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51. 发明申请

US20080112424A1 Apparatus for reducing contention in prioritized contention access of wireless personal area network and method of using the same 审中-公开
标题翻译：用于减少无线个域网优先竞争接入的争用的装置及其使用方法
公开(公告)号：US20080112424A1
公开(公告)日：2008-05-15
申请号：US11727907
申请日：2007-03-29
申请人： Yong Suk Kim , Jun Seo Lee , Chang Woo Seo , Jun Haeng Cho
发明人： Yong Suk Kim , Jun Seo Lee , Chang Woo Seo , Jun Haeng Cho
IPC分类号： H04L12/28
CPC分类号： H04W74/0816 , H04W74/0875 , H04W84/18
摘要： A contention reduction apparatus and method in a prioritized contention access (PCA) method of a Wireless Personal Area Network are provided. A contention reduction apparatus of a Wireless Personal Area Network includes: a prioritized contention access (PCA) section retriever which retrieves a PCA section from beacons received for a beacon period (BP); a PCA section divider which divides the retrieved PCA section; a device selector which selects devices using the PCA section; and a PCA section allocator which allocates the divided PCA section to the selected devices.
摘要翻译：提供了一种无线个人区域网络的优先竞争接入（PCA）方法中的争用减少装置和方法。无线个人区域网络的争用减免装置包括：优先级争用接入（PCA）部分检索器，其从为信标周期（BP）接收到的信标检索PCA部分; 一个PCA部分分割器，分割检索的PCA部分; 使用PCA部分选择设备的设备选择器; 以及PCA部分分配器，其将所分割的PCA部分分配给所选择的设备。

52. 发明申请

US20080112384A1 Apparatus for merging beacon of wireless local network and method using the same 审中-公开
标题翻译：用于合并无线局域网的信标的装置及其使用方法
公开(公告)号：US20080112384A1
公开(公告)日：2008-05-15
申请号：US11723285
申请日：2007-03-19
申请人： Chang Woo Seo , Jun Seo Lee , Jun Haeng Cho , Yong Suk Kim , Seung Hwan Oh
发明人： Chang Woo Seo , Jun Seo Lee , Jun Haeng Cho , Yong Suk Kim , Seung Hwan Oh
IPC分类号： H04J1/00
CPC分类号： H04W8/005 , H04W48/12 , H04W84/18 , H04W88/02 , Y02D70/10 , Y02D70/14
摘要： An apparatus and method of merging beacons in a wireless local network are provided. The method of merging beacons in a wireless local network includes: calculating a continuous occurrence frequency of a received alien beacon period (BP); comparing the calculated occurrence frequency with a certain reference occurrence frequency; and merging a beacon group of a corresponding device with an alien beacon group when the calculated occurrence frequency is greater than or equal to the reference occurrence frequency.
摘要翻译：提供了一种在无线局域网络中合并信标的装置和方法。在无线局域网中合并信标的方法包括：计算接收的外来信标周期（BP）的连续出现频率; 将计算的出现频率与特定参考发生频率进行比较; 以及当所计算的出现频率大于或等于所述参考发生频率时，将对应设备的信标组合与外来信标组合并。

53. 发明授权

US07371603B2 Method of fabricating light emitting diode package 有权
标题翻译：制造发光二极管封装的方法
公开(公告)号：US07371603B2
公开(公告)日：2008-05-13
申请号：US11439189
申请日：2006-05-24
申请人： Yong Suk Kim , Seog Moon Choi , Hyoung Ho Kim , Yong Sik Kim
发明人： Yong Suk Kim , Seog Moon Choi , Hyoung Ho Kim , Yong Sik Kim
IPC分类号： H01L21/00 , H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： H01L33/52 , H01L2224/48091 , H01L2224/48227 , Y10S438/974 , H01L2924/00014
摘要： The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed. The method also includes mounting the LED on the mounting area on the substrate package and electrically connecting the LED with the metal pattern, and forming the resin-molded part in the mounting area of the LED to seal the LED package.
摘要翻译：本发明涉及一种LED封装，并提出一种制造LED封装的方法，包括以下步骤：提供具有与LED连接的LED的安装区域和与LED连接的金属图案的封装基板，以及等离子体处理封装基板以改造至少形成将形成树脂成型部件的封装基板的预定表面积。该方法还包括将LED安装在基板封装上的安装区域上，并将LED与金属图案电连接，并在LED的安装区域中形成树脂模制部件以密封LED封装。

