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    • 57. 发明授权
    • Multilayered chip capacitor
    • 多层片式电容器
    • US06940710B1
    • 2005-09-06
    • US11029677
    • 2005-01-06
    • Byoung Hwa LeeDong Seok ParkChang Hoon ShimSang Soo ParkMin Cheol Park
    • Byoung Hwa LeeDong Seok ParkChang Hoon ShimSang Soo ParkMin Cheol Park
    • H01G4/232H01G4/30H01G4/06
    • H01G4/232H01G4/30
    • A multilayered chip capacitor including a capacitor main body including a plurality of dielectric layers, which are laminated; at least one pair of first and second internal electrodes, each of which is formed on the corresponding one of the plural dielectric layers and includes at least one lead extended to one end of the corresponding dielectric layer; a plurality of external terminals formed on the outer surface of the capacitor main body, and respectively connected to the first and second internal electrodes through the leads; and at least one opened region, formed through the inner area of each of the first and second internal electrodes, for branching the flow of current so as to increase the offset quantity of parasitic inductances between the first and second internal electrodes.
    • 一种多层片状电容器,其包括层叠有多个电介质层的电容器主体; 至少一对第一和第二内部电极,每个所述第一和第二内部电极形成在所述多个电介质层中的相应一个上,并且包括至少一个延伸到所述相应电介质层的一端的引线; 多个外部端子,形成在电容器主体的外表面上,分别通过引线连接到第一和第二内部电极; 以及通过第一和第二内部电极的每一个的内部区域形成的至少一个开放区域,用于分流电流,以增加第一和第二内部电极之间的寄生电感的偏移量。