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    • 61. 发明专利
    • Reconfigurable communication circuit
    • 可重构通信电路
    • JP2012209976A
    • 2012-10-25
    • JP2012160115
    • 2012-07-19
    • Agere Systems Incアギア システムズ インコーポレーテッド
    • NICOL CHRISTOPHER JOHNPROKOP TOMASZ TYIP DOMINIC WING-KIN
    • H04B7/08H04J99/00
    • H04B7/0845H04B7/0857H04B7/0871H04B7/0874H04B7/0891Y02D70/00Y02D70/1242Y02D70/444
    • PROBLEM TO BE SOLVED: To reduce integrated area of an equalizer filter unit and to decrease electric power consumption, in a receiver capable of being operated by switching a first mode which uses a diversity function and a second mode which does not use the diversity function.SOLUTION: A communication circuit comprises: N sets of equalizer filter units 106; a coupling circuit 114; and N sets of a post equalizer processor 112. During operating in a first mode, the coupling circuit is constituted so as to couple output of N sets of the equalizer filter units to input of N sets of the post equalizer processors by corresponding the output with the input. During operating in a second mode, the coupling circuit is constituted so as to couple the output of N sets of the equalizer filter units to the input of L sets (L is smaller than N) of the post equalizer processors among the N sets of the post equalizer processors.
    • 要解决的问题为了减少均衡器滤波器单元的集成面积并降低电力消耗,在能够通过切换使用分集功能的第一模式和不使用分集功能的第二模式来操作的接收机中 多样性功能。 解决方案:通信电路包括:N组均衡滤波器单元106; 耦合电路114; 和N组后置均衡器处理器112.在第一模式下操作期间,耦合电路被构造成将N组均衡器滤波器单元的输出耦合到N组后置均衡器处理器的输入, 输入。 在第二模式下工作时,耦合电路被构造成将N组均衡滤波器单元的输出耦合到N组的均衡器处理器的L组输入(L小于N) 后均衡器处理器。 版权所有(C)2013,JPO&INPIT
    • 65. 发明专利
    • Circuit device including removable bond pad extension
    • 电路设备,包括可拆卸的BOND PAD EXTENSION
    • JP2010261931A
    • 2010-11-18
    • JP2009234710
    • 2009-10-09
    • Agere Systems Incアギア システムズ インコーポレーテッド
    • FRATTI ROGER A
    • G01R31/28G11C29/12H01L21/822H01L27/04
    • G01R31/31905G01R31/2822G01R31/2884H01L2924/0002H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a reusable, removable bond pad extension without giving any additional parasitic effects to an electric circuit device. SOLUTION: A test pad 14 of the bond pad extension is removably coupled to one of electric components of the electric circuit device 22, such as a bond pad 12. Since the test pad of the bond pad extension is disconnected from the electric components when not tested, the test pad of the bond pad extension test does not give any additional parasitic effects to the corresponding electric circuit device. An electric circuit arrangement automatically detects when a test voltage is applied to the test pad of the bond pad extension, then connects the test pad of the bond pad extension in response to the detection of the applied test voltage. When no test voltages are being applied to the test pad of the bond pad extension, the electric circuit arrangement disconnects the test pad from the associated electric components. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供可重复使用的可移除的接合焊盘扩展,而不会给电路设备带来额外的寄生效应。 解决方案:接合焊盘延伸部的测试焊盘14可移除地耦合到诸如焊盘12的电路装置22的电气部件中的一个。由于接合焊盘延伸部的测试焊盘与电 未测试组件时,焊盘扩展测试的测试焊盘不会对相应的电路设备产生任何额外的寄生效应。 电路装置自动检测何时将测试电压施加到接合焊盘延伸部的测试焊盘,然后响应于检测所施加的测试电压而连接焊盘扩展部分的测试焊盘。 当没有测试电压施加到接合焊盘扩展的测试焊盘时,电路装置将测试焊盘与相关联的电气部件断开。 版权所有(C)2011,JPO&INPIT