54. 发明授权

US07338854B2 Method for manufacturing multilayer ceramic capacitor 失效
标题翻译：多层陶瓷电容器制造方法
公开(公告)号：US07338854B2
公开(公告)日：2008-03-04
申请号：US11002183
申请日：2004-12-03
申请人： Ho Sung Choo , Seung Hyun Ra , Yong Suk Kim , Jung Woo Lee , Hyo Soon Shin , Hyoung Ho Kim
发明人： Ho Sung Choo , Seung Hyun Ra , Yong Suk Kim , Jung Woo Lee , Hyo Soon Shin , Hyoung Ho Kim
IPC分类号： H01L21/8242
CPC分类号： H01G4/005 , H01G4/12 , H01G4/30 , Y10T29/417
摘要： A method for manufacturing a multilayer ceramic capacitor, in which internal electrodes printed on each of a plurality of dielectric sheets have reduced thicknesses using an absorption member, thereby allowing the multilayer ceramic capacitor to have a high capacity and be minimized. The method includes printing the internal electrodes on each of the dielectric sheets, and stacking the dielectric sheets, wherein the internal electrodes formed on each of the dielectric sheets have a reduced thickness by causing an absorptive member to contact the surface of each of the dielectric sheets provided with the internal electrodes and then separating the absorptive member from the surface so that portions of the internal electrodes having a designated thickness are eliminated, and the dielectric sheets provided with the internal electrodes having the reduced thickness are stacked to form a chip element.
摘要翻译：一种制造多层陶瓷电容器的方法，其中印刷在多个电介质片材的每一个上的内部电极使用吸收构件具有减小的厚度，从而允许多层陶瓷电容器具有高容量并且被最小化。该方法包括在每个电介质片上印刷内部电极，并叠放电介质片，其中形成在每个电介质片上的内部电极通过使吸收构件接触每个电介质片的表面而具有减小的厚度设置有内部电极，然后将吸收构件从表面分离，使得部分具有指定厚度的内部电极被去除，并且设置有具有减小的厚度的内部电极的电介质层被堆叠以形成芯片元件。

55. 发明申请

US20070260801A1 Method of operating wireless USB apparatus and wireless USB apparatus using the same 失效
标题翻译：操作无线USB装置的方法和使用其的无线USB装置
公开(公告)号：US20070260801A1
公开(公告)日：2007-11-08
申请号：US11598747
申请日：2006-11-14
申请人： Dong Won Kwak , Yong Suk Kim , Chang Mo Chung
发明人： Dong Won Kwak , Yong Suk Kim , Chang Mo Chung
IPC分类号： G06F13/14
CPC分类号： H04W48/16 , H04W28/26 , H04W48/08 , H04W88/04 , H04W88/06 , H04W92/02
摘要： A method of operating a wireless universal serial bus (USB) apparatus and the wireless USB apparatus using the same. The method including: receiving operation state information from a neighboring wireless USB apparatus in a beacon period (BP); the wireless USB apparatus, which is operating as a host in a first cluster by using the operation state information, identifying a distributed reservation protocol (DRP) corresponding to a second cluster; and the wireless USB apparatus, which is operating as the host in the first cluster, participating in the second cluster as a device by transmitting and receiving data in the DRP corresponding to the second cluster. Accordingly, the wireless USB apparatus which operates as a host may participate in a neighboring WUSB cluster as a device.
摘要翻译：一种操作无线通用串行总线（USB）设备的方法和使用其的无线USB设备。该方法包括：在信标周期（BP）中从相邻的无线USB设备接收操作状态信息; 所述无线USB装置通过使用所述操作状态信息在第一集群中作为主机运行，识别与第二集群对应的分布式预留协议（DRP）; 以及作为第一群集中的主机操作的无线USB装置，通过在对应于第二群集的DRP中发送和接收数据来作为设备参与第二群集。因此，作为主机操作的无线USB装置可以作为设备参与相邻的WUSB群集。

56. 发明授权

US08841927B2 Touch sensing circuit 有权
标题翻译：触摸感应电路
公开(公告)号：US08841927B2
公开(公告)日：2014-09-23
申请号：US13287607
申请日：2011-11-02
申请人： Yong Sung Ahn , Jung Min Choi , Yong Suk Kim , Hyung Seog Oh
发明人： Yong Sung Ahn , Jung Min Choi , Yong Suk Kim , Hyung Seog Oh
IPC分类号： G01R27/26 , G06F3/044 , G01R23/20 , G06F3/041
CPC分类号： G06F3/044 , G06F3/0416
摘要： A touch sensing circuit detects a difference in variation of coupling capacitances between mutually adjacent driving electrodes through the use of a differential amplifier, and senses whether or not a touch is made on a touch screen panel, thereby being capable of removing display noise.
摘要翻译：触摸感测电路通过使用差分放大器检测相互相邻的驱动电极之间的耦合电容的变化差异，并且感测是否在触摸屏面板上进行触摸，从而能够去除显示噪声。

