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    • 51. 发明申请
    • PIXEL CIRCUIT AND DISPLAY DEVICE
    • 像素电路和显示设备
    • US20120075251A1
    • 2012-03-29
    • US13375614
    • 2010-06-07
    • Yoshimitsu Yamauchi
    • Yoshimitsu Yamauchi
    • G09G5/00G06F3/045
    • G09G3/3659G09G3/3258G09G2300/0866G09G2300/0876G09G2330/021
    • An embodiment of the present invention provides a liquid crystal display device. In each pixel circuit, a pixel electrode is connected to a source line via a third transistor. When a refreshing circuit performs a refreshing operation, a boosting signal line is supplied with a voltage pulse. If the pixel electrode is at a high voltage level at this time point, a voltage at a node is boosted and a first transistor turns ON to supply a refreshing voltage to the pixel electrode. If the pixel electrode is at a low voltage level, there is no boost, and the first transistor stays in OFF state, so a node assumes a voltage which is given by an off-resistance ratio of the first and the third transistors, and this voltage is supplied to the pixel electrode.
    • 本发明的实施例提供一种液晶显示装置。 在每个像素电路中,像素电极经由第三晶体管连接到源极线。 当刷新电路进行刷新操作时,向升压信号线提供电压脉冲。 如果在该时间点像素电极处于高电压电平,则节点处的电压被升高,并且第一晶体管导通以向像素电极提供刷新电压。 如果像素电极处于低电压电平,则不存在升压,并且第一晶体管保持截止状态,因此节点呈现由第一和第三晶体管的截止电阻比给出的电压,并且这个 电压被提供给像素电极。
    • 54. 发明授权
    • Cell array, operating method of the same and manufacturing method of the same
    • 电池阵列,操作方法相同,制造方法相同
    • US06392927B2
    • 2002-05-21
    • US09789726
    • 2001-02-22
    • Yoshimitsu Yamauchi
    • Yoshimitsu Yamauchi
    • G11C1604
    • H01L27/11521G11C16/0433G11C16/0491G11C16/3427H01L27/115
    • A cell array comprising nonvolatile memory cells having; a floating gate formed on a semiconductor substrate with the intervention of a first insulating film; a split gate formed with the intervention of a second insulating film at a predetermined distance from the floating gate; a control gate formed at least on the floating gate with the intervention of a third insulating film; and an impurity diffusion layer formed in a surface layer of the semiconductor substrate and capacitively coupled with an edge of the floating gate on an opposite side to the split gate in an X direction in parallel with a channel direction; wherein two or more cells are arranged in matrix along the X direction and a Y direction vertical to the X direction, the floating gates and the split gates are alternately arranged in the X direction and the impurity diffusion layer of one cell is capacitively coupled with a split gate of another cell adjacent to said one cell in the X direction, the control gates of the cells arranged along the X direction are commonly connected along the X direction, the impurity diffusion layers of the cells arranged along the Y direction are commonly connected along the Y direction, and the split gates commonly connected along the Y direction are also commonly connected along the X direction through at least one conductive layer.
    • 一种包括非易失性存储单元的单元阵列,具有: 介于第一绝缘膜之间的形成在半导体衬底上的浮栅; 形成有与浮动栅极隔开预定距离的第二绝缘膜介入的分路门; 至少在所述浮动栅极上形成的第三绝缘膜介入的控制栅极; 以及杂质扩散层,其形成在所述半导体衬底的表面层中,并且与所述浮栅的边缘在与沟道方向平行的X方向上与所述分离栅极相反的一侧电容耦合; 其中两个或更多个单元沿着X方向和垂直于X方向的Y方向排列成矩阵,浮置栅极和分离栅极在X方向上交替排列,并且一个单元的杂质扩散层与电容耦合 在X方向上与所述一个单元相邻的另一个单元的分离栅极沿X方向排列的单元的控制栅极沿着X方向共同连接,沿Y方向排列的单元的杂质扩散层共同连接 Y方向和沿着Y方向共同连接的分割门也通过至少一个导电层沿X方向共同连接。
    • 55. 发明授权
    • Method of making nonvolatile semiconductor memory
    • US5877054A
    • 1999-03-02
    • US672666
    • 1996-06-28
    • Yoshimitsu Yamauchi
    • Yoshimitsu Yamauchi
    • G11C16/04H01L21/8247H01L27/115
    • H01L27/11521G11C16/0491H01L27/115
    • The nonvolatile semiconductor memory of this invention includes: a semiconductor substrate; a plurality of memory cells formed in a matrix on the semiconductor substrate, each of the memory cells including a first insulating film formed on the semiconductor substrate, a floating gate formed on the first insulating film, and a control gate formed on the floating gate via a second insulating film sandwiched therebetween, a source diffusion region, and a drain diffusion region; a diffusion layer formed in a portion of the semiconductor substrate located between two of the memory cells adjacent in a first direction, the diffusion layer including the drain diffusion region for one of the two memory cells and the source diffusion region for the other memory cell; a word line formed by connecting the control gates of the memory cells lined in the first direction; and a bit line formed by connecting the diffusion layers lined in a second direction substantially perpendicular to the first direction, wherein the memory cells have a structure in which a tunnel current flows between the drain diffusion region and the floating gate of one of the two adjacent memory cells via the first insulating film when a predetermined voltage is applied to the diffusion layers and no tunnel current flows between the diffusion layer and the floating gate of the other memory cell.
    • 56. 发明授权
    • Method for forming a semiconductor device
    • 半导体器件形成方法
    • US5422297A
    • 1995-06-06
    • US254574
    • 1994-06-06
    • Yoshimitsu Yamauchi
    • Yoshimitsu Yamauchi
    • H01L27/112H01L21/8242H01L21/8246H01L21/70
    • H01L27/10873
    • A method for forming a semiconductor device comprising steps of: (i) depositing an oxide film and then an anti-oxide film on a semiconductor substrate of a first conductive type, (ii) removing the anti-oxide film provided in a prescribed region where a field oxide film is to be formed, followed by forming a resist on the semiconductor substrate including the anti-oxide film in a prescribed region where a buried bit line is to be formed, (iii) implanting ions of a second conductive type to the semiconductor substrate using the oxide film and the resist as a mask, (iv) forming the field oxide film in the prescribed region by LOCOS method, followed by forming a gate electrode on the semiconductor substrate, (v) implanting ions of the second conductive type to the semiconductor substrate using the gate electrode as a mask and subjecting the resulting semiconductor substrate to a thermal treatment, thereby forming a source/drain region to which the buried bit line is connected.
    • 一种形成半导体器件的方法,包括以下步骤:(i)在第一导电类型的半导体衬底上沉积氧化膜,然后沉积抗氧化膜,(ii)除去在规定区域中设置的抗氧化膜, 形成场氧化膜,然后在要形成掩埋位线的规定区域中的包含抗氧化膜的半导体衬底上形成抗蚀剂,(iii)将第二导电类型的离子注入到 使用氧化膜和抗蚀剂作为掩模的半导体衬底,(iv)通过LOCOS法在规定区域中形成场氧化膜,然后在半导体衬底上形成栅电极,(v)注入第二导电类型的离子 使用栅极电极作为掩模对半导体基板进行热处理,从而形成与埋置的位线连接的源极/漏极区域。