarily substituted, X: paired ion, such as Na or K, R': hydrogen or -S-R-SO3X or a substituent of a larger compound. As a concrete brightening agent n,n-dimethyl-dithiocarbamic acid-(3- sulfopropyl)ester, or the like, is cited.

69. 发明专利

JP2000349419A CONDUCTIVE PAD AND MANUFACTURE THEREOF 失效
公开(公告)号：JP2000349419A
公开(公告)日：2000-12-15
申请号：JP15425799
申请日：1999-06-01
申请人： OCEAN KK , SHIPLEY FAR EAST LTD
发明人： YAZAWA AKIRA , SUZUKI TORU
IPC分类号： H05K3/24 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To raise reliability in conductive connection by forming a base material layer comprising a nickel or an alloy whose main component is nickel on the surface of a pad forming part while a surface coat layer comprising a silver or alloy whose main component is silver is formed on the surface of the base material layer. SOLUTION: A base material layer 122a comprising nickel as the main component including phosphorus is formed on the surface of a chip-side pad forming part 121 of a copper pattern by an electroless plating method, over which a coat layer 122c of silver is formed by an electroless plating method. Since, with this configuration, the coat layer 122c is formed on the base material layer 122a whose main component is nickel, the flatness and hardness of a conductive pad is assured while bonding characteristics as well as adhesion of the surface coat layer 122c is improved. Further, the fact that the main component of the surface coat layer 122c is silver gives joint strength. So, the reliability in conductive connection is raised both by bonding and metal- jointing.

70. 发明专利

JP2000349186A PACKAGE INTERPOSITION BOARD AND ITS MANUFACTURE 失效
公开(公告)号：JP2000349186A
公开(公告)日：2000-12-15
申请号：JP15425699
申请日：1999-06-01
申请人： OCEAN KK , SHIPLEY FAR EAST LTD
发明人： YAZAWA AKIRA , SUZUKI TORU
IPC分类号： H05K1/11 , H01L23/12 , H05K1/09
摘要： PROBLEM TO BE SOLVED: To provide a technique capable of enhancing a bonding strength in stability ensuring a bonding strength to a conductor for a package interposition board equipped with a terminal bonding pad used for forming a protrudent electrode by bonding various kinds of conductor such as a solder ball, a bump electrode, and the like. SOLUTION: Plating resist is applied on all the top surface of a BGA wiring board. A terminal pad forming part 131 formed on the under surface of the BGA wiring board is plated with silver for the formation of a surface layer 132 which serves as a terminal bonding pad. Then, the BGA wiring board is cleaned, the plating resist is removed, then the BGA wiring board is cleaned again, and the under surface of the BGA wiring board is coated with plating resist. A surface layer is formed on a chip-side pad forming part provided on the top surface of the BGA wiring board, and a chip connection pad covered with a gold coating layer is formed.

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