57. 发明申请

US20120279544A1 THERMOELECTRIC MODULE 审中-公开
标题翻译：热电模块
公开(公告)号：US20120279544A1
公开(公告)日：2012-11-08
申请号：US13412126
申请日：2012-03-05
申请人： Dong Hyeok CHOI , Yong Suk Kim , Sung Ho Lee
发明人： Dong Hyeok CHOI , Yong Suk Kim , Sung Ho Lee
IPC分类号： H01L35/32
CPC分类号： H01L35/32
摘要： Disclosed herein is a thermoelectric module using a thermoelectric element capable of showing a spin Seebeck effect. The present invention provides a new thermoelectric module including: an upper substrate on which a plurality of upper metal electrodes are arranged; a lower substrate on which a plurality of lower metal electrodes are arranged; p-type semiconductor devices and n-type semiconductor devices that are disposed between the upper substrate and the lower substrate and are electrically bonded alternately to each other by the plurality of upper metal electrodes and the plurality of lower metal electrodes; and ferrite elements that are disposed between the p-type semiconductor devices and the n-type semiconductor devices, top ends and bottom ends of the ferrite elements being bonded to the upper metal electrodes and the lower metal electrodes.
摘要翻译：本文公开了一种使用能够显示旋转塞贝克效应的热电元件的热电模块。本发明提供一种新的热电模块，包括：上基板，多个上金属电极布置在其上; 其上布置有多个下部金属电极的下部基板; p型半导体器件和n型半导体器件，其设置在上基板和下基板之间，并且通过多个上金属电极和多个下金属电极彼此交替电接合; 以及设置在p型半导体器件和n型半导体器件之间的铁氧体元件，铁氧体元件的顶端和底端被接合到上金属电极和下金属电极。

58. 发明申请

US20120060887A1 ASYMMETRIC THERMOELECTRIC MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：不对称热电模块及其制造方法
公开(公告)号：US20120060887A1
公开(公告)日：2012-03-15
申请号：US12963185
申请日：2010-12-08
申请人： Yong Suk Kim , Jeong Ho Yoon , Sung Ho Lee , Dong Hyeok Choi , Ji Hye Shim , Kyu Hwan Oh
发明人： Yong Suk Kim , Jeong Ho Yoon , Sung Ho Lee , Dong Hyeok Choi , Ji Hye Shim , Kyu Hwan Oh
IPC分类号： H01L35/30 , H01L21/04 , H01L35/34
CPC分类号： H01L35/32 , H01L35/34
摘要： Disclosed is an asymmetric thermoelectric module, which includes a plurality of first-type thermoelectric semiconductor elements, a plurality of second-type thermoelectric semiconductor elements, a plurality of pairs of assistant layers having different melting points and disposed on the upper and lower surfaces of the first-type and second-type thermoelectric semiconductor elements, and a pair of substrates.
摘要翻译：公开了一种不对称热电模块，其包括多个第一类型热电半导体元件，多个第二类型热电半导体元件，多对辅助层，其具有不同的熔点并且设置在该第一类型热电半导体元件的上表面和下表面上第一型和第二型热电半导体元件，以及一对基板。

59. 发明申请

US20110134629A1 BACK-LIGHT UNIT 有权
标题翻译：背光单元
公开(公告)号：US20110134629A1
公开(公告)日：2011-06-09
申请号：US13003056
申请日：2008-11-18
申请人： Yong Suk Kim
发明人： Yong Suk Kim
IPC分类号： G02F1/13357
CPC分类号： G02F1/133608 , G02F2201/54
摘要： A back-light unit is disclosed. An object of the present invention is to provide a back-light unit that is able to improve structural stability and mass-production efficiency. The back-light unit includes a circuit substrate comprising a plurality of light sources arranged thereon, an optical sheet positioned on the circuit substrate, a plurality of supporting parts arranged between the circuit substrate and the optical sheet to support the optical sheet, which are installed to the circuit substrate by using surface-mount technology (SMT).
摘要翻译：公开了背光单元。本发明的目的是提供能够提高结构稳定性和批量生产效率的背光单元。背光单元包括：电路基板，包括布置在其上的多个光源;位于电路基板上的光学片;布置在电路基板和光学片之间的多个支撑部件，用于支撑光学片，通过使用表面贴装技术（SMT）到电路基板。

60. 发明授权

US07909486B2 Light emitting device package and backlight unit and liquid crystal display device using the same 有权
标题翻译：发光装置封装和背光单元以及使用其的液晶显示装置
公开(公告)号：US07909486B2
公开(公告)日：2011-03-22
申请号：US12273401
申请日：2008-11-18
申请人： Yong Suk Kim
发明人： Yong Suk Kim
IPC分类号： F21V5/04 , G02F1/13357 , H01L33/00
CPC分类号： H01L33/54 , G02F1/133603 , H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device package and other devices using the light emitting device package are discussed. According to an embodiment, the light emitting device package includes a package body; at least one light emitting device disposed in the package body; at least one pair of leads electrically connected with the light emitting device; and a lens over the light emitting device and having at least one recess at an upper portion of the lens, the shortest distance from the light emitting device to a lowest portion of the recess being greater than approximately D1/7 and smaller than approximately D1/2.4, wherein D1 is a diameter of the lens.
摘要翻译：讨论了使用发光器件封装的发光器件封装和其它器件。根据实施例，发光器件封装包括封装体; 设置在所述包装体内的至少一个发光装置; 与发光装置电连接的至少一对引线; 以及在该发光器件上的透镜，并且在该透镜的上部具有至少一个凹部，从该发光器件到该凹部的最下部分的最短距离大于约D1 / 7且小于约D1 / 2.4，其中D1是透镜的直径。

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