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51. 发明申请

US20100035408A1 METHOD OF PROCESSING OPTICAL DEVICE WAFER 有权
标题翻译：处理光学器件波形的方法
公开(公告)号：US20100035408A1
公开(公告)日：2010-02-11
申请号：US12496436
申请日：2009-07-01
申请人： Hitoshi Hoshino , Takashi Yamaguchi
发明人： Hitoshi Hoshino , Takashi Yamaguchi
IPC分类号： H01L21/304
CPC分类号： G02B6/13 , B23K26/364 , B23K26/40 , B23K2103/50 , B24B7/228 , B24B37/042 , G02B6/3688
摘要： A method of dividing an optical device wafer includes: a laser beam processing step of performing laser beam processing to provide an optical device wafer with breakage starting points along streets on the face side of the optical device wafer; a protective plate bonding step of bonding the face side of the optical device wafer to a surface of a highly rigid protective plate with a bonding agent permitting peeling; a back side grinding step of grinding the back side of the optical device wafer so as to form the optical device wafer to a finished thickness of the optical devices; a wafer supporting step of adhering the back-side surface of the optical device wafer to a surface of a dicing tape, and peeling the protective plate adhered to the face side of the optical device wafer; and a wafer dividing step of exerting an external force on the optical device wafer so as to break up the optical device wafer along the streets along which the breakage starting points have been formed, thereby dividing the optical device wafer into the individual optical devices.
摘要翻译：一种分割光学元件晶片的方法包括：激光束处理步骤，执行激光束处理，以向光学器件晶片提供沿着光学器件晶片的正面侧上的街道的断裂起始点; 保护板接合步骤，用粘合剂剥离光学器件晶片的表面与高度刚性的保护板的表面接合; 背面磨削步骤，其研磨所述光学器件晶片的背面，以便将所述光学器件晶片形成为所述光学器件的成品厚度; 将所述光学器件晶片的背面粘接到切割带的表面的晶片支撑步骤，以及剥离粘附到所述光学器件晶片的所述正面的所述保护板; 以及在光学器件晶片上施加外力以沿着已经形成有断裂起点的街道分裂光学器件晶片，从而将光学器件晶片分成各个光学器件的晶片分割步骤。